LM161, LM361
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SNOSBJ5C –MAY 1999–REVISED MARCH 2013
LM161/LM361 High Speed Differential Comparators
Check for Samples: LM161,LM361
1FEATURES DESCRIPTION
The LM161/LM361 is a very high speed differential
2• Independent strobes input, complementary TTL output voltage comparator
• Ensured high speed: 20 ns max with improved characteristics over the SE529/NE529
• Tight delay matching on both outputs for which it is a pin-for-pin replacement. The device
has been optimized for greater speed performance
• Complementary TTL outputs and lower input offset voltage. Typically delay varies
• Operates from op amp supplies: ±15V only 3 ns for over-drive variations of 5 mV to 500 mV.
• Low speed variation with overdrive variation It may be operated from op amp supplies (±15V).
• Low input offset voltage Complementary outputs having maximum skew are
• Versatile supply voltage range provided. Applications involve high speed analog to
digital converters and zero-crossing detectors in disk
file systems.
CONNECTION DIAGRAMS
SOIC or PDIP Package
Figure 1. Top View
Package Numbers D0014A, NFF0014A
TO-100 Package
Figure 2. Package Number LME0010C
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1999–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM161, LM361
SNOSBJ5C –MAY 1999–REVISED MARCH 2013
www.ti.com
LOGIC DIAGRAM
*Output is low when current is drawn from strobe pin.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1)
Positive Supply Voltage, V++16V
Negative Supply Voltage, V−−16V
Gate Supply Voltage, VCC +7V
Output Voltage +7V
Differential Input Voltage ±5V
Input Common Mode Voltage ±6V
Power Dissipation 600 mW
Storage Temperature Range −65°C to +150°C
Operating Temperature Range TMIN TMAX
LM161 −55°C to +125°C
−25°C to +85°C
LM361 0°C to +70°C
Lead Temp. (Soldering, 10 seconds) 260°C
For Any Device Lead Below V−0.3V
(1) The device may be damaged by use beyond the maximum ratings.
Operating Conditions Min Typ Max
LM161 5V 15V
Supply Voltage V+LM361 5V 15V
LM161 −6V −15V
Supply Voltage V−LM361 −6V −15V
LM161 4.5V 5V 5.5V
Supply Voltage VCC LM361 4.75V 5V 5.25V
ESD Tolerance (1) 1600V
PDIP Package Soldering (10 seconds)(2) 260°C
SOIC Package Vapor Phase (60 215°C
Soldering Information(2) seconds)
Infrared (15 seconds) 220°C
(1) Human body model, 1.5 kΩin series with 100 pF.
(2) See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.
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Product Folder Links: LM161 LM361
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SNOSBJ5C –MAY 1999–REVISED MARCH 2013
Electrical Characteristics(1)(2)(1)
(V+= +10V, VCC = +5V, V−=−10V, TMIN ≤TA≤TMAX, unless noted)
Parameter Conditions Limits Units
LM161 LM361
Min Typ Max Min Typ Max
Input Offset Voltage 1 3 1 5 mV
5 10 μA
Input Bias Current TA=25°C 20 30 μA
2 2 μA
Input Offset Current TA=25°C 3 5 μA
Voltage Gain TA=25°C 3 3 V/mV
Input Resistance TA=25°C, f=1 kHz 20 20 kΩ
VCC=4.75V,
Logical “1” Output Voltage 2.4 3.3 2.4 3.3 V
ISOURCE=−0.5 mA
VCC=4.75V,
Logical “0” Output Voltage 0.4 0.4 V
ISINK=6.4 mA
Strobe Input “1” Current VCC=5.25V, 200 200 μA
(Output Enabled) VSTROBE=2.4V
Strobe Input “0” Current VCC=5.25V, −1.6 −1.6 mA
(Output Disabled) VSTROBE=0.4V
Strobe Input “0” Voltage VCC=4.75V 0.8 0.8 V
Strobe Input “1” Voltage VCC=4.75V 2 2 V
Output Short Circuit Current VCC=5.25V, VOUT=0V −18 −55 −18 −55 mA
Supply Current I+V+=10V, V−=−10V, 4.5 mA
VCC=5.25V,
−55°C≤TA≤125°C
Supply Current I+V+=10V, V−=−10V, 5 mA
VCC=5.25V,
0°C≤TA≤70°C
Supply Current I−V+=10V, V−=−10V, 10 mA
VCC=5.25V,
−55°C≤TA≤125°C
Supply Current I−V+=10V, 10 mA
V−=−10V,VCC=5.25V,
0°C≤TA≤70°C
Supply Current ICC V+=10V, V−=−10V, 18 mA
VCC=5.25V,
−55°C≤TA≤125°C
Supply Current ICC V+=10V, V−=−10V, 20 mA
VCC=5.25V,
0°C≤TA≤70°C
Transient Response VIN = 50 mV overdrive (3)
Propagation Delay Time (tpd(0)) TA=25°C 14 20 14 20 ns
Propagation Delay Time (tpd(1)) TA=25°C 14 20 14 20 ns
Delay Between Output A and B TA=25°C 2 5 2 5 ns
Strobe Delay Time (tpd(0)) TA=25°C 8 8 ns
Strobe Delay Time (tpd(1)) TA=25°C 8 8 ns
(1) Typical thermal impedances are as follows:
(2) Refer to RETS161X for LM161H and LM161J military specifications.
