Next-Generation NAND Flash Part Numbering System
Micron's part numbering system is available at www.micron.com/numbering
Next-Generation NAND Flash*
MT 29F 2G 08 A A A A A WP - xx xx x ES : A
Micron Technology Design Revision (shrink)
Single-Supply Flash Production Status
29F = NAND Flash Blank = Production
29E = Enterprise NAND Flash ES = Engineering Samples
QS = Qualification Samples
Density MS = Mechanical Sample
1G = 1Gb
2G = 2Gb Reserved for Future use.
4G = 4Gb
8G = 8Gb Operating Temperature Range
16G = 16Gb Blank = Commercial (0°C to +70°C)
32G = 32Gb IT = Extended (–40°C to +85°C) (AKA ET)
64G = 64Gb WT = Wireless Temp (–25°C to +85°C)
128G = 128Gb
256G = 256Gb Speed Grade (Synchronous)
Blank if no speed grade defined
Device Width 20 = 100MT/s
01 = 1 bit 15 = 133MT/s
08 = 8 bits 12 = 166MT/s
16 = 16 bits
Package Code
Level WP = 48-pin TSOP I (CPL version) (Pb-free)
Mark Level WC = 48-pin TSOP I (OCPL version) (Pb-free)
A SLC HC = 63-ball VFBGA, 10.5 x 13 x 1.0
B Reserved C3 = 52-pad ULGA, 12 x 17 x 0.65
C MLC-2 C4 = 52-pad VLGA, 12 x 17 x 1.0 (SDP/DDP/QDP)
C5 = 52-pad VLGA, 14 x 18 x 1.0 (SDP/DDP/QDP)
Classification C6 = 52-pad LLGA, 14 x 18 x 1.47 (DDP/QDP/8DP)
C7 = 48-pad LLGA, 12 x 20 x 1.47 (8DP)
Mark Die nCE RnB IO Channels C8 = 52-pad WLGA, 14 x 18 x 0.75 (DDP/QDP)
A1 1 H1 = 100-ball VBGA (Pb-free), 12 x 18 x 1.0
B1 1 H2 = 100-ball TBGA (Pb-free), 12 x 18 x 1.2
C2 1 H3 = 100-ball LBGA, (Pb-free) 12 x 18 x 1.4 (DDP/QDP/8DP)
D2 1 H4 = 63-ball VFBGA, 9 x 11 x 1
E2 2
F2 1 Interface
GMark Interface
H4 1 A Async only
J4 1 B Sync/Async
K4 2 D SPI
L4 1
M4 42 Generation Feature Set
N4 + 4 1 A = 1st set of device features
P8 1 B = 2nd set of device features (rev only if different than 1st set)
Q8 1 C = 3rd set of device features (rev only if different)
R8 2 D = 4th set of device features (rev only if different)
T8 1 etc.
U8 2
VOperating Voltage Range
WA = 3.3V (2.70–3.60V)
YB = 1.8V (1.70–1.95V)
C = 3.3V (2.70–3.60V), VccQ 1.8V (1.70–1.95V)
D = 1.8V (1.65–3.6V) SIM
*Contact Micron for help differentiating between standard and next-generation NAND offerings.
Rev. 8/19/09
00
11
11
00
22
22
2 + 2 2 + 2
4
4
4
22
2
11
2
22
4
44
4
1
22
1
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Products and specifications are subject to change without notice. Dates are estimates only.