
2
TechnischeInformation/technicalinformation
FS400R12A2T4
preparedby:AU
approvedby:MM
dateofpublication:2012-11-06
revision:3.0
IGBT-Wechselrichter/IGBT-inverter
HöchstzulässigeWerte/MaximumRatedValues
Kollektor-Emitter-Sperrspannung
Collector-emittervoltage Tvj = 25°C VCES 1200 V
ImplementierterKollektor-Strom
Implementedcollectorcurrent ICN 400 A
Kollektor-Dauergleichstrom
ContinuousDCcollectorcurrent
TF = 75°C, Tvj = 175°C
TF = 25°C, Tvj = 175°C
IC nom
IC300
400 A
A
PeriodischerKollektor-Spitzenstrom
Repetitivepeakcollectorcurrent tP = 1 ms ICRM 800 A
Gesamt-Verlustleistung
Totalpowerdissipation TF = 25°C, Tvj = 175°C Ptot 1500 W
Gate-Emitter-Spitzenspannung
Gate-emitterpeakvoltage VGES +/-20 V
CharakteristischeWerte/CharacteristicValues min. typ. max.
Kollektor-Emitter-Sättigungsspannung
Collector-emittersaturationvoltage
IC = 300 A, VGE = 15 V
IC = 300 A, VGE = 15 V
IC = 300 A, VGE = 15 V
VCE sat
1,55
1,75
1,80
1,85
V
V
V
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Gate-Schwellenspannung
Gatethresholdvoltage IC = 13,0 mA, VCE = VGE, Tvj = 25°C VGEth 5,2 5,8 6,4 V
Gateladung
Gatecharge VGE = -15 V ... +15 V QG3,20 µC
InternerGatewiderstand
Internalgateresistor Tvj = 25°C RGint 1,9 Ω
Eingangskapazität
Inputcapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cies 25,0 nF
Rückwirkungskapazität
Reversetransfercapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cres 1,10 nF
Kollektor-Emitter-Reststrom
Collector-emittercut-offcurrent VCE = 1200 V, VGE = 0 V, Tvj = 25°C ICES 1,0 mA
Gate-Emitter-Reststrom
Gate-emitterleakagecurrent VCE = 0 V, VGE = 20 V, Tvj = 25°C IGES 400 nA
Einschaltverzögerungszeit,induktiveLast
Turn-ondelaytime,inductiveload
IC = 300 A, VCE = 500 V
VGE = ±15 V
RGon = 1,5 Ω
td on
0,16
0,18
0,19
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Anstiegszeit,induktiveLast
Risetime,inductiveload
IC = 300 A, VCE = 500 V
VGE = ±15 V
RGon = 1,5 Ω
tr
0,05
0,05
0,06
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Abschaltverzögerungszeit,induktiveLast
Turn-offdelaytime,inductiveload
IC = 300 A, VCE = 500 V
VGE = ±15 V
RGoff = 1,5 Ω
td off
0,42
0,53
0,61
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Fallzeit,induktiveLast
Falltime,inductiveload
IC = 300 A, VCE = 500 V
VGE = ±15 V
RGoff = 1,5 Ω
tf
0,04
0,09
0,09
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
EinschaltverlustenergieproPuls
Turn-onenergylossperpulse
IC = 300 A, VCE = 500 V, LS = 20 nH
VGE = ±15 V, di/dt = 5500 A/µs (Tvj=150°C)
RGon = 1,5 ΩEon
17,0
24,0
26,0
mJ
mJ
mJ
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
AbschaltverlustenergieproPuls
Turn-offenergylossperpulse
IC = 300 A, VCE = 500 V, LS = 20 nH
VGE = ±15 V, du/dt = 2550 V/µs (Tvj=150°C)
RGoff = 1,5 ΩEoff
13,0
26,0
30,0
mJ
mJ
mJ
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Kurzschlußverhalten
SCdata
VGE ≤ 15 V, VCC = 900 V
VCEmax = VCES -LsCE ·di/dt ISC 2300
2000 A
A
Tvj = 25°C
Tvj = 150°C
tP ≤ 8 µs,
tP ≤ 6 µs,
Wärmewiderstand,ChipbisGehäuse
Thermalresistance,junctiontocase
pro IGBT / per IGBT
cooling fluid = 50% water/50% ethylenglycol; ∆V/∆t =
10,0 dm³/min
RthJF 0,10 K/W