LM161, LM361 www.ti.com SNOSBJ5C - MAY 1999 - REVISED MARCH 2013 LM161/LM361 High Speed Differential Comparators Check for Samples: LM161, LM361 FEATURES DESCRIPTION * * * * * * * * The LM161/LM361 is a very high speed differential input, complementary TTL output voltage comparator with improved characteristics over the SE529/NE529 for which it is a pin-for-pin replacement. The device has been optimized for greater speed performance and lower input offset voltage. Typically delay varies only 3 ns for over-drive variations of 5 mV to 500 mV. It may be operated from op amp supplies (15V). 1 2 Independent strobes Ensured high speed: 20 ns max Tight delay matching on both outputs Complementary TTL outputs Operates from op amp supplies: 15V Low speed variation with overdrive variation Low input offset voltage Versatile supply voltage range Complementary outputs having maximum skew are provided. Applications involve high speed analog to digital converters and zero-crossing detectors in disk file systems. CONNECTION DIAGRAMS SOIC or PDIP Package Figure 1. Top View Package Numbers D0014A, NFF0014A TO-100 Package Figure 2. Package Number LME0010C 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1999-2013, Texas Instruments Incorporated LM161, LM361 SNOSBJ5C - MAY 1999 - REVISED MARCH 2013 www.ti.com LOGIC DIAGRAM *Output is low when current is drawn from strobe pin. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) + Positive Supply Voltage, V +16V Negative Supply Voltage, V- -16V Gate Supply Voltage, VCC +7V Output Voltage +7V Differential Input Voltage 5V Input Common Mode Voltage 6V Power Dissipation 600 mW -65C to +150C Storage Temperature Range Operating Temperature Range TMIN TMAX -55C to +125C LM161 -25C to +85C LM361 0C to +70C Lead Temp. (Soldering, 10 seconds) 260C For Any Device Lead Below V- (1) 0.3V The device may be damaged by use beyond the maximum ratings. Operating Conditions Min LM161 Supply Voltage V+ Supply Voltage V- Supply Voltage VCC ESD Tolerance (1) (2) 2 Max 15V LM361 5V 15V LM161 -6V -15V LM361 -6V -15V LM161 4.5V 5V 5.5V LM361 4.75V 5V 5.25V (1) Soldering Information Typ 5V 1600V (2) (2) PDIP Package Soldering (10 seconds) SOIC Package Vapor Phase (60 seconds) 260C 215C Infrared (15 seconds) 220C Human body model, 1.5 k in series with 100 pF. See AN-450 "Surface Mounting Methods and Their Effect on Product Reliability" for other methods of soldering surface mount devices. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM161 LM361 LM161, LM361 www.ti.com SNOSBJ5C - MAY 1999 - REVISED MARCH 2013 Electrical Characteristics (1) (2) (1) (V+ = +10V, VCC = +5V, V- = -10V, TMIN TA TMAX, unless noted) Parameter Conditions Limits Units LM161 Min Input Offset Voltage Input Bias Current LM361 Typ Max 1 3 Min 5 TA=25C Typ Max 1 5 mV A 10 20 A 30 2 A 2 Input Offset Current TA=25C Voltage Gain TA=25C 3 3 V/mV Input Resistance TA=25C, f=1 kHz 20 20 k Logical "1" Output Voltage VCC=4.75V, ISOURCE=-0.5 mA 3.3 V Logical "0" Output Voltage VCC=4.75V, ISINK=6.4 mA 0.4 0.4 V Strobe Input "1" Current (Output Enabled) VCC=5.25V, VSTROBE=2.4V 200 200 A Strobe Input "0" Current (Output Disabled) VCC=5.25V, VSTROBE=0.4V -1.6 -1.6 mA Strobe Input "0" Voltage VCC=4.75V 0.8 0.8 V Strobe Input "1" Voltage VCC=4.75V Output Short Circuit Current VCC=5.25V, VOUT=0V -55 mA Supply Current I+ V+=10V, V-=-10V, VCC=5.25V, -55CTA125C Supply Current I+ V+=10V, V-=-10V, VCC=5.25V, 0CTA70C Supply Current I- V+=10V, V-=-10V, VCC=5.25V, -55CTA125C Supply Current I- V+=10V, V-=-10V,VCC=5.25V, 0CTA70C Supply Current ICC V+=10V, V-=-10V, VCC=5.25V, -55CTA125C Supply Current ICC V+=10V, V-=-10V, VCC=5.25V, 0CTA70C Transient Response VIN = 50 mV overdrive 3 2.4 A 5 3.3 2.4 2 2 -18 -55 V -18 4.5 mA 5 10 mA mA 10 18 mA mA 20 mA (3) Propagation Delay Time (tpd(0)) TA=25C 14 20 14 20 ns Propagation Delay Time (tpd(1)) TA=25C 14 20 14 20 ns Delay Between Output A and B TA=25C 2 5 2 5 ns Strobe Delay Time (tpd(0)) TA=25C 8 8 ns Strobe Delay Time (tpd(1)) TA=25C 8 8 ns (1) Typical thermal impedances are as follows: (2) (3) Refer to RETS161X for LM161H and LM161J military specifications. Measurements using AC Test circuit, Fanout = 1. The devices are faster at low supply voltages. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM161 LM361 3 LM161, LM361 SNOSBJ5C - MAY 1999 - REVISED MARCH 2013 www.ti.com Typical Performance Characteristics 4 Offset Voltage Input Currents vs Ambient Temperature Figure 3. Figure 4. Input Characteristics Supply Current vs Ambient Temperature Figure 5. Figure 6. Supply Current vs Supply Voltage Propagation Delay vs Ambient Temperature Figure 7. Figure 8. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM161 LM361 LM161, LM361 www.ti.com SNOSBJ5C - MAY 1999 - REVISED MARCH 2013 Typical Performance Characteristics (continued) Delay of Output 1 With Respect to Output 2 vs Ambient Temperature Strobe Delay vs Ambient Temperature Figure 9. Figure 10. Common-Mode Pulse Response Propagation Delay vs Supply Voltage Figure 11. Figure 12. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM161 LM361 5 LM161, LM361 SNOSBJ5C - MAY 1999 - REVISED MARCH 2013 www.ti.com AC TEST CIRCUIT VIN = 50 mV + V = +10V 6 FANOUT = 1 FANOUT = 4 V- = -10V R = 2.4k R = 680 VCC = 5.25V Submit Documentation Feedback C=15 pF C = 30 pF Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM161 LM361 LM161, LM361 www.ti.com SNOSBJ5C - MAY 1999 - REVISED MARCH 2013 SCHEMATIC DIAGRAM LM161 R10, R16: 85 R11, R17: 205 Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM161 LM361 7 LM161, LM361 SNOSBJ5C - MAY 1999 - REVISED MARCH 2013 www.ti.com REVISION HISTORY Changes from Revision B (March 2013) to Revision C * 8 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 7 Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM161 LM361 PACKAGE OPTION ADDENDUM www.ti.com 23-Sep-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) LM361H ACTIVE TO-100 LME 10 500 TBD Call TI Call TI 0 to 70 LM361H LM361H/NOPB ACTIVE TO-100 LME 10 500 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM 0 to 70 LM361H LM361M ACTIVE SOIC D 14 55 TBD Call TI Call TI 0 to 70 LM361M LM361M/NOPB ACTIVE SOIC D 14 55 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM361M LM361MX ACTIVE SOIC D 14 TBD Call TI Call TI 0 to 70 LM361M LM361MX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM361M LM361N ACTIVE PDIP NFF 14 25 TBD Call TI Call TI 0 to 70 LM361N LM361N/NOPB ACTIVE PDIP NFF 14 25 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 LM361N LM529CH ACTIVE TO-100 LME 10 500 TBD Call TI Call TI 0 to 70 LM361H LM529CN ACTIVE PDIP NFF 14 25 TBD Call TI Call TI 0 to 70 LM361N NE529A ACTIVE PDIP NFF 14 25 TBD Call TI Call TI 0 to 70 LM361N NE529K ACTIVE TO-100 LME 10 500 TBD Call TI Call TI 0 to 70 LM361H SE529K ACTIVE TO-100 LME 10 500 TBD Call TI Call TI 0 to 70 LM361H (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 23-Sep-2013 Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device LM361MX/NOPB Package Package Pins Type Drawing SOIC D 14 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 9.35 2.3 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM361MX/NOPB SOIC D 14 2500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA MMBC006 - MARCH 2001 LME (O-MBCY-W10) METAL CYLINDRICAL PACKAGE o 0.370 (9,40) 0.335 (8,51) o 0.335 (8,51) 0.305 (7,75) 0.040 (1,02) 0.010 (0,25) 0.185 (4,70) 0.165 (4,19) 0.040 (1,02) 0.010 (0,25) 0.500 (12,70) MIN Seating Plane o o 0.021 (0,53) 0.016 (0,41) 0.160 (4,06) 0.120 (3,05) 0.120 (3,05) 0.110 (2,79) 4 3 0.034 (0,86) 0.028 (0,71) 36 5 2 6 1 10 7 9 8 0.230 (5,84) 0.045 (1,14) 0.029 (0,74) 4202488/A 03/01 NOTES: A. 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