LMV712MMX - National Semiconductor

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FEATURES APPLICATIONS

DGS PACKAGE

(TOP VIEW)

2OUT

2SD

2IN−

1OUT

1IN–

1IN+

VCC+

2IN+

VCC–

1SD

DRC PACKAGE

(TOP VIEW)

2OUT

2SD

2IN−

1OUT

1IN–

1IN+

VCC+

2IN+

VCC–

1SD

DESCRIPTION/ORDERING INFORMATION

LMV712

LOW-POWER LOW-NOISE HIGH-OUTPUT RRIO DUAL OPERATIONAL AMPLIFIER

WITH INDEPENDENT SHUTDOWN

SLOS485–JANUARY 2006

•Power-Amplifier Control Loops

•5-MHz Gain Bandwidth Product

•Cellular Phones

•5-V/μs Slew Rate

•Portable Equipment

•Low Noise: 20 nV/√Hz

•Wireless LANs

•1.22-mA/Channel Supply Current •Radio Systems

•VOS < 3 mV Max •Cordless Phones

•Low Supply Voltage: 2.7 V to 5 V

•Rail-to-Rail Inputs and Outputs

•Unity Gain Stable

•1.5-μA Shutdown ICC

•2.2-μs Turn On

The LMV712 dual operational amplifier is a high-performance BiCMOS operational amplifier intended for

applications requiring rail-to-rail inputs, combined with speed and low noise. The device offers a bandwidth of

5 MHz, a slew rate of 5 V/μs, and operates with capacitive loads of up to 200 pF without oscillation.

The LMV712 offers two independent shutdown (1SD, 2SD) pins. This feature allows disabling of each device

separately and reduces the supply current to less than 1 μA typical. The output voltage rapidly and smoothly

ramps up with no glitch as the amplifier comes out of the shutdown mode.

The LMV712 is offered in the space-saving SON (DRC) package and in an MSOP (DGS) package. These

packages are designed to meet the demands of small size, low power, and low cost required by cellular phones

and similar battery-operated portable electronics.

ORDERING INFORMATION

TAPACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING

Reel of 2500 LMV712IDGSR

MSOP – DGS RNB

Reel of 250 LMV712IDGST

–40°Cto85°CReel of 3000 LMV712IDRCR

SON – DRC PREVIEW

Reel of 250 LMV712IDRCT

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

www.ti.com

−

IN−

IN+

OUT

IN−

IN+

VBIAS1

Class AB

Control OUT

VBIAS2

VCC+

BIAS

Control

VCC−

LMV712

LOW-POWER LOW-NOISE HIGH-OUTPUT RRIO DUAL OPERATIONAL AMPLIFIER

WITH INDEPENDENT SHUTDOWN

SLOS485–JANUARY 2006

SYMBOL (EACH AMPLIFIER)

SIMPLIFIED SCHEMATIC (EACH AMPLIFIER)

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Absolute Maximum Ratings(1)

ESD Protection

Recommended Operating Conditions

LMV712

LOW-POWER LOW-NOISE HIGH-OUTPUT RRIO DUAL OPERATIONAL AMPLIFIER

WITH INDEPENDENT SHUTDOWN

SLOS485–JANUARY 2006

over operating free-air temperature range (unless otherwise noted)

MIN MAX UNIