1. Product profile
1.1 General description
10W plastic LDMOS power transistor for base station applications at frequencies from
700 MHz to 2700 MHz.
[1] Test signal: 2-carrier W-CDMA; carrier spacing = 5 MHz; PAR = 8.4 dB at 0.01 % probability on CCDF;
RF performance at VDS = 28 V; IDq = 110 mA.
1.2 Features and benefits
High efficiency
Excellent ruggedness
Designed for broadband operation
Excellent thermal stability
High power gain
Integrated ESD protection
Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances
(RoHS)
1.3 Applications
CDMA
W-CDMA
GSM EDGE
MC-GSM
LTE
WiMAX
BLP7G22-10
LDMOS driver transistor
Rev. 3 — 1 September 2015 Product data sheet
Table 1. Application performance (multiple frequencies)
Ty pical RF performance at Tcase =25
C; IDq = 110 mA; in a class-AB application circuit.
Test signal f IDq VDS PL(AV) GpDACPR5M
(MHz) (mA) (V) (W) (dB) (%) (dBc)
Pulsed CW 2700 110 28 2 14.5 26 -
1-carrier W-CDMA 748 110 28 0.7 27.5 13.5 43 [1]
748 110 28 2 27.5 25 40
2-carrier W-CDMA 2140 110 28 0.7 17.4 13 51
2140 110 28 2 17.4 25 40
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Product data sheet Rev. 3 — 1 September 2015 2 of 15
BLP7G22-10
LDMOS driver transistor
2. Pinning information
[1] To be used in single ended applications only.
3. Ordering information
4. Limiting values
Table 2. Pinning
Pin Description Simplified outline Graphic symbol [1]
1, 6, 7, 12 n.c.
2, 3, 4, 5 gate
8, 9, 10, 11 drain
exposed die-pad source
Transparent top view
1
12 7
6
4, 5
2, 3 exposed
die-pad
10, 11
8, 9
aaa-007804
Table 3. Ordering information
Type number Package
Name Description Version
BLP7G22-10 HVSON12 plastic thermal enhanced very thin small outline
package; no leads; 12 terminals; body 6 4 0.85 mm
SOT1179-2
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDS drain-source voltage - 65 V
VGS gate-source voltage 0.5 +13 V
Tstg storage temperature 65 +150 C
Tjjunction temperature - 150 C
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Product data sheet Rev. 3 — 1 September 2015 3 of 15
BLP7G22-10
LDMOS driver transistor
5. Recommended operating conditions
See application note AN11198 for more details.
6. Thermal characteristics
7. Characteristics
Fig 1. Recommended operating area; case temperature as a function of power
dissipation
aaa-007805
2 3 4 5 6 7 8 9 10
50
70
90
110
130
150
P (W)
Tcasecase
Tcase
(°C)(°C)(°C)
Table 5. Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-c) thermal resistance from junction to case Tcase =70C; PL=2W 3.2 K/W
Table 6. DC characteristics
Tj = 25
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
V(BR)DSS drain-source breakdown voltage VGS =0V; I
D=0.18mA 65 - - V
VGS(th) gate-source threshold voltage VDS =10 V; I
D=18mA 1.5 1.9 2.3 V
IDSS drain leakage current VGS =0V; V
DS =28V 1.4 - +1.4 A
IDSX drain cut-off current VGS =V
GS(th) + 3.75 V - 3.2 - A
IGSS gate leakage current VGS =11V; V
DS = 0 V - - 140 nA
gfs forward transconductance VDS =10V; I
D= 18 mA - 160 - mS
RDS(on) drain-source on-state resistance VGS =V
GS(th) + 3.75 V;
VDS =10V; I
D= 630 mA
- 1000 - m
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Product data sheet Rev. 3 — 1 September 2015 4 of 15
BLP7G22-10
LDMOS driver transistor
8. Application information
8.1 Frequency band 2110 MHz to 2170 MHz
8.1.1 Application circuit
Table 7. RF characteristics
Test signal: 1-tone pulsed; tp = 50
s;
= 10 %; f = 2140 MHz; RF performance at VDS =28V;
IDq =110 mA; T
case =25
C; unless otherwise specified, in a production circuit.
Symbol Parameter Conditions Min Typ Max Unit
Gppower gain PL(AV) = 2 W 15 16 - dB
Ddrain efficiency PL(AV) =2W 20 23 - %
PL(1dB) output power at 1 dB
gain compression
11 - - W
RLin input return loss PL(AV) =2W - 16 12 dB
The used Printed-Circuit Board (PCB) material is Rogers RO4350; thickness = 0.762 mm; r = 3.5;
thickness copper plating is 35 m.
See Table 8 for list of components.
Fig 2. Component layout
Table 8. List of components
See Figure 2 for component layout.
The used Printed-Circuit Board (PCB) material is Rogers RO4 350; thickness = 0.762 mm;
r = 3.5;
thickness copper plating is 35
m.
Component Description Value Remarks
C1, C4, C10, C13 multilayer ceramic chip capacitor 22 pF [1]
C2, C12 multilayer ceramic chip capacitor 1 F[2]
C3, C11 multilayer ceramic chip capacitor 100 nF [3]
C5, C9 multilayer ceramic chip capacitor 10 F; 50 V [4]
C6 multilayer ceramic chip capacitor 2.8 pF [1]
BLP7G22S-10
2010 to 2170 MHz
RO4350 / 30 mil
C9C5
C13
C8
C7
C6
C1
R1
Q1
C10
C11
C12
C2 C3
C4
aaa-007806
INPUT OUTPUT
GNDGND
BIAS DRAIN
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Product data sheet Rev. 3 — 1 September 2015 5 of 15
BLP7G22-10
LDMOS driver transistor
[1] American Technical Ceramics type 100A or capacitor of same quality.
[2] Murata GRM31MR71H105KA88L or capacitor of same quality.
[3] Murata GRM21BR71H104KA01L or capacitor of same quality.
[4] Murata GRM32ER71H106KA88L or capacitor of same quality.
8.1.2 Graphs
8.1.2.1 Pulsed CW
C7 multilayer ceramic chip capacitor 3.9 pF [1]
C8 multilayer ceramic chip capacitor 1.7 pF [1]
R1 chip resistor 10 SMD 0805; 1 % tolerance
Table 8. List of components …continued
See Figure 2 for component layout.
The used Printed-Circuit Board (PCB) material is Rogers RO4 350; thickness = 0.762 mm;
r = 3.5;
thickness copper plating is 35
m.
Component Description Value Remarks
VDS = 28 V; IDq =110mA; T
case = 25 C; = 10 %;
tp=20s.
(1) Gp at f = 2110 MHz
(2) Gp at f = 2140 MHz
(3) Gp at f = 2170 MHz
(4) D at f = 2110 MHz
(5) D at f = 2140 MHz
(6) D at f = 2170 MHz
VDS = 28 V; f = 2140 MHz; Tcase = 25 C; = 10 %;
tp=20s.
(1) Gp at IDq = 90 mA
(2) Gp at IDq = 110 mA
(3) Gp at IDq = 130 mA
(4) D at IDq = 90 mA
(5) D at IDq = 110 mA
(6) D at IDq = 130 mA
Fig 3. Power gain and drain efficiency as function of
load power; typical values
Fig 4. Power gain and drain efficiency as function of
load power; typical values
aaa-007807
0 4 8 12 16 20
00
515
10 30
15 45
20 60
PL (W)
Gp
Gp
(dB)(dB)(dB)
ηD
ηD
(%)(%)(%)
(2)(2)(2)
(1)(1)(1)
(3)(3)(3)
(6)(6)(6)
(5)(5)(5)
(4)(4)(4)
aaa-007808
0 2 4 6 8 10 12 14
14 0
15 10
16 20
17 30
18 40
19 50
20 60
PL (W)
Gp
Gp
(dB)(dB)(dB)
ηD
ηD
(%)(%)(%)
(6)(6)(6)
(5)(5)(5)
(4)(4)(4)
(3)(3)(3)
(2)(2)(2)
(1)(1)(1)
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Product data sheet Rev. 3 — 1 September 2015 6 of 15
BLP7G22-10
LDMOS driver transistor
VDS = 28 V; IDq = 110 mA; f = 2140 MHz; = 10 %; tp = 20 s.
(1) Gp at Tcase = 37 C
(2) Gp at Tcase = 25 C
(3) Gp at Tcase = 85 C
(4) D at Tcase = 37 C
(5) D at Tcase = 25 C
(6) D at Tcase = 85 C
Fig 5. Power gain and drain efficiency as function of load power; typical values
aaa-007809
0 4 8 12 16 20
00
515
10 30
15 45
20 60
PL (W)
Gp
Gp
(dB)(dB)(dB)
ηD
ηD
(%)(%)(%)
(1)(1)(1)
(2)(2)(2)
(3)(3)(3)
(4)(4)(4)
(5)(5)(5)
(6)(6)(6)
BLP7G22-10#3 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 3 — 1 September 2015 7 of 15
BLP7G22-10
LDMOS driver transistor
8.1.2.2 2-Carrier W-CDMA
VDS = 28 V; IDq =110mA; T
case = 25 C;
carrier spacing = 5 MHz; 46 % clipping; PAR = 8.4 dB at
0.01 % probability on CCDF.
(1) Gp at f = 2110 MHz
(2) Gp at f = 2140 MHz
(3) Gp at f = 2170 MHz
(4) D at f = 2110 MHz
(5) D at f = 2140 MHz
(6) D at f = 2170 MHz
VDS = 28 V; IDq =110mA; T
case = 25 C;
carrier spacing = 5 MHz; 46 % clipping; PAR = 8.4 dB at
0.01 % probability on CCDF.
(1) f = 2110 MHz
(2) f = 2140 MHz
(3) f = 2170 MHz
Fig 6. Power gain and drain efficiency as function of
load power; typical values
Fig 7. Adjacent channel power ratio (5 MHz) as a
function of load power; typical values
aaa-007810
0 1 2 3 4 5 6 7
10 0
12 10
14 20
16 30
18 40
20 50
PL (W)
Gp
Gp
(dB)(dB)(dB)
ηD
ηD
(%)(%)(%)
(1)(1)(1)
(2)(2)(2)
(3)(3)(3)
(4)(4)(4)
(5)(5)(5)
(6)(6)(6)
aaa-007811
0 1 2 3 4 5 6 7
-60
-50
-40
-30
-20
-10
0
PL (W)
ACPR
ACPR5M5M
ACPR5M
(dBc)(dBc)(dBc)
(2)(2)(2)
(1)(1)(1)
(3)(3)(3)
BLP7G22-10#3 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 3 — 1 September 2015 8 of 15
BLP7G22-10
LDMOS driver transistor
8.2 Frequency band 728 MHz to 768 MHz
8.2.1 Application circuit
VDS = 28 V; IDq = 110 mA; f = 2140 MHz; carrier spacing = 5 MHz; 46 % clipping; PAR = 8.4 dB at
0.01 % probability on CCDF.
(1) Tcase = 37 C
(2) Tcase = 25 C
(3) Tcase = 85 C
Fig 8. Adjacent channel power ratio (5 MHz) as a function of load power; typical values
aaa-007812
0 1 2 3 4 5 6 7
-60
-50
-40
-30
-20
-10
0
PL (W)
ACPR
ACPR5M5M
ACPR5M
(dBc)(dBc)(dBc)
(3)(3)(3)
(2)(2)(2)
(1)(1)(1)
The used Printed-Circuit Board (PCB) material is Rogers RO4350; thickness = 0.762 mm; r = 3.5;
thickness copper plating is 35 m.
See Table 9 for list of components.
Fig 9. Component layout
aaa-007813
BLP7G22S-10
728 to 768 MHz
RO4350 / 30 mil
INPUT OUTPUT
GND
Q1
R1
C2C1
C3 C10
C9
C12 C11
C4 C5 C8
HL
BIAS DRAIN
GND
C6 C7
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Product data sheet Rev. 3 — 1 September 2015 9 of 15
BLP7G22-10
LDMOS driver transistor
[1] American Technical Ceramics type 100A or capacitor of same quality.
[2] Murata GRM21BR71H104KA01L or capacitor of same quality.
[3] Murata GRM32ER71H106KA88L or capacitor of same quality.
8.2.2 Graphs
8.2.2.1 2-Carrier W-CDMA
Table 9. List of components
See Figure 9 for component layout.
The used Printed-Circuit Board (PCB) material is Rogers RO4 350; thickness = 0.762 mm;
r = 3.5;
thickness copper plating is 35
m.
Component Description Value Remarks
C1, C12 multilayer ceramic chip capacitor 68 pF [1]
C2 multilayer ceramic chip capacitor 10 pF [1]
C3, C10 multilayer ceramic chip capacitor 100 pF [1]
C4, C9 multilayer ceramic chip capacitor 100 nF [2]
C5, C8 multilayer ceramic chip capacitor 10 F; 50 V [3]
C6 multilayer ceramic chip capacitor 36 pF [1]
C7 multilayer ceramic chip capacitor 9.1 pF [1]
C11 multilayer ceramic chip capacitor 7.5 pF [1]
R1 chip resistor 5.1 SMD 0805; 1 % tolerance
VDS = 28 V; IDq =110mA; T
case = 25 C;
carrier spacing = 5 MHz; 46 % clipping; PAR = 8.4 dB at
0.01 % probability on CCDF.
(1) f = 728 MHz
(2) f = 748 MHz
(3) f = 768 MHz
VDS = 28 V; IDq =110mA; T
case = 25 C;
carrier spacing = 5 MHz; 46 % clipping; PAR = 8.4 dB at
0.01 % probability on CCDF.
(1) f = 728 MHz
(2) f = 748 MHz
(3) f = 768 MHz
Fig 10. Power gain and drain efficiency as function of
load power; typical values
Fig 11. Adjacent channel power ratio (5 MHz) as a
function of load power; typical values
aaa-007814
0 0.5 1 1.5 2 2.5 3
13 0
16 6
19 12
22 18
25 24
28 30
31 36
PL (W)
Gp
Gp
(dB)(dB)(dB)
ηD
ηD
(%)(%)(%)
(1)(1)(1)
(2)(2)(2)
(3)(3)(3)
(1)(1)(1)
(2)(2)(2)
(3)(3)(3)
Gp
Gp
ηD
ηD
aaa-007815
0 0.5 1 1.5 2 2.5 3
-50
-40
-30
-20
-10
0
PL (W)
ACPR
ACPR5M5M
ACPR5M
(dBc)(dBc)(dBc)
(1)(1)(1)
(2)(2)(2)
(3)(3)(3)
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Product data sheet Rev. 3 — 1 September 2015 10 of 15
BLP7G22-10
LDMOS driver transistor
9. Test information
9.1 Ruggedness in class-AB operation
The BLP7G22-10 is capable of withstanding a load mismatch corresponding to
VSWR = 10 : 1 through all phases under the following conditions: VDS =28V;
IDq =110mA; P
L= 10 W; frequency from 700 MHz to 2700 MHz.
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Product data sheet Rev. 3 — 1 September 2015 11 of 15
BLP7G22-10
LDMOS driver transistor
10. Package outline
Fig 12. Package outline SOT1179-2 (HVSON12)
References
Outline
version
European
projection Issue date
IEC JEDEC JEITA
SOT1179-2 - - -
MO-229
- - -
sot1179-2_po
13-02-26
13-07-16
Unit
mm
max
nom
min
1.00
0.85
0.80
0.05
0.03
0.00
0.2
6.1
6.0
5.9
5.2
5.1
5.0
4.1
4.0
3.9
0.8 4 0.1
A
Dimensions (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
HVSON12: plastic thermal enhanced very thin small outline package; no leads;
12 terminals; body 4 x 6 x 0.85 mm SOT1179-2
A1b
0.35
0.30
0.25
cD
(1) DhE(1) Eh
2.2
2.1
2.0
ee
1L
0.5
0.4
0.3
K
0.5
vw
0.05
y
0.05
y1
0.1
0 2.5 5 mm
scale
C
y
C
y1
X
B A
terminal 1
index area
D
E
detail X
AA1
c
Dh
Eh
L
b
K
e1
e
1/2 e
ACBv
Cw
terminal 1
index area
6
7
1
12
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Product data sheet Rev. 3 — 1 September 2015 12 of 15
BLP7G22-10
LDMOS driver transistor
11. Handling information
12. Abbreviations
13. Revision history
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
Table 10. Abbreviations
Acronym Description
3GPP 3rd Generation Partnership Project
CCDF Complementary Cumulative Distribution Function
CDMA Code Division Multiple Access
CW Continuous Wave
DPCH Dedicated Physical CHannel
EDGE Enhanced Data rates for GSM Evolution
ESD ElectroStatic Discharge
GSM Global System for Mobile Communication
LDMOS Laterally Diffused Metal-Oxide Semiconductor
LTE Long Term Evolution
MC-GSM Multi Carrier GSM
PAR Peak-to-Average Ratio
SMD Surface Mounted Device
VSWR Voltage Standing-Wave Ratio
W-CDMA Wideband Code Division Multiple Access
WiMAX Worldwide Interoperability for Microwave Access
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BLP7G22-10#3 20150901 Product data sheet BLP7G22-10 v.2
Modifications: The format of this document has been redesigned to comply with the new identity guidelines
of Ampleon.
Legal texts have been adapted to the new company name where appropriate.
BLP7G22-10 v.2 20130530 Product data sheet - BLP7G22-10 v.1
BLP7G22-10 v.1 20120213 Objective data sheet - -
BLP7G22-10#3 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 3 — 1 September 2015 13 of 15
BLP7G22-10
LDMOS driver transistor
14. Legal information
14.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.ampleon.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Ampleon does not give any representations or
warranties as to the accuracy or completeness of information included herein
and shall have no liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Ampleon sales office. In
case of any inconsistency or conflict with the short data sheet, the full data
sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
Ampleon and its customer, unless Ampleon and customer have explicitly
agreed otherwise in writing. In no event however, shall an agreement be valid
in which the Ampleon product is deemed to offer functions and qualities
beyond those described in the Product data sheet.
14.3 Disclaimers
Limited warranty and liabilityInformation in this document is believed to
be accurate and reliable. However, Ampleon does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. Ampleon takes no responsibility for
the content in this document if provided by an information source outside of
Ampleon.
In no event shall Ampleon be liable for any indirect, incidental, punitive,
special or consequential damages (including - without limitation - lost profits,
lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, Ampleon’ aggregate and cumulative liability towards customer
for the products described herein shall be limited in accordance with the
Terms and conditions of commercial sale of Ampleon.
Right to make changes — Ampleon reserves the right to make changes to
information published in this document, including without limitation
specifications and product descriptions, at any time and without notice. This
document supersedes and replaces all information supplied prior to the
publication hereof.
Suitability for use — Ampleon products are not designed, authorized or
warranted to be suitable for use in life support, life-critical or safety-critical
systems or equipment, nor in applications where failure or malfunction of an
Ampleon product can reasonably be expected to result in personal injury,
death or severe property or environmental damage. Ampleon and its
suppliers accept no liability for inclusion and/or use of Ampleon products in
such equipment or applications and therefore such inclusion and/or use is at
the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Ampleon makes no representation
or warranty that such applications will be suitable for the specified use without
further testing or modification.
Customers are responsible for the design and operation of their applications
and products using Ampleon products, and Ampleon accepts no liability for
any assistance with applications or customer product design. It is customer’s
sole responsibility to determine whether the Ampleon product is suitable and
fit for the customer’s applications and products planned, as well as for the
planned application and use of customer’s third party customer(s). Customers
should provide appropriate design and operating safeguards to minimize the
risks associated with their applications and products.
Ampleon does not accept any liability related to any default, damage, costs or
problem which is based on any weakness or default in the customer’s
applications or products, or the application or use by customer’s third party
customer(s). Customer is responsible for doing all necessary testing for the
customer’s applications and products using Ampleon products in order to
avoid a default of the applications and the products or of the application or
use by customer’s third party customer(s). Ampleon does not accept any
liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — Ampleon products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.ampleon.com/terms, unless otherwise agreed in a valid written
individual agreement. In case an individual agreement is concluded only the
terms and conditions of the respective agreement shall apply. Ampleon
hereby expressly objects to applying the customer’s general terms and
conditions with regard to the purchase of Ampleon products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
BLP7G22-10#3 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 3 — 1 September 2015 14 of 15
BLP7G22-10
LDMOS driver transistor
Non-automotive qualified products — Unless this data sheet expressly
states that this specific Ampleon product is automotive qualified, the product
is not suitable for automotive use. It is neither qualified nor tested in
accordance with automotive testing or application requirements. Ampleon
accepts no liability for inclusion and/or use of non-automotive qualified
products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without Ampleon’ warranty of the product for such
automotive applications, use and specifications, and (b) whenever customer
uses the product for automotive applications beyond Ampleon’ specifications
such use shall be solely at customer’s own risk, and (c) customer fully
indemnifies Ampleon for any liability, damages or failed product claims
resulting from customer design and use of the product for automotive
applications beyond Ampleon’ standard warranty and Ampleon’ product
specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Any reference or use of any ‘NXP’ trademark in this document or in or on the
surface of Ampleon products does not result in any claim, liability or
entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of
the NXP group of companies and any reference to or use of the ‘NXP’
trademarks will be replaced by reference to or use of Ampleon’s own Any
reference or use of any ‘NXP’ trademark in this document or in or on the
surface of Ampleon products does not result in any claim, liability or
entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of
the NXP group of companies and any reference to or use of the ‘NXP’
trademarks will be replaced by reference to or use of Ampleon’s own
trademarks.
15. Contact information
For more information, please visit:
http://www.ampleon.com
For sales office addresses, please visit:
http://www.ampleon.com/sales
BLP7G22-10
LDMOS driver transistor
© Ampleon The Netherlands B.V. 2015. All rights reserved.
For more information, please visit: http://www.ampleon.com
For sales office addresses, please visit: http://www.ampleon.com/sales
Date of release: 1 September 2015
Document identifier: BLP7G22-10#3
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
16. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Recommended operating conditions. . . . . . . . 3
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3
7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Application information. . . . . . . . . . . . . . . . . . . 4
8.1 Frequency band 2110 MHz to 2170 MHz . . . . . 4
8.1.1 Application circuit . . . . . . . . . . . . . . . . . . . . . . . 4
8.1.2 Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8.1.2.1 Pulsed CW . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8.1.2.2 2-Carrier W-CDMA . . . . . . . . . . . . . . . . . . . . . . 7
8.2 Frequency band 728 MHz to 768 MHz . . . . . . . 8
8.2.1 Application circuit . . . . . . . . . . . . . . . . . . . . . . . 8
8.2.2 Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
8.2.2.1 2-Carrier W-CDMA . . . . . . . . . . . . . . . . . . . . . . 9
9 Test information. . . . . . . . . . . . . . . . . . . . . . . . 10
9.1 Ruggedness in class-AB operation . . . . . . . . 10
10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
11 Handling information. . . . . . . . . . . . . . . . . . . . 12
12 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12
14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
14.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
14.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
14.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
14.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
15 Contact information. . . . . . . . . . . . . . . . . . . . . 14
16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
NXP:
BLP7G22-10Z