Order Now Product Folder Support & Community Tools & Software Technical Documents Reference Design LM78M05-MIL SNVSAX6 - JUNE 2017 LM78M05-MIL Series 3-Terminal 500-mA Positive Voltage Regulator 1 Features 3 Description * * * * * * The LM78M05-MIL three-pin positive voltage regulator employs built-in current limiting, thermal shutdown, and safe-operating area protection, which makes them virtually immune to damage from output overloads. 1 * Output Current in Excess of 0.5 A No External Components Internal Thermal Overload Protection Internal Short Circuit Current-Limiting Output Transistor Safe-Area Compensation Available in 3-Pin TO-220, TO-252, and TO packages Output Voltage: 5 V With adequate heat sinking, they can deliver in excess of 0.5-A output current. Typical applications would include local (on-card) regulators which can eliminate the noise and degraded performance associated with single-point regulation. 2 Applications * * * * * Device Information(1) Electronic Point-of-Sale Medical and Health Fitness Applications Printers Appliances and White Goods TVs and Set-Top Boxes PART NUMBER LM78M05 BODY SIZE (NOM) TO-220 (3) 10.16 mm x 14.986 mm TO-252 (3) 6.10 mm x 6.58 mm TO (3) 9.14 mm x 9.14 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Available Packages Pin 1. Input 2. Ground 3. Output Tab/Case is Ground PACKAGE Simplified Application 1 LM78M05-MIL 2 3 TO TO-220 VIN IN OUT VOUT GND 1 2 3 TO-252 1 2 3 Copyright (c) 2017, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM78M05-MIL SNVSAX6 - JUNE 2017 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 6.1 6.2 6.3 6.4 6.5 3 3 4 4 5 Absolute Maximum Ratings ...................................... Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. 8 8.1 Application Information............................................ 10 8.2 Typical Application .................................................. 10 9 Power Supply Recommendations...................... 11 10 Layout................................................................... 11 10.1 Layout Guidelines ................................................. 11 10.2 Layout Example .................................................... 12 10.3 Thermal Considerations ........................................ 12 11 Device and Documentation Support ................. 15 11.1 11.2 11.3 11.4 11.5 11.6 Detailed Description .............................................. 7 7.1 7.2 7.3 7.4 Overview ................................................................... Functional Block Diagram ......................................... Feature Description................................................... Device Functional Modes.......................................... Application and Implementation ........................ 10 7 8 9 9 Documentation Support ........................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 15 15 15 15 15 15 12 Mechanical, Packaging, and Orderable Information ........................................................... 15 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. 2 DATE REVISION NOTES June 2017 * Initial release. Submit Documentation Feedback Copyright (c) 2017, Texas Instruments Incorporated Product Folder Links: LM78M05-MIL LM78M05-MIL www.ti.com SNVSAX6 - JUNE 2017 5 Pin Configuration and Functions NDE Package 3-Pin TO-220 Top View NDP Package 3-Pin TO-252 Top View NDT Package 3-Pin TO Top View Pin Functions PIN NAME NO. I/O DESCRIPTION TO-220 TO-252 TO 2/TAB 2/TAB 3 INPUT 1 1 1 I Input OUTPUT 2 2 2 O Output GND -- Tab is GND 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN Input voltage 5 V VO 15 V Power dissipation Lead temperature (Soldering, 10 s) MAX UNIT 35 V Internally limited TO package (NDT) 300 TO-220 package (NDE) 260 C Operating junction temperature -40 125 C Storage temperature, Tstg -65 150 C (1) (2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. 6.2 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) Input voltage Output current MIN MAX VOUT + 1.8 35 V 0.5 A Submit Documentation Feedback Copyright (c) 2017, Texas Instruments Incorporated Product Folder Links: LM78M05-MIL UNIT 3 LM78M05-MIL SNVSAX6 - JUNE 2017 www.ti.com 6.3 Thermal Information LM78M05 THERMAL METRIC (1) NDP (TO-252) NDT (TO) 3 PINS 3 PINS UNIT RJA Junction-to-ambient thermal resistance 38 162.4 C/W RJC(top) Junction-to-case (top) thermal resistance 48.4 23.9 C/W RJB Junction-to-board thermal resistance 17.7 -- C/W JT Junction-to-top characterization parameter 6.7 -- C/W JB Junction-to-board characterization parameter 17.9 -- C/W RJC(bot) Junction-to-case (bottom) thermal resistance 4.4 -- C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Electrical Characteristics VIN = 10 V, CIN = 0.33 F, CO = 0.1 F, TJ = 25C (unless otherwise noted). Limits are specified by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. PARAMETER TEST CONDITIONS IL = 500 mA VO VRLINE Output voltage Line regulation 5 mA IL 500 mA, PD 7.5 W, 7.5 V VIN 20 V, -40C TJ 125C 7.2 V VIN 25 V VRLOAD Load regulation IL = 5 mA to 500 mA IQ Quiescent current IL = 500 mA MIN TYP MAX 4.8 5 5.2 4.75 5 5.25 IL = 100 mA 50 IL = 500 mA 100 UNIT V mV 4 5 mA IL 500 mA, 100 mV 10 mA 0.5 IQ Quiescent current change Vn Output noise voltage 10 Hz f 100 kHz 40 V VIN Ripple rejection f = 120 Hz, IL = 500 mA 78 dB VIN Input voltage required to maintain line regulation IL = 500 mA VO Long-term stability IL = 500 mA, -40C TJ 125C 4 7.5 V VIN 25 V, IL = 500 mA Submit Documentation Feedback 1 7.2 mA V 20 mV/khrs Copyright (c) 2017, Texas Instruments Incorporated Product Folder Links: LM78M05-MIL LM78M05-MIL www.ti.com SNVSAX6 - JUNE 2017 6.5 Typical Characteristics Figure 1. Peak Output Current Figure 2. Ripple Rejection Figure 3. Ripple Rejection Figure 4. Dropout Voltage Normalized to 1 V TJ = 25C Figure 5. Output Voltage Figure 6. Quiescent Current Submit Documentation Feedback Copyright (c) 2017, Texas Instruments Incorporated Product Folder Links: LM78M05-MIL 5 LM78M05-MIL SNVSAX6 - JUNE 2017 www.ti.com Typical Characteristics (continued) 6 Figure 7. Quiescent Current Figure 8. Output Impedance Figure 9. Line Transient Response Figure 10. Load Transient Response Submit Documentation Feedback Copyright (c) 2017, Texas Instruments Incorporated Product Folder Links: LM78M05-MIL LM78M05-MIL www.ti.com SNVSAX6 - JUNE 2017 7 Detailed Description 7.1 Overview The LM78M05-MIL device is a fixed positive voltage regulators. It can accept up to 35 V at the input and regulate it down to outputs of 5 V, 12 V, or 15 V. The device is capable of supplying up to 500 mA of output current, although it is important to ensure an adequate amount of heat sinking to avoid exceeding thermal limits. However, in the case of accidental overload the device has built in current limiting, thermal shutdown and safeoperating area protection to prevent damage from occurring. Submit Documentation Feedback Copyright (c) 2017, Texas Instruments Incorporated Product Folder Links: LM78M05-MIL 7 LM78M05-MIL SNVSAX6 - JUNE 2017 www.ti.com 7.2 Functional Block Diagram 8 Submit Documentation Feedback Copyright (c) 2017, Texas Instruments Incorporated Product Folder Links: LM78M05-MIL LM78M05-MIL www.ti.com SNVSAX6 - JUNE 2017 7.3 Feature Description The LM78M05-MIL fixed voltage regulator has built-in thermal overload protection which prevents the device from being damaged due to excessive junction temperature. The regulator also contains internal short-circuit protection which limits the maximum output current, and safearea protection for the pass transistor which reduces the short-circuit current as the voltage across the pass transistor is increased. Although the internal power dissipation is automatically limited, the maximum junction temperature of the device must be maintained below 125C to meet data sheet specifications. An adequate heat sink must be provided to assure this limit is not exceeded under worst-case operating conditions (maximum input voltage and load current) if reliable performance is to be obtained. 7.4 Device Functional Modes 7.4.1 Normal Operation The device OUTPUT pin sources current necessary to make the voltage at the OUTPUT pin equal to the fixed voltage level of the device. 7.4.2 Operation With Low Input Voltage The device requires up to 2-V headroom (VIN - VOUT) to operate in regulation. With less headroom, the device may drop out of regulation in which the OUTPUT voltage would equal INPUT voltage minus dropout voltage. 7.4.3 Operation in Self Protection When an overload occurs, the device shuts down Darlington NPN output stage or reduce the output current to prevent device damage. The device automatically resets from the overload. The output may be reduced or alternate between on and off until the overload is removed. Submit Documentation Feedback Copyright (c) 2017, Texas Instruments Incorporated Product Folder Links: LM78M05-MIL 9 LM78M05-MIL SNVSAX6 - JUNE 2017 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The LM78M05-MIL device is a fixed voltage regulator that needs no external feedback resistors in order to set the output voltage. Input. Output capacitors are not required for the device to be stable. However, input capacitance helps filter noise from the supply and output capacitance improves the transient response. 8.2 Typical Application LM78M05-MIL IN VIN 0.33 PF OUT GND VOUT 0.1 PF Copyright (c) 2017, Texas Instruments Incorporated CIN required if regulator input is more than 4 inches from input filter capacitor (or if no input filter capacitor is used). COUT is optional for improved transient response. Figure 11. Typical Application 8.2.1 Design Requirements For this design example, use the parameters listed in Table 1 as the input parameters. Table 1. Design Parameters PARAMETER VALUE CIN 0.33 F COUT 0.1 F 8.2.2 Detailed Design Procedure 8.2.2.1 Input Voltage Regardless of the output voltage option being used (5 V, 12 V, 15 V), the input voltage must be at least 2 V greater to ensure proper regulation (7 V, 14 V, 17 V). 8.2.2.2 Output Current Depending on the input-output voltage differential, the output current must be limited to ensure maximum power dissipation is not exceeded. The graph in Figure 1 shows the appropriate current limit for a variety of conditions. 8.2.2.3 Input Capacitor If no power supply filter capacitor is used or if the device is placed more than four inches away from the capacitor of the power supply, an additional capacitor placed at the input pin of the device helps bypass noise. 10 Submit Documentation Feedback Copyright (c) 2017, Texas Instruments Incorporated Product Folder Links: LM78M05-MIL LM78M05-MIL www.ti.com SNVSAX6 - JUNE 2017 8.2.2.4 Output Capacitor This device is designed to be stable with no output capacitance and can be omitted from the design if needed. However if large changes in load are expected, an output capacitor is recommended to improve the transient response. 8.2.3 Application Curves Figure 12. RJA vs 2-oz Copper Area for PFM Figure 13. Maximum Allowable Power Dissipation vs Ambient Temperature for PFM Figure 14. Maximum Allowable Power Dissipation vs 2-oz Copper Area for PFM 9 Power Supply Recommendations The LM78M05-MIL device is designed to operate from an input voltage supply range between VOUT + 2 V to 35 V. If the device is more than four inches from the power supply filter capacitors, an input bypass capacitor 0.1-F or greater of any type is recommended. 10 Layout 10.1 Layout Guidelines Follow these layout guidelines to ensure proper regulation of the output voltage with minimum noise. TI recommends that the input terminal be bypassed to ground with a bypass capacitor. The optimum placement is closest to the input terminal of the device and the system GND. Take care to minimize the loop area formed by the bypass-capacitor connection, the input terminal, and the system GND. Traces carrying the load current must be wide to reduce the amount of parasitic trace inductance. In cases when VIN shorts to ground, an external diode must be placed from VOUT to VIN to divert the surge current from the output capacitor and protect the device. This diode must be placed close to the corresponding device pins to increase their effectiveness. Submit Documentation Feedback Copyright (c) 2017, Texas Instruments Incorporated Product Folder Links: LM78M05-MIL 11 LM78M05-MIL SNVSAX6 - JUNE 2017 www.ti.com 10.2 Layout Example Figure 15. Layout Recommendation 10.3 Thermal Considerations When an integrated circuit operates with appreciable current, its junction temperature is elevated. It is important to quantify its thermal limits to achieve acceptable performance and reliability. This limit is determined by summing the individual parts consisting of a series of temperature rises from the semiconductor junction to the operating environment. A one-dimension steady-state model of conduction heat transfer is demonstrated in Figure 16. The heat generated at the device junction flows through the die to the die attach pad, through the lead frame to the surrounding case material, to the printed-circuit board, and eventually to the ambient environment. There are several variables that may affect the thermal resistance and in turn the need for a heat sink, which includes the following. Component variables (RJC) * Leadframe size and material * Number of conduction pins * Die size * Die attach material * Molding compound size and material Application variables (RCA) * Mounting pad size, material, and location * Placement of mounting pad * PCB size and material * Traces length and width * Adjacent heat sources * Volume of air * Ambient temperature * Shape of mounting pad The case temperature is measured at the point where the leads contact the mounting pad surface Figure 16. Cross-Sectional View of Integrated Circuit Mounted on a Printed-Circuit Board 12 Submit Documentation Feedback Copyright (c) 2017, Texas Instruments Incorporated Product Folder Links: LM78M05-MIL LM78M05-MIL www.ti.com SNVSAX6 - JUNE 2017 Thermal Considerations (continued) The LM78M05-MIL regulator has internal thermal shutdown to protect the device from overheating. Under all possible operating conditions, the junction temperature of the device must be within the range of 0C to 125C. A heat sink may be required depending on the maximum power dissipation and maximum ambient temperature of the application. To determine if a heat sink is needed, the power dissipated by the regulator (PD) is calculated using Equation 1. IIN = IL + IG PD = (VIN - VOUT) x IL + (VIN x IG) (1) (2) Figure 17 shows the voltages and currents which are present in the circuit. LM78M05-MIL IIN IN VIN VOUT OUT IL GND IG Load Copyright (c) 2017, Texas Instruments Incorporated Figure 17. Power Dissipation Diagram Use to calculate the maximum allowable temperature rise, TR(max). TR(max) = TJ(max) - TA(max) where * * TJ(max) is the maximum allowable junction temperature (125C) TA(max) is the maximum ambient temperature encountered in the application Using the calculated values for TR(max) and PD, the maximum allowable value for the junction-to-ambient thermal resistance (RJA) can be calculated with Equation 3. RJA = TR(max) / PD (3) As a design aid, Table 2 shows the value of the RJA of TO-252 for different heat sink area. The copper patterns that we used to measure these RJA are shown at the end of AN-1028 Maximum Power Enhancement Techniques for Power Packages (SNVA036). Figure 12 reflects the same test results as what are in the Table 2. Figure 13 shows the maximum allowable power dissipation versus ambient temperature for the PFM device. Figure 14 shows the maximum allowable power dissipation versus copper area (in2) for the TO-252 device. For power enhancement techniques to be used with TO-252 package, see AN-1028 Maximum Power Enhancement Techniques for Power Packages (SNVA036). Table 2. RJA Different Heat Sink Area TOP SIDE (1) BOTTOM SIDE TO-252 0.0123 0 103 1 (1) THERMAL RESISTANCE: RJA (C/W) COPPER AREA (in2) LAYOUT Tab of device is attached to topside copper. Submit Documentation Feedback Copyright (c) 2017, Texas Instruments Incorporated Product Folder Links: LM78M05-MIL 13 LM78M05-MIL SNVSAX6 - JUNE 2017 www.ti.com Thermal Considerations (continued) Table 2. RJA Different Heat Sink Area (continued) 14 THERMAL RESISTANCE: RJA (C/W) COPPER AREA (in2) LAYOUT TOP SIDE (1) BOTTOM SIDE TO-252 2 0.066 0 87 3 0.3 0 60 4 0.53 0 54 5 0.76 0 52 6 1 0 47 7 0 0.2 84 8 0 0.4 70 9 0 0.6 63 10 0 0.8 57 11 0 1 57 12 0.066 0.066 89 13 0.175 0.175 72 14 0.284 0.284 61 15 0.392 0.392 55 16 0.5 0.5 53 Submit Documentation Feedback Copyright (c) 2017, Texas Instruments Incorporated Product Folder Links: LM78M05-MIL LM78M05-MIL www.ti.com SNVSAX6 - JUNE 2017 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 Related Documentation For related documentation see the following: AN-1028 Maximum Power Enhancement Techniques for Power Packages (SNVA036) 11.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.5 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.6 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright (c) 2017, Texas Instruments Incorporated Product Folder Links: LM78M05-MIL 15 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) (3) Device Marking (4/5) (6) LM78M05CH ACTIVE TO NDT 3 500 RoHS & Green AU Level-1-NA-UNLIM -40 to 125 ( LM78M05CH, LM78M 05CH) LM78M05CH/NOPB ACTIVE TO NDT 3 500 RoHS & Green AU Level-1-NA-UNLIM -40 to 125 ( LM78M05CH, LM78M 05CH) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. 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