© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Rev 0.2, Revised: 10/12/18
SiC MOSFET
LSIC1MO120E0080, 1200 V, 80 mOhm, TO-247-3L
RoHS
LSIC1MO120E0080 1200 V N-channel, Enhancement-mode SiC MOSFET
Features
Applications
Optimized for high-
frequency, high-efficiency
applications
Extremely low gate
charge and output
capacitance
Low gate resistance for
high-frequency switching
Normally-off operation at
all temperatures
Ultra-low on-resistance
High-frequency
applications
Solar Inverters
Switch Mode Power
Supplies
UPS
Motor Drives
High Voltage DC/DC
Converters
Battery Chargers
Induction Heating
Circuit Diagram TO-247-3L
21 3
*
* Body
diode
Product Summary
Characteristics Value Unit
VDS 1200 V
Typical RDS(ON) 80
ID ( TC ≤ 100 °C) 25 A
Littelfuse “RoHS” logo =
RoHS conform
Littelfuse “HF” logo =
Halogen Free
Littelfuse “Pb-free” logo =
Pb-free lead plating
Environmental
RoHS
Pb
Pb
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Rev 0.2, Revised: 10/12/18
SiC MOSFET
LSIC1MO120E0080, 1200 V, 80 mOhm, TO-247-3L
Thermal Characteristics
Maximum Ratings
Characteristics Symbol Conditions Value Unit
Continuous Drain Current ID
VGS = 20 V, TC = 25 °C 39 A
VGS = 20 V, TC = 100 °C 25
Pulsed Drain Current 1 ID(pulse) TC = 25 °C 80 A
Power Dissipation PDTC = 25 °C, TJ = 150 °C 179 W
Operating Junction Temperature TJ-55 to 150 °C
Gate-source Voltage
VGS,MAX Absolute maximum values -6 to 22
V
VGS,OP,TR Transient, <1% duty cycle -10 to 25
VGS,OP
Recommended DC
operating values -5 to 20
Storage Temperature TSTG --55 to 150 °C
Lead Temperature for Soldering Tsold -260 °C
Mounting Torque MDM3 or 6-32 screw 0.6 Nm
5.3 in-lb
Footnote 1: Pulse width limited by TJ,max
Characteristics Symbol Value Unit
Maximum Thermal Resistance, junction-to-case Rth,JC,max 0.7 °C/W
Maximum Thermal Resistance, junction-to-ambient Rth,JA,max 40 °C/W
Electrical Characteristics (TJ = 25 °C unless otherwise specified)
Characteristics Symbol Conditions Min Typ Max Unit
Static Characteristics
Drain-source Breakdown Voltage V(BR)DSS VGS = 0 V, ID = 250 μA 1200 - - V
Zero Gate Voltage Drain Current IDSS
VDS = 1200 V, VGS = 0 V - 1 100 μA
VDS = 1200 V, VGS = 0 V, TJ = 150 °C - 2 -
Gate Leakage Current IGSS,F VGS = 20 V, VDS = 0 V - - 100 nA
IGSS,R VGS = -10 V, VDS = 0 V - - 100
Drain-source On-state Resistance RDS(ON)
ID = 20 A, VGS = 20 V - 80 100
ID = 20 A, VGS = 20 V, TJ = 150 °C -105 -
Gate Threshold Voltage VGS,(th)
VDS = VGS, ID = 10 mA 1.8 2.8 4.0 V
VDS = VGS, ID = 10 mA, TJ = 150 °C -1. 9 -
Gate Resistance RGf = 1 MHz, VAC = 25 mV -1.0 - Ω
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/12/18
SiC MOSFET
LSIC1MO120E0080, 1200 V, 80 mOhm, TO-247-3L LSIC1MO120E0080, 1200 V, 80 m Ohm, TO-247-3L
Electrical Characteristics (TJ = 25 °C unless otherwise specified)
Characteristics Symbol Conditions Value Unit
Min Typ Max
Dynamic Characteristics
Turn-on Switching Energy EON VDD = 800 V, ID = 20 A,
VGS = -5/+20 V,
RG,ext = 2 Ω, L = 1.4 mH
- 270 -
μJTurn-off Switching Energy EOFF - 60 -
Total Per-cycle Switching Energy ETS - 330 -
Input Capacitance CISS
VDD = 800 V, VGS = 0 V,
f = 1 MHz, VAC = 25 mV
- 1825 -
pFOutput Capacitance COSS - 75 -
Reverse Transfer Capacitance CRSS -15 -
COSS Stored Energy EOSS - 25 - μJ
Total Gate Charge QgVDD = 800 V, ID = 20 A,
VGS = -5/+20 V
- 95 -
nCGate-source Charge Qgs - 29 -
Gate-drain Charge Qgd - 39 -
Turn-on Delay Time td(on) VDD = 800 V, VGS = -5/+20 V,
ID = 20 A, RG,ext = 2 Ω,
RL = 40 Ω,
Timing relative to VDS
-10 -
ns
Rise Time tr-10 -
Turn-off Delay Time td(off) -16 -
Fall Time tf- 6 -
Reverse Diode Characteristics
Characteristics Symbol Conditions Value Unit
Min Typ Max
Diode Forward Voltage VSD
IS = 10 A, VGS = 0 V - 3.8 - V
IS = 10 A, VGS = 0 V, TJ = 150 °C - 3.4 -
Continuous Diode Forward Current ISVGS = 0 V, TC = 25 °C - - 35 A
Peak Diode Forward Current 1ISP - - 85
Reverse Recovery Time trr VGS = -5 V, IS = 20 A,
VR = 800 V,
dI/dt = 5.3 A/ns
- 25 - ns
Reverse Recovery Charge Qrr -185 - nC
Peak Reverse Recovery Current Irrm -16 - A
Footnote 1: Pulse width limited by TJ,max
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Rev 0.2, Revised: 10/12/18
SiC MOSFET
LSIC1MO120E0080, 1200 V, 80 mOhm, TO-247-3L
Case Temperature, T
C
(
±
C)
Maximum Power Dissipation (W)
0
20
40
60
80
100
120
140
160
180
200
-75-25 25 75 125175
Figure 2: Transfer Characteristics ( VDS = 10 V )
Figure 3: Output Characteristics ( TJ = 25 °C )
Figure 1: Maximum Power Dissipation ( TJ = 150 °C )
0
10
20
30
40
50
60
70
80
90
0510 15 20
Drain Current, I
D
(A)
Gate-Source Voltage, V
GS
(V)
150 C
Ʊ25 C
Ʊ-55 C
Ʊ
Figure 4: Output Characteristics ( TJ = 150 °C )
10V
12V
14V
16V
20V
18V
0
20
40
60
80
0246810
Drain Current, I
D
(A)
Drain-source Voltage, V
DS
(V)
10V
12V
14V
V = 20V,18V,16V
0
20
40
60
80
0246810
Drain Current, I
D
(A)
Drain
-
source Voltage, V
DS
(V)
GS
Figure 6: Reverse Conduction Characteristics ( TJ = 25 °C )
0
10
20
30
40
50
60
70
80
01234567
Reverse Current, I
S
(A)
Reverse Voltage, V
SD
(V)
-5V0V 5V 10V
V
GS
= 15V, 20V
Figure 5: Output Characteristics ( TJ = -55 °C )
0
20
40
60
80
0246810
Drain Current, I
D
(A)
Drain
-
source Voltage, V
DS (V)
10V
12V
14V
16V
20V
18V
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/12/18
SiC MOSFET
LSIC1MO120E0080, 1200 V, 80 mOhm, TO-247-3L LSIC1MO120E0080, 1200 V, 80 m Ohm, TO-247-3L
Figure 9: Transient Thermal Impedance Figure 10: Safe Operating Area ( TC = 25 °C )
10 10 10 10 10 10 10
-6 -5 -4 -3 -2 -1 0
Transient Thermal Impedance, Z
th,JC
(Normalized to R
th,JC
)
Pulse Width (s)
10
0
10
-1
10
-2
10
-3
0.5
0.3
0.1
0.05
0.02
0.01
Single Pulse
10 μs
100 μs
1 ms
DC
0.1
1
10
100
0.1101000
Drain Current, I
D
(A)
Drain-source Voltage, V
DS
(V)
Figure 11: On-resistance vs. Drain Current Figure 12: Normalized On-resistance
0
20
40
60
80
100
120
140
160
180
200
15 25 35 45 55 65
On-resistance, R
DS(ON)
(mΩ)
Drain Current, I
D
(A)
25 ƱC
150 ƱC
-55 ƱC
Normalized On-Resistance, RDS(ON)
Junction Temperature, TJ(±C)
( V = 20 V, I = 20 A )
GS D
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
-75-50 -250 25 50 75 100125150175
Figure 7: Reverse Conduction Characteristics ( TJ = 150 °C )
-5V0V 5V V =
10V,15V,20V
0
10
20
30
40
50
60
70
80
01234567
Reverse Current, I
S
(A)
Reverse Voltage, V
SD
(V)
GS
Figure 8: Reverse Conduction Characteristics ( TJ = -55 °C )
0
10
20
30
40
50
60
70
80
01234567
Reverse Current, IS(A)
Reverse Voltage, VSD (V)
-5V0V 5V 10VVGS =
15V,20V
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Rev 0.2, Revised: 10/12/18
SiC MOSFET
LSIC1MO120E0080, 1200 V, 80 mOhm, TO-247-3L
Figure 13: Threshold Voltage
±C)
Threshold Voltage, VGS(th)(V)
Junction Temperature, T
J(
(I
D
= 10 mA)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
-75-50 -250 25 50 75 100125150175
Figure 14: Drain-source Blocking Voltage
(±C)
Normalized Blocking Voltage, V(BR)DSS (V)
Junction Temperature, TJ
(I
D
= 250 μA)
0.96
0.97
0.98
0.99
1
1.01
1.02
1.03
1.04
-75-50 -250 25 50 75 100125 150175
Figure 15: Junction Capacitances Figure 16: Junction Capacitances
Figure 17: COSS Stored Energy EOSS Figure 18: Gate Charge
10
100
1000
10000
0200 400600 8001000
Capacitance (pF)
Drain Voltage, VDS (V)
C
C
C
ISS
OSS
RSS
( f = 1 MHz )
C
C
ISS
OSS
050100 150200
Drain Voltage, V
DS
(V)
10
100
1000
10000
Capacitance (pF)
( f = 1 MHz )
RSS
C
0
10
20
30
40
0200 400600 8001000
Stored Energy, E
oss
J)
Drain Voltage, V
DS
(V)
Gate -source Voltage, VGS (V)
Gate Charge, Qg(nC)
( V = 800 V, I = 20 A )
DD D
-5
0
5
10
15
20
0102030405060708090100
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/12/18
SiC MOSFET
LSIC1MO120E0080, 1200 V, 80 mOhm, TO-247-3L LSIC1MO120E0080, 1200 V, 80 m Ohm, TO-247-3L
Figure 19: Switching Energy vs. Drain Current Figure 20: Switching Energy vs. Gate Resistance
E
0
200
400
600
800
1000
1200
01020304050
Switching Energy J)
Drain Current, I
D
(A)
V
DD
= 800 V
R
G,ext
= 2
V
GS
=-5/+20V
FWD = LSIC2SD120A10
L = 1.4 mH
T
J
= 25 °C
TS
E
ON
E
OFF
0
100
200
300
400
500
600
700
024681012
Switching Energy (μJ)
External Gate Resistance, RG,ext (Ω)
V
DD
= 800 V
I
D
= 20A
V
GS
=-5/+20V
FWD = LSIC2SD120A10
L = 1.4 mH
T
J
= 25 °C
E
TS
E
ON
E
OFF
Package Dimensions TO-247-3L
1A
R0.93
5.44 5.44
2.46
Recommended Hole Pattern Layout
UNIT: mm
Symbol Millimeters
Min Nom Max
A 4.902 5.029 5.156
A1 2.253 2.380 2.507
A2 1.854 1.981 2.108
D 20.828 20.955 21.082
E 15.773 15.900 16.027
E2 4.191 4.318 4.445
E2/2 1.473 1.524 1.575
e 5.436
L 20.066 20.193 20.320
L1 3.937 4.191 4.445
øP3.556 3.067 3.658
Q 5.486 5.613 5.740
S 6.045 6.172 6.299
b 0.991 - 1.397
b1 0.991 1.199 1.346
b2 1.651 - 2.387
b3 1.651 1.999 2.336
b4 2.591 - 3.429
b5 2.591 3.000 3.378
c 0.381 0.635 0.889
c1 0.381 0.610 0.838
D1 17.399 17.526 17.653
D2 1.067 1.194 1.321
E1 13.894 14.021 14.148
øP1 7.061 7.188 7.315
Notes:
1. Dimensions are in millimeters
2. Dimension D, E do not include mold flash.
Mold flash shall not exceed 0.127 mm per
side measured at outer most extreme of
plastic body.
3.øP to have a maximum draft angle of 38.1
mm to the top of the part with a maximum
hole diameter of 3.912 mm.
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Rev 0.2, Revised: 10/12/18
SiC MOSFET
LSIC1MO120E0080, 1200 V, 80 mOhm, TO-247-3L
Packing Options
Part Number Marking Packing Mode M.O.Q
LSIC1MO120E0080 SIC1MO120E0080 Tube(30pcs) 450
Part Numbering and Marking System
SIC
1
MO
E = TO-247-3L
YY
WW
E
ZZZZZZ-ZZ
120
0080
SIC1MO120E0080
YYWWE
ZZZZZZ-ZZ
L
F
= SiC
= MOSFET
= Voltage Rating (1200 V)
= Gen1
= RDS(ON) (80 mOhm)
= Week
= Special Code
= Lot Number
= Year
Packing Specification TO-247-3L
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NOTE:
1. All pin plug holes are considered critical dimension
2. Tolerance is to be ±0.010 unless otherwise specified
3. Dimension are in inch (and millimeters).
Ø
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medical, life-saving, life-sustaining or nuclear facility applications, devices intended for surgical implant into the body, or any other application in which the failure
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