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- Silicon zener diodes
- Low profile surface-mount package
- Zener and surge current specification
- Low leakage current
- Excellent stability
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
V
F
Volts
R
θJA
℃/W
R
θJL
℃/W
T
J
, T
STG
℃
Document Number: DS_D1405036 Version: V14
BZD27C SERIES
Taiwan Semiconductor
V
olta
g
e Re
g
ulator Diodes
FEATURES
- Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
MECHANICAL DATA
Case: Sub SMA Sub SMA
UNIT
Forward voltage @ I
F
=0.2A 1.2
Power dissipation at T
L
=80℃
T
A
=25℃ (Note 1) Ptot
Polarity: Indicated by cathode band
Weight: 0.019g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
PARAMETER SYMBOL
2.3
1.0 Watts
VALUE
-55 to +175
Non-repetitive peak pulse power dissipation
10/1000μs waveform (BZD27C110P to BZD27C220P)
(Note 2)
Non-repetitive peak pulse power dissipation
100μs square pulse (Note 2) P
ZSM
300 Watts
P
RSM
150 Watts
Non-repetitive peak pulse power dissipation
10/1000μs waveform (BZD27C6V8P to BZD27C100P)
(Note 2)
P
RSM
100 Watts
Note 1: Mounted on Cu-Pad size 5mm x 5mm
Note 2: T
J
=25℃ prior to surge
Thermal resistance junction to ambient (Note 1) 180
Thermal resistance junction to lead 30
Operating and storage temperature range
PART NO.
PART NO.
BZD27C10P
BZD27C10P
BZD27C10P
(TA=25℃ unless otherwise noted)
Document Number: DS_D1405036 Version: V14
BZD27C SERIES
Taiwan Semiconductor
ORDERING INFORMATION
AEC-Q101
QUALIFIED
EXAMPLE
PREFERRED P/N
BZD27CxxP
(Note 1)
RF
RH
R3 Sub SMA 1,800 / 7" Plastic reel (12mm tape)
RATINGS AND CHARACTERISTICS CURVES
BZD27C10P RU
BZD27C10P RUG
RU
PACKING
CODE
GREEN COMPOUND
CODE
PACKAGE PACKING
Prefix "H"
RU
Suffix "G"
Sub SMA 1,800 / 7" Plastic reel (8mm tape)
RV Sub SMA 3,000 / 7" Plastic reel (8mm tape)
RT Sub SMA 7,500 / 13" Paper reel (8mm tape)
MT Sub SMA 7,500 / 13" Plastic reel (8mm tape)
RQ Sub SMA 10,000 / 13" Paper reel (8mm tape)
MQ Sub SMA 10,000 / 13" Plastic reel (8mm tape)
Sub SMA 3,000 / 7" Plastic reel (12mm tape)
R2 Sub SMA 7,500 / 13" Paper reel (12mm tape)
M2 Sub SMA 7,500 / 13" Plastic reel (12mm tape)
Sub SMA 10,000 / 13" Paper reel (12mm tape)
MH Sub SMA 10,000 / 13" Plastic reel (12mm tape)
AEC-Q101
QUALIFIED PACKING CODE GREEN COMPOUND
CODE DESCRIPTION
Note 1: "xx" defines voltage from 6.8V (BZD27C6V8P) to 220V (BZD27C220P)
BZD27C10PHRU
RU G Green compound
H RU AEC-Q101 qualified
0
0.5
1
1.5
2
2.5
3
0 25 50 75 100 125 150 175
POWER DISSIPATION(W)
AMBIENT TEMPERATURE(oC)
FIG.3 POWER DISSIPATION vs
AMBIENT TEMPERATURE
10
100
1000
10000
0.0 0.5 1.0 1.5 2.0 2.5 3.0
TYP. JUNCTION CAPACITANCE (pF)
REVERSE VOLTAGE
FIG. 2 TYP. DIODE CAPACITANCE vs
REVERSE VOLTAGE
C12P
C27P
C200P
C6V8P
0.1
1
10
0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6
INSTANTANEOUS FORWARD CURRENT (A)
FORWARD VOLTAGE (V)
FIG. 1 TYPICAL FORWARD CHARACTERISTICS
TYP. VF MAX. VF
0
20
40
60
80
100
120
140
160
0 25 50 75 100 125 150 175 200 225 250
MAX PULSE POWER DISSIPATION
(W)
ZENER VOLTAGE (V)
FIG. 4 MAXIMUM PULSE POWER DISSPATION vs
ZENER VOLTAGE
Test
Current
I
ZT
I
R
V
R
mA μAV
Min. Max. Typ. Max. Min. Max. Max.
BZD27C6V8P D7 6.4 7.2 1 3 0 0.07 100 10 3
BZD27C7V5P D8 7.0 7.9 1 2 0 0.07 100 50 3
BZD27C8V2P D9 7.7 8.7 1 2 0.03 0.08 100 10 3
BZD27C9V1P E0 8.5 9.6 2 4 0.03 0.08 50 10 5
BZD27C10P E1 9.4 10.6 2 4 0.05 0.09 50 7 7.5
BZD27C11P E2 10.4 11.6 4 7 0.05 0.10 50 4 8.2
BZD27C12P E3 11.4 12.7 4 7 0.05 0.10 50 3 9.1
BZD27C13P E4 12.4 14.1 5 10 0.05 0.10 50 2 10
BZD27C15P E5 13.8 15.6 5 10 0.05 0.10 25 1 11
BZD27C16P E6 15.3 17.1 6 15 0.06 0.11 25 1 12
BZD27C18P E7 16.8 19.1 6 15 0.06 0.11 25 1 13
BZD27C20P E8 18.8 21.2 6 15 0.06 0.11 25 1 15
BZD27C22P E9 20.8 23.3 6 15 0.06 0.11 25 1 16
BZD27C24P F0 22.8 25.6 7 15 0.06 0.11 25 1 18
BZD27C27P F1 25.1 28.9 7 15 0.06 0.11 25 1 20
BZD27C30P F2 28 32 8 15 0.06 0.11 25 1 22
BZD27C33P F3 31 35 8 15 0.06 0.11 25 1 24
BZD27C36P F4 34 38 21 40 0.06 0.11 10 1 27
BZD27C39P F5 37 41 21 40 0.06 0.11 10 1 30
BZD27C43P F6 40 46 24 45 0.07 0.12 10 1 33
BZD27C47P F7 44 50 24 45 0.07 0.12 10 1 36
BZD27C51P F8 48 54 25 60 0.07 0.12 10 1 39
BZD27C56P F9 52 56 25 60 0.07 0.12 10 1 43
BZD27C62P G0 58 66 25 80 0.08 0.13 10 1 47
BZD27C68P G1 64 72 25 80 0.08 0.13 10 1 51
BZD27C75P G2 70 79 30 100 0.08 0.13 10 1 56
BZD27C82P G3 77 82 60 200 0.08 0.13 10 1 62
BZD27C91P G4 85 91 60 200 0.08 0.13 5 1 68
BZD27C100P G5 94 106 60 200 0.09 0.13 5 1 75
BZD27C110P G6 104 116 80 250 0.09 0.13 5 1 82
BZD27C120P G7 114 127 150 300 0.09 0.13 5 1 91
BZD27C130P G 124 141 150 300 0.09 0.13 5 1 100
BZD27C150P G9 138 156 150 300 0.09 0.13 5 1 110
BZD27C160P H0 153 171 150 350 0.09 0.13 5 1 120
BZD27C180P H1 168 191 280 450 0.09 0.13 5 1 130
BZD27C200P H2 188 212 350 750 0.09 0.13 5 1 150
BZD27C220P H3 208 233 430 900 0.09 0.13 5 1 160
Notes: 1. Pulse test: tp ≦5ms.
Document Number: DS_D1405036 Version: V14
r
dif
@ I
Z
Device
Device
Marking
Code
Working Voltage
(Note 1)
V
Z
@ I
ZT
V
BZD27C SERIES
Taiwan Semiconductor
Reverse Current@
Reverse Voltage
ALPH
Z
@ I
Z
Ω
Temperature
Coefficient
%/℃
Differential
Resistance
V
(BR)
@I
test
I
test
Vc @I
RSM
(Note 1) I
R
@V
WM
VmA V A μAV
Min. Min. Max Max. Max.
BZD27C7V5P 7 100 0 0.07 11.3 13.3 1500 6.2
BZD27C8V2P 7.7 100 0.03 0.08 12.3 12.2 1200 6.8
BZD27C9V1P 8.5 50 0.03 0.08 13.3 11.3 100 7.5
BZD27C10P 9.4 50 0.05 0.09 14.8 10.1 20 8.2
BZD27C11P 10.4 50 0.05 0.10 15.7 9.6 5 9.1
BZD27C12P 11.4 50 0.05 0.10 17 8.8 5 10
BZD27C13P 12.4 50 0.05 0.10 18.9 7.9 5 11
BZD27C15P 13.8 50 0.05 0.10 20.9 7.2 5 12
BZD27C16P 15.3 25 0.06 0.11 22.9 6.6 5 13
BZD27C18P 16.8 25 0.06 0.11 25.6 5.9 5 15
BZD27C20P 18.8 25 0.06 0.11 28.4 5.3 5 16
BZD27C22P 20.8 25 0.06 0.11 31 4.8 5 18
BZD27C24P 22.8 25 0.06 0.11 33.8 4.4 5 20
BZD27C27P 25.1 25 0.06 0.11 38.1 3.9 5 22
BZD27C30P 28 25 0.06 0.11 42.2 3.6 5 24
BZD27C33P 31 25 0.06 0.11 46.2 3.2 5 27
BZD27C36P 34 10 0.06 0.11 50.1 3 5 30
BZD27C39P 37 10 0.06 0.11 54.1 2.8 5 33
BZD27C43P 40 10 0.07 0.12 60.7 2.5 5 36
BZD27C47P 44 10 0.07 0.12 65.5 2.3 5 39
BZD27C51P 48 10 0.07 0.12 70.8 2.1 5 43
BZD27C56P 52 10 0.07 0.12 78.6 1.9 5 47
BZD27C62P 58 10 0.08 0.13 86.5 1.7 5 51
BZD27C68P 64 10 0.08 0.13 94.4 1.6 5 56
BZD27C75P 70 10 0.08 0.13 103.5 1.5 5 62
BZD27C82P 77 10 0.08 0.13 114 1.3 5 68
BZD27C91P 85 5 0.09 0.13 126 1.2 5 75
BZD27C100P 94 5 0.09 0.13 139 1.1 5 82
BZD27C110P 104 5 0.09 0.13 150 1 5 91
BZD27C120P 114 5 0.09 0.13 152 0.9 5 100
BZD27C130P 124 5 0.09 0.13 185 0.81 5 110
BZD27C150P 138 5 0.09 0.13 205 0.73 5 120
BZD27C160P 153 5 0.09 0.13 224 0.67 5 130
BZD27C180P 168 5 0.09 0.13 229 0.6 5 150
BZD27C200P 188 5 0.09 0.13 254 0.54 5 160
BZD27C220P 208 5 0.09 0.13 279 0.35 5 176
Notes: 1. Non-repetitive peak reverse current in accordance with "IEC 60-1, Section 8" (10/1000 μs pulse)
Document Number: DS_D1405036 Version: V14
BZD27C SERIES
Taiwan Semiconductor
Reverse Current@
Stand-Off Voltage
Device ALPHz@I
test
%/℃
Rev.
Breakdown
Voltage
Test
Current
Temperature
Coefficient Clamping Voltage
Min Max Min Max
B 1.70 1.90 0.067 0.075
C 2.70 2.90 0.106 0.114
D 0.16 0.30 0.006 0.012
E 1.23 1.43 0.048 0.056
F 0.80 1.20 0.031 0.047
G 3.40 3.80 0.134 0.150
H 2.45 2.60 0.096 0.102
I 0.35 0.85 0.014 0.033
J 0.00 0.10 0.000 0.004
P/N = Marking Code
G = Green Compound
YW = Date Code
F = Factory Code
Document Number: DS_D1405036 Version: V14
BZD27C SERIES
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DIM. Unit (mm) Unit (inch)
1.9
E4.3
SUGG ESTED PAD LAYOUT
Symbol Unit (mm)
A1.4
B1.2
MARKING DIAGRAM
Unit (inch)
0.055
0.047
0.122
0.075
0.169
C3.1
D
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assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1405036 Version: V14
BZD27C SERIES
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