(3) Measurements using AC Test circuit, Fanout = 1. The devices are faster at low supply voltages.
Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LM161 LM361
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SNOSBJ5C –MAY 1999–REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics
Input Currents
vs
Ambient
Offset Voltage Temperature
Figure 3. Figure 4.
Supply Current vs
Input Characteristics Ambient Temperature
Figure 5. Figure 6.
Supply Current vs Propagation Delay vs
Supply Voltage Ambient Temperature
Figure 7. Figure 8.
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LM161, LM361
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SNOSBJ5C –MAY 1999–REVISED MARCH 2013
Typical Performance Characteristics (continued)
Strobe Delay
Delay of Output 1 With vs
Respect to Output 2 vs Ambient
Ambient Temperature Temperature
Figure 9. Figure 10.
Common-Mode Propagation Delay vs
Pulse Response Supply Voltage
Figure 11. Figure 12.
Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LM161 LM361
LM161, LM361
SNOSBJ5C –MAY 1999–REVISED MARCH 2013
www.ti.com
REVISION HISTORY
Changes from Revision B (March 2013) to Revision C Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 7
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PACKAGE OPTION ADDENDUM
www.ti.com 23-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM361H ACTIVE TO-100 LME 10 500 TBD Call TI Call TI 0 to 70 LM361H
LM361H/NOPB ACTIVE TO-100 LME 10 500 Green (RoHS
& no Sb/Br) POST-PLATE Level-1-NA-UNLIM 0 to 70 LM361H
LM361M ACTIVE SOIC D 14 55 TBD Call TI Call TI 0 to 70 LM361M
LM361M/NOPB ACTIVE SOIC D 14 55 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM361M
LM361MX ACTIVE SOIC D 14 TBD Call TI Call TI 0 to 70 LM361M
LM361MX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM361M
LM361N ACTIVE PDIP NFF 14 25 TBD Call TI Call TI 0 to 70 LM361N
LM361N/NOPB ACTIVE PDIP NFF 14 25 Green (RoHS
& no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 LM361N
LM529CH ACTIVE TO-100 LME 10 500 TBD Call TI Call TI 0 to 70 LM361H
LM529CN ACTIVE PDIP NFF 14 25 TBD Call TI Call TI 0 to 70 LM361N
NE529A ACTIVE PDIP NFF 14 25 TBD Call TI Call TI 0 to 70 LM361N
NE529K ACTIVE TO-100 LME 10 500 TBD Call TI Call TI 0 to 70 LM361H
SE529K ACTIVE TO-100 LME 10 500 TBD Call TI Call TI 0 to 70 LM361H
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PACKAGE OPTION ADDENDUM
www.ti.com 23-Sep-2013
Addendum-Page 2
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM361MX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM361MX/NOPB SOIC D 14 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 2
MECHANICAL DATA
MMBC006 – MARCH 2001
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
LME (O–MBCY–W10) METAL CYLINDRICAL PACKAGE
7
8
4202488/A 03/01
0.335 (8,51)
0.370 (9,40)
0.335 (8,51)
0.305 (7,75)
0.185 (4,70)
0.165 (4,19)
0.500 (12,70) MIN
0.010 (0,25)
0.040 (1,02)
0.040 (1,02)
0.010 (0,25)
0.016 (0,41)
0.021 (0,53)
0.045 (1,14)
0.029 (0,74)
0.028 (0,71)
0.034 (0,86)
0.120 (3,05)
0.160 (4,06) 0.120 (3,05)
0.110 (2,79)
ø
ø
ø
ø
Seating
Plane
36°
3
110 9
456
2
0.230 (5,84)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Leads in true position within 0.010 (0,25) R @ MMC at seating plane.
D. Pin numbers shown for reference only. Numbers may not be marked on package.
E. Falls within JEDEC MO–006/TO-100.
MECHANICAL DATA
N0014A
www.ti.com
N14A (Rev G)
NFF0014A
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