Excess resistance in series with the remote diode causes
about +1/2°C error per ohm. Likewise, 200μV of offset
voltage forced on DXP–DXN causes about 1°C error.
A/D Conversion Sequence
If a Start command is written (or generated automatically
in the free-running auto-convert mode), both channels
are converted, and the results of both measurements are
available after the end of conversion. A BUSY status bit in
the status byte shows that the device is actually performing
a new conversion; however, even if the ADC is busy, the
results of the previous conversion are always available.
Remote-Diode Selection
Temperature accuracy depends on having a good-quality,
diode-connected small-signal transistor. See Table 1 for a
recommended list of diode-connected small-signal tran-
sistors. The MAX1617A can also directly measure the die
temperature of CPUs and other integrated circuits having
on-board temperature-sensing diodes.
The transistor must be a small-signal type with a rela-
tively high forward voltage; otherwise, the A/D input volt-
age range can be violated. The forward voltage must be
greater than 0.25V at 10μA; check to ensure this is true
at the highest expected temperature. The forward voltage
(VDXP - VDXN) must be less than 0.95V at 100μA; addi-
tionally, ensure the maximum VDXP (DXP voltage) ≤ (0.78
x VCC - 1.1) volts over your expected range of tempera-
ture. Large power transistors don’t work at all. Also ensure
that the base resistance is less than 100Ω. Tight specifica-
tions for forward-current gain (+50 to +150, for example)
indicate that the manufacturer has good process controls
and that the devices have consistent VBE characteristics.
For heatsink mounting, the 500-32BT02-000 thermal sen-
sor from Fenwal Electronics is a good choice. This device
consists of a diode-connected transistor, an aluminum
plate with screw hole, and twisted-pair cable (Fenwal Inc.,
Milford, MA, 508-478-6000).
Thermal Mass and Self-Heating
Thermal mass can seriously degrade the MAX1617A’s
effective accuracy. The thermal time constant of the
QSOP-16 package is about 140sec in still air. For the
MAX1617A junction temperature to settle to within +1°C
after a sudden +100°C change requires about five time
constants or 12 minutes. The use of smaller packages
for remote sensors, such as SOT23s, improves the situa-
tion. Take care to account for thermal gradients between
the heat source and the sensor, and ensure that stray air
currents across the sensor package do not interfere with
measurement accuracy.
Self-heating does not significantly affect measurement
accuracy. Remote-sensor self-heating due to the diode
current source is negligible. For the local diode, the
worst-case error occurs when auto-converting at the fast-
est rate and simultaneously sinking maximum current at
the ALERT output. For example, at an 8Hz rate and with
ALERT sinking 1mA, the typical power dissipation is VCC
x 450μA plus 0.4V x 1mA. Package theta J-A is about
150°C/W, so with VCC = 5V and no copper PC board
heatsinking, the resulting temperature rise is:
dT = 2.7mW x 150°C/W = 0.4°C
Even with these contrived circumstances, it is difficult to
introduce significant self-heating errors.
ADC Noise Filtering
The ADC is an integrating type with inherently good noise
rejection, especially of low-frequency signals such as
60Hz/120Hz power-supply hum. Micropower operation
places constraints on high-frequency noise rejection;
therefore, careful PC board layout and proper external
noise filtering are required for high-accuracy remote mea-
surements in electrically noisy environments.
High-frequency EMI is best filtered at DXP and DXN
with an external 2200pF capacitor. This value can be
increased to about 3300pF (max), including cable capaci-
tance. Higher capacitance than 3300pF introduces errors
due to the rise time of the switched current source.
Nearly all noise sources tested cause the ADC measure-
ments to be higher than the actual temperature, typically
by +1°C to +10°C, depending on the frequency and ampli-
tude (see Typical Operating Characteristics).
Table 1. Remote-Sensor Transistor
Manufacturers
Note: Transistors must be diode-connected (base shorted to
collector).
MAX1617A Remote/Local Temperature Sensor
with SMBus Serial Interface
www.maximintegrated.com Maxim Integrated
│
8
MANUFACTURER MODEL NUMBER
Central Semiconductor (USA) CMPT3904
Motorola (USA) MMBT3904
National Semiconductor (USA) MMBT3904
Rohm Semiconductor (Japan) SST3904
Samsung (Korea) KST3904-TF
Siemens (Germany) SMBT3904
Zetex (England) FMMT3904CT-ND