DATA SHEET
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
PHOTOCOUPLER
PS2503-1,-2,-4,PS2503L-1,-2,-4
LOW INPUT CURRENT, HIGH SPEED SWITCHING
MULTI PHOTOCOUPLER SERIES −NEPOC Series−
Document No. PN10227EJ02V0DS (2nd edition)
Date Published March 2006 CP(K)
Printed in Japan
NEC Compound Semiconductor Devices, Ltd. 1993, 2006
The mark shows major revised points.
PIN CONNECTION
(Top View)
1. Anode
2. Cathode
3. Emitter
4. Collector
12
43
PS2503-1, PS2503L-1
1, 3. Anode
2, 4. Cathode
5, 7. Emitter
6, 8. Collector
1234
8765
PS2503-2, PS2503L-2
1, 3, 5, 7. Anode
2, 4, 6, 8. Cathode
9, 11, 13, 15. Emitter
10, 12, 14, 16. Collector
12345678
16 15 14 13 12 11 10 9
PS2503-4, PS2503L-4
DESCRIPTION
The PS2503-1, -2, -4 and PS2503L-1, -2, -4 are optically coupled isolators containing a GaAs light emitting diode
and an NPN silicon phototransistor.
The PS2503-1, -2, -4 are in a plastic DIP (Dual In-line Package) and the PS2503L-1, -2, -4 are lead bending type
(Gull-wing) for surface mount.
FEATURES
• High isolation voltage (BV = 5 000 Vr.m.s.)
• High-speed switching (tr = 20
µ
s TYP., tf = 30
µ
s TYP.)
• Ordering number of tape product: PS2503L-1-E3, E4, F3, F4, PS2503L-2-E3, E4
• Safety standards
• UL approved: File No. E72422
• CSA approved: No. CA 101391
APPLICATIONS
• Measurement equipment
• Programmable logic controller
• Telephone/Telegraph Receiver
• Power supply
Data Sheet PN10227EJ02V0DS
2
PS2503-1,-2,-4,PS2503L-1,-2,-4
PACKAGE DIMENSIONS (UNIT : mm)
DIP Type
PS2503-4
PS2503-1
9.7±0.5
6.5±0.5
3.5±0.3
4.15±0.43.3±0.5
2.54
1.25±0.15 0.50±0.10
0.25
M
0 to 15˚
7.62
0.25
+0.1
–0.05
PS2503-2
4.6±0.5
6.5±0.5
3.5±0.3
4.15±0.43.3±0.5
2.54
1.25±0.15 0.50±0.10
0.25
M
0 to 15˚
7.62
0.25
+0.1
–0.05
19.8±0.5
6.5±0.5
0 to 15˚
7.62
0.25
+0.1
–0.05
3.5±0.3
4.15±0.43.3±0.5
2.54
1.25±0.15 0.50±0.10
0.25
M
Data Sheet PN10227EJ02V0DS 3
PS2503-1,-2,-4,PS2503L-1,-2,-4
Lead Bending Type
PS2503L-2
PS2503L-1
PS2503L-4
4.6±0.5
6.5±0.5
0.25
M
3.5±0.3
2.54
1.25±0.15
0.15
0.9±0.25
9.60±0.4
0.25
+0.1
–0.05
0.1
+0.1
–0.05
9.7±0.5
6.5±0.5
2.54
1.25±0.15
0.25
M
0.15
3.5±0.3
0.9±0.25
9.60±0.4
0.25
+0.1
–0.05
0.1
+0.1
–0.05
19.8±0.5
6.5±0.5
2.54
1.25±0.15
0.25
M
3.5±0.3
0.15
0.9±0.25
9.60±0.4
0.25
+0.1
–0.05
0.1
+0.1
–0.05
Data Sheet PN10227EJ02V0DS
4
PS2503-1,-2,-4,PS2503L-1,-2,-4
MARKING EXAMPLE
2503
ML601
PS2503-2
NL601
PS2503-1 PS2503-2, -4
Assembly Lot
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
CTR Rank Code
No. 1 pin
Mark
Package
New PKG
Standard PKG
Made in Japan Made in Taiwan
No. 1 pin
Mark
N
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
CTR Rank Code
Package
New PKG
Standard PKG
Made in Japan Made in Taiwan
601
M601
LL
Country Assembled
Type Number
Assembly Lot
LL
Data Sheet PN10227EJ02V0DS 5
PS2503-1,-2,-4,PS2503L-1,-2,-4
ORDERING INFORMATION
Part Number Order Number Solder Plating
Specification
Packing Style Safety Standard
Approval
Application Part
Number*1
PS2503-1 PS2503-1-A Pb-Free Magazine case 100 pcs Standard products PS2503-1
PS2503L-1 PS2503L-1-A (UL, CSA Approved)
PS2503L-1-E3 PS2503L-1-E3-A Embossed Tape 1 000 pcs/reel
PS2503L-1-E4 PS2503L-1-E4-A
PS2503L-1-F3 PS2503L-1-F3-A Embossed Tape 2 000 pcs/reel
PS2503L-1-F4 PS2503L-1-F4-A
PS2503-2 PS2503-2-A Magazine case 45 pcs PS2503-2
PS2503L-2 PS2503L-2-A
PS2503L-2-E3 PS2503L-2-E3-A Embossed Tape 1 000 pcs/reel
PS2503L-2-E4 PS2503L-2-E4-A
PS2503-4 PS2503-4-A Magazine case 20 pcs PS2503-4
PS2503L-4 PS2503L-4-A
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise specified)
Ratings
Parameter Symbol PS2503-1,
PS2503L-1
PS2503-2,-4
PS2503L-2,-4
Unit
Diode Reverse Voltage VR 6 V
Forward Current (DC) IF 80 mA/ch
Power Dissipation Derating
∆
PD/°C 1.5 1.2 mW/°C
Power Dissipation PD 150 120 mW/ch
Peak Forward Current*1 IFP 1 A/ch
Transistor Collector to Emitter Voltage VCEO 40 V
Emitter to Collector Voltage VECO 0.6 V
Collector Current IC 30 mA/ch
Power Dissipation Derating
∆
PC/°C 1.5 1.2 mW/°C
Power Dissipation PC 150 120 mW/ch
Isolation Voltage*2 BV 5 000 Vr.m.s.
Operating Ambient Temperature TA −55 to +100 °C
Storage Temperature Tstg −55 to +150 °C
*1 PW = 100
µ
s, Duty Cycle = 1%
*2 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output
Pins 1-2 shorted together, 3-4 shorted together (PS2503-1, PS2503L-1).
Pins 1-4 shorted together, 5-8 shorted together (PS2503-2, PS2503L-2).
Pins 1-8 shorted together, 9-16 shorted together (PS2503-4, PS2503L-4).
Data Sheet PN10227EJ02V0DS
6
PS2503-1,-2,-4,PS2503L-1,-2,-4
ELECTRICAL CHARACTERISTICS (TA = 25 °C)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Diode Forward Voltage VF IF = 1 mA 1.1 1.3 V
Reverse Current IR VR = 5 V 5
µ
A
Terminal Capacitance Ct V = 0 V, f = 1.0 MHz 50 pF
Transistor Collector to Emitter Dark
Current
ICEO VCE = 40 V, IF = 0 mA 100 nA
Coupled Current Transfer Ratio
(IC/IF)*1
CTR IF = 1 mA, VCE = 5 V 100 200 400 %
Collector Saturation
Voltage
VCE(sat) IF = 1 mA, IC = 0.2 mA 0.25 V
Isolation Resistance RI-O VI-O = 1.0 kVDC 1011 Ω
Isolation Capacitance CI-O V = 0 V, f = 1.0 MHz 0.5 pF
Rise Time*2 tr VCC = 5 V, IF = 1 mA, RL = 10 kΩ 20
µ
s
Fall Time*2 tf 30
*1 CTR rank (only PS2503-1, PS2503L-1)
K : 200 to 400 (%)
L : 150 to 300 (%)
M : 100 to 200 (%)
*2 Test circuit for switching time
PW = 100 s
Duty Cycle = 1/10
µ
Pulse Input V
CC
V
OUT
R
L
= 10 kΩ
50 Ω
I
F
Data Sheet PN10227EJ02V0DS 7
PS2503-1,-2,-4,PS2503L-1,-2,-4
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified)
150
100
50
0255075
100 125 150
1.5 mW/˚C
1.2 mW/˚C
150
100
50
25 50 100 125 1500
1.5 mW/˚C
1.2 mW/˚C
PS2503-1
PS2503L-1
PS2503-2
PS2503L-2
PS2503-4
PS2503L-4
PS2503-1
PS2503L-1
PS2503-2
PS2503L-2
PS2503-4
PS2503L-4
100
1.51.41.31.21.11.00.90.80.7
50
10
5
1
0.5
0.1
Diode Power Dissipation P
D
(mW)
Transistor Power Dissipation P
C
(mW)
Ambient Temperature T
A
(˚C)
Forward Current I
F
(mA)
Forward Voltage V
F
(V)
Collector to Emitter Dark Current I
CEO
(nA)
Collector Saturation Voltage V
CE(sat)
(V)
Ambient Temperature T
A
(˚C)
Ambient Temperature T
A
(˚C)
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE
TRANSISTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
FORWARD CURRENT vs.
FORWARD VOLTAGE
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
Collector Current I
C
(mA)
75
Collector Current I
C
(mA)
Collector to Emitter Voltage V
CE
(V)
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
–55 ˚C
0 ˚C
–25 ˚C
+60 ˚C
+25 ˚C
T
A
= +100 ˚C
12
2
10
8
6
4
2
046810
I
F
= 0.6 mA
0.8 mA
1 mA
1.5 mA
2 mA
3 mA
4 mA
5 mA
100
50
10
1.0
0.3
5.0
V
CE
= 40 V
30 V
20 V
10 V
–25 0 25 50 75 100
10
1.0
0.80.60.40.20
5
1
0.5
0.1
30
I
F
= 0.8 mA
1 mA
2 mA
5 mA
10 mA
Remark The graphs indicate nominal characteristics.
Data Sheet PN10227EJ02V0DS
8
PS2503-1,-2,-4,PS2503L-1,-2,-4
Normalized to 1.0
at T
A
= 25 ˚C,
I
F
= 1 mA, V
CE
= 5 V
Forward Current I
F
(mA)
Ambient Temperature T
A
(˚C)
Ambient Temperature T
A
(˚C)
Frequency f (Hz)
Normalized Current Transfer Ratio CTR
Current Transfer Ratio CTR (%)
Normalized Gain G
V
Load Resistance R
L
(Ω)
Switching Time t ( s)
µ
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
SWITCHING TIME vs.
AMBIENT TEMPERATURE
SWITCHING TIME vs.
LOAD RESISTANCE
FREQUENCY RESPONSE
Switching Time t ( s)
µ
Time (Hr)
CTR (Relative Value)
LONG TERM CTR DEGRADATION
1.4
1.2
1.0
0.8
0.6
0.4
0.2
010050 75
25
0
–30
400
300
200
100
0
0.3 0.5 1510 50 100
500
100
50
10
5
1
100
75
50
25
0
–25
–50
t
r
CTR = 290 %,
V
CC
= 5 V,
I
F
= 1 mA,
R
L
= 10 kΩ
t
s
t
f
t
d
50
10
5
1
0.1
0.5
100 k50 k10 k5 k1 k
500
100
I
F
= 1 mA, V
CC
= 5 V,
CTR = 209 %,
t
r
t
d
t
f
t
s
IFVCC
VO
R
L
50 Ω
0
–3.0
–6.0
–9.0
–12.0
–15.0
100 1 k 10 k 100 k 1 M
V
CC
= 5 V,
CTR = 209 %
R
L
= 5.6 kΩ1 kΩ300 Ω
1.2
1.0
0.8
0.6
0.4
0.2
010
2
10
3
10
4
10
5
I
F
= 5 mA
T
A
= 60˚C
I
F
= 5 mA
T
A
= 25˚C
Sample A
B
C
V
CE
= 5 V
Remark The graphs indicate nominal characteristics.
Data Sheet PN10227EJ02V0DS 9
PS2503-1,-2,-4,PS2503L-1,-2,-4
TAPING SPECIFICATIONS (UNIT : mm)
Tape Direction
Outline and Dimensions (Tape)
Outline and Dimensions (Reel)
PS2503L-1-E3 PS2503L-1-E4
1.55±0.1
2.0±0.1
4.0±0.1
1.75±0.1
4.5 MAX.
4.0±0.1
0.4
5.3±0.1
8.0±0.1
7.5±0.1
16.0±0.3
10.3±0.1
1.5
+0.1
–0
φ
Packing: 1 000 pcs/reel
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
254±2.0
80.0±1.0
2.0±0.5
φ
φ
15.9 to 19.4
Outer edge of
flange
21.5±1.0
17.5±1.0
Data Sheet PN10227EJ02V0DS
10
PS2503-1,-2,-4,PS2503L-1,-2,-4
Tape Direction
Outline and Dimensions (Tape)
Outline and Dimensions (Reel)
PS2503L-1-F3 PS2503L-1-F4
1.55±0.1
2.0±0.1
4.0±0.1
1.75±0.1
4.5 MAX.
4.0±0.1
0.4
5.3±0.1
8.0±0.1
7.5±0.1
16.0±0.3
10.3±0.1
1.5
+0.1
–0
φ
Packing: 2 000 pcs/reel
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
330±2.0
100±1.0
2.0±0.5
φ
φ
15.9 to 19.4
Outer edge of
flange
21.5±1.0
17.5±1.0
Data Sheet PN10227EJ02V0DS 11
PS2503-1,-2,-4,PS2503L-1,-2,-4
Tape Direction
PS2503L-2-E3 PS2503L-2-E4
Outline and Dimensions (Tape)
1.55±0.1
2.0±0.1
4.0±0.1
1.75±0.1
4.5 MAX.
10.4±0.1
12.0±0.1
Outline and Dimensions (Reel)
Packing: 1 000 pcs/reel
330±2.0
100±1.0
2.0±0.5
13.0±0.2
R 1.0 21.0±0.8
2.0±0.5
1.5
+0.1
–0
7.5±0.1
10.3±0.1
16.0±0.3
4.0±0.1
0.3
15.9 to 19.4
Outer edge of
flange
17.5±1.0
21.5±1.0
Data Sheet PN10227EJ02V0DS
12
PS2503-1,-2,-4,PS2503L-1,-2,-4
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature 260°C or below (package surface temperature)
• Time of peak reflow temperature 10 seconds or less
• Time of temperature higher than 220°C 60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s
• Number of reflows Three
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
120±30 s
(preheating)
220˚C
180˚C
Package Surface Temperature T (˚C)
Time (s)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
to 60 s
260˚C MAX.
120˚C
(2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
• Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
• Number of times One (Allowed to be dipped in solder including plastic mold portion.)
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
• Peak temperature (lead part temperature) 350°C or below
• Time (each pins) 3 seconds or less
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
Data Sheet PN10227EJ02V0DS 13
PS2503-1,-2,-4,PS2503L-1,-2,-4
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute
maximum ratings.
3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler
Check the setting values before use, since the forward current conditions at CTR measurement differ according
to product.
When using products other than at the specified forward current, the characteristics curves may differ from the
standard curves due to CTR value variations or the like. Therefore, check the characteristics under the actual
operating conditions and thoroughly take variations or the like into consideration before use.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
Data Sheet PN10227EJ02V0DS
14
PS2503-1,-2,-4,PS2503L-1,-2,-4
When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority
having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license.
M8E 00. 4 - 0110
The information in this document is current as of March, 2006. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
•
•
•
•
•
•
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)
Hong Kong Head Office
Taipei Branch Office
Korea Branch Office
TEL: +852-3107-7303
TEL: +886-2-8712-0478
TEL: +82-2-558-2120
FAX: +852-3107-7309
FAX: +886-2-2545-3859
FAX: +82-2-558-5209
NEC Electronics (Europe) GmbH http://www.ee.nec.de/
TEL: +49-211-6503-0 FAX: +49-211-6503-1327
California Eastern Laboratories, Inc. http://www.cel.com/
TEL: +1-408-988-3500 FAX: +1-408-988-0279 0504
NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/
E-mail: salesinfo@ml.ncsd.necel.com (sales and general)
techinfo@ml.ncsd.necel.com (technical)
Sales Division TEL: +81-44-435-1573 FAX: +81-44-435-1579
For further information, please contact
PS2503-1,-2,-4,PS2503L-1,-2,-4
Caution GaAs Products This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
