PLA140STR - IXYS - Pdf.Support

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DS-PLA140-R09 1

PLA140

Single-Pole Normally Open

OptoMOS® Relay

Applications

Features

Description

Ordering Information

Parameter Rating Units

Blocking Voltage 400 VP

Load Current 250 mArms / mADC

On-Resistance (max) 8 

Pin Configuration

Part Number Description

PLA140 6-Pin DIP (50/Tube)

PLA140S 6-Pin Surface Mount (50/Tube)

PLA140STR 6-Pin Surface Mount (1,000/Reel)

Switching Characteristics of

Normally Open Devices

• Low On-Resistance, High Current Handling

• Low Drive Power Requirements

• 3750Vrms Input/Output Isolation

• High Reliability

• VDE Compatible

• FCC Compatible

• Arc-Free With No Snubbing Circuits

• No EMI/RFI Generation

• Flammability Rating UL 94 V-0

• Small 6-Pin Package

• Surface Mount Tape & Reel Version Available

• Telecommunications

• Telecomm Switching

• Hook Switch

• Instrumentation

• Multiplexers

• Data Acquisition

• Electronic Switching

• I/O Subsystems

• Meters (Watt-Hour, Water, Gas)

• Medical Equipment—Patient/Equipment Isolation

• Security

• Aerospace

• Industrial Controls

• Automotive

Approvals

• UL Certified Component: File E76270

• CSA Certified Component: Certificate 1175739

• EN/IEC 60950-1 Certified Component:

Certificate available on our website

Form-A

LOAD

10%

90%

ton toff

+ Control

– Control

Do Not Use

Load

Do Not Use

Load

AC/DC Configuration

+ Control

– Control

Do Not Use

+ Load

– Load

DC Only Configuration

The PLA140 is a single-pole normally open

(1-Form-A) Solid State Relay that uses optically

coupled MOSFET technology to provide 3750Vrms of

input-to-output isolation.

MOSFET output switches, which use IXYS

Integrated Circuits' patented OptoMOS architecture,

are controlled by a highly efficient infrared LED.

The PLA140’s combination of low on-resistance and

high load current handling makes it suitable for a

variety of industrial applications.

Because Solid State Relays like the PLA140 have no

moving parts, they offer faster, bounce-free switching

in a more compact surface mount or though hole

package than traditional electromechanical relays.

INTEGRATED CIRCUITS DIVISION

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2R09

PLA140

Absolute Maximum Ratings @ 25ºC

Electrical Characteristics @ 25ºC

Absolute Maximum Ratings are stress ratings. Stresses in

excess of these ratings can cause permanent damage to

the device. Functional operation of the device at conditions

beyond those indicated in the operational sections of this

data sheet is not implied.

Typical values are characteristic of the device at +25°C,

and are the result of engineering evaluations. They are

provided for information purposes only, and are not part of

the manufacturing testing requirements.

Parameter Ratings Units

Blocking Voltage 400 VP

Reverse Input Voltage 5 V

Input Control Current 50 mA

Peak (10ms) 1 A

Input Power Dissipation 1150 mW

Total Power Dissipation 2800 mW

Isolation Voltage, Input to Output 3750 Vrms

Operational Temperature -40 to +85 °C

Storage Temperature -40 to +125 °C

1 Derate linearly 1.33 mW / ºC

2 Derate linearly 6.67 mW / ºC

Parameter Conditions Symbol Min Typ Max Units

Output Characteristics

Load Current (Continuous)

AC/DC Configuration IF=5mA IL

- - 250 mArms / mADC

DC Configuration - - 350 mADC

Peak Load Current IF=5mA , t=10ms ILPK - - ±500 mAP

On-Resistance

AC/DC Configuration IF=5mA , IL=250mA RON

- 5.5 8 

DC Configuration IF=5mA , IL=350mA - 1.5 3

Off-State Leakage Current VL=400VPILEAK -- 1 µA

Switching Speeds

Turn-On IF=5mA, VL=10V ton - 0.4 3 ms

Turn-Off toff - 0.19 1

Output Capacitance IF=0mA , VL=50V, f=1MHz COUT -18 - pF

Input Characteristics

Input Control Current to Activate IL=250mA IF- 0.46 5 mA

Input Control Current to Deactivate - IF0.2 0.44 - mA

Input Voltage Drop IF=5mA VF0.9 1.2 1.5 V

Reverse Input Current VR=5V IR- - 10 µA

Common Characteristics

Input to Output Capacitance VIO=0V, f=1MHz CIO -3 - pF

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PLA140

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R09

LED Forward Voltage (V)

1.235 1.240 1.245 1.250 1.255 1.260 1.265

Device Count (N)

Typical LED Forward Voltage Drop

(N=50, IF=5mA)

LED Current (mA)

0.28 0.34 0.40 0.46 0.52 0.58 0.64 0.70

Device Count (N)

Typical IF for Switch Operation

(IL=250mA)

On-Resistance (:)

4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4

Device Count (N)

Typical On-Resistance Distribution

(N=50, IF=5mA, IL=250mA)

Turn-On Time (ms)

0.675 0.750 0.825 0.900 0.975 1.050 1.125 1.200

Device Count (N)

Typical Turn-On Time

(N=50, IF=5mA, IL=100mA)

Turn-Off Time (ms)

0.13 0.15 0.17 0.19 0.21 0.23 0.25 0.27

Device Count (N)

Typical Turn-Off Time

(N=50, IF=5mA, IL=100mA)

Blocking Voltage (VP)

442 448 454 460 466 472 478 484

Device Count (N)

Typical Blocking Voltage Distribution

(N=50, IF=0mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

LED Current (mA)

0.44

0.46

0.48

0.50

0.52

0.54

0.56

0.58

0.60

Typical IF for Switch Operation

vs. Temperature

(IL=100mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Turn-On Time (ms)

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

Typical Turn-On Time vs. Temperature

(IF=5mA, IL=100mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Turn-Off Time (ms)

0.14

0.16

0.18

0.20

0.22

0.24

0.26

Typical Turn-Off Time vs. Temperature

(IF=5mA, IL=100mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

LED Forward Voltage (V)

1.1

1.2

1.3

1.4

1.5

1.6

Typical LED Forward Voltage Drop

vs. Temperature

IF=50mA

IF=20mA

IF=10mA

IF=5mA

LED Current (mA)

0 1020304050

Turn-On Time (ms)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

Typical Turn-On Time

vs. LED Forward Current

(IL=100mA)

LED Current (mA)

0 1020304050

Turn-Off Time (ms)

0.16

0.18

0.20

0.22

0.24

0.26

Typical Turn-Off Time

vs. LED Forward Current

(IL=100mA)

PERFORMANCE DATA*

*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.

For guaranteed parameters not indicated in the written specifications, please contact our application department.

INTEGRATED CIRCUITS DIVISION

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4R09

PLA140

Temperature (ºC)

-40 -20 0 20 40 60 80 100

On-Resistance (:)

Typical On-Resistance vs. Temperature

AC/DC Configuration

(IF=5mA, IL=100mA)

Load Voltage (V)

-1.5 -1.0 -0.5 0.0 0.5 1.0 1.5

Load Current (A)

-0.3

-0.2

-0.1

0.0

0.1

0.2

0.3

Typical Load Current vs. Load Voltage

AC/DC Configuration

(IF=5mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Load Current (mA)

100

125

150

175

200

225

250

275

Maximum Load Current

vs. Temperature - AC/DC Configuration

(IF=5mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

On-Resistance (:)

1.0

1.2

1.4

1.6

1.8

2.0

2.2

2.4

Typical On-Resistance vs. Temperature

DC-Only Configuration

(IF=5mA, IL=100mA)

Load Voltage (V)

0.0 0.1 0.2 0.3 0.4 0.5 0.6

Load Current (A)

0.00

0.05

0.10

0.15

0.20

0.25

0.30

0.35

0.40

Typical Load Current vs. Load Voltage

DC-Only Configuration

(IF=5mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Load Current (mA)

150

175

200

225

250

275

300

325

350

375

Maximum Load Current

vs. Temperature - DC-Only Configuration

(IF=5mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Blocking Voltage (VP)

440

450

460

470

480

490

500

510

Typical Blocking Voltage

vs. Temperature

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Leakage Current (nA)

Typical Leakage vs. Temperature

Measured Across Pins 4&6

(VL=400V)

Time

10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s

Load Current (A)

0.2

0.4

0.6

0.8

1.0

1.2

Energy Rating Curve

PERFORMANCE DATA*

*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.

For guaranteed parameters not indicated in the written specifications, please contact our application department.

INTEGRATED CIRCUITS DIVISION

PLA140

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R09

Manufacturing Information

Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated

Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of

the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of

our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices

when handled according to the limitations and information in that standard as well as to any limitations set forth in the

information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced

product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled

according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

Device Moisture Sensitivity Level (MSL) Classiﬁ cation

PLA140 / PLA140S MSL 1

ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

Soldering Profile

Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the

body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum

Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other

processes, the guidelines of J-STD-020 must be observed.

Device Classiﬁ cation Temperature (Tc) Dwell Time (tp) Max Reﬂ ow Cycles

PLA140 250ºC 30 seconds 1

PLA140S 250ºC 30 seconds 3

Board Wash

IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux

residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage

to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow

up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the

variability of the wash parameters used to clean the board, determination of the bake temperature and duration

necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning

or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the

device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.

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6R09

PLA140

MECHANICAL DIMENSIONS

Dimensions

(inches)

PCB Hole Pattern

6.350 ± 0.127

(0.250 ± 0.005)

2.540 ± 0.127

(0.100 ± 0.005)

7.620 ± 0.127

(0.300 ± 0.005)

5.080 ± 0.127

(0.200 ± 0.005)

6 - 0.800 DIA.

(6 - 0.031 DIA.)

0.254 ± 0.0127

(0.010 ± 0.0005)

9.144 ± 0.508

(0.360 ± 0.020)

7.239 TYP

(0.285 TYP)

7.620 ± 0.254

(0.300 ± 0.010)

3.302 ± 0.051

(0.130 ± 0.002) 4.064 TYP

(0.160 TYP)

0.457 ± 0.076

(0.018 ± 0.003)

8.382 ± 0.381

(0.330 ± 0.015) 2.54 ± 0.127

(0.100 ± 0.005)

6.350 ± 0.127

(0.250 ± 0.005)

1.651 ± 0.254

(0.065 ± 0.010)

Pin 1

Dimensions

(inches)

PCB Land Pattern

0.254 ± 0.0127

(0.010 ± 0.0005)

7.620 ± 0.254

(0.300 ± 0.010)

0.635 ± 0.127

(0.025 ± 0.005)

3.302 ± 0.051

(0.130 ± 0.002)

4.445 ± 0.254

(0.175 ± 0.010)

2.54

(0.10)

8.90

(0.3503)

1.65

(0.0649)

0.65

(0.0255)

8.382 ± 0.381

(0.330 ± 0.015) 2.54 ± 0.127

(0.100 ± 0.005)

9.524 ± 0.508

(0.375 ± 0.020) 6.350 ± 0.127

(0.250 ± 0.005)

0.457 ± 0.076

(0.018 ± 0.003)

1.651 ± 0.254

(0.065 ± 0.010)

1.651 ± 0.254

(0.065 ± 0.010)

Pin 1

PLA140

PLA140S

INTEGRATED CIRCUITS DIVISION

For additional information please visit our website at: www.ixysic.com

PLA140

Specification: DS-PLA140-R09

OptoMOS® is a registered trademark of IXYS Integrated Circuits

6/27/2018

IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes

to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits'

Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but

not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other

applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property

or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice.

NOTES:

1. All dimensions carry tolerances of EIA Standard 481-2

2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2

Dimensions

(inches)

Embossment

Embossed

Carrier

330.2 Dia

(13.00 Dia)

Top Cover

Tape Thickness

0.102 Max

(0.004 Max)

W=16.00

(0.63)

B0 = 10.10

(0.398)

A0 = 10.10

(0.398)

P1 = 12.00

(0.472)

K1 = 3.80

(0.15)

K0 = 4.90

(0.19)

User Direction of Feed

PLA140STR Tape & Reel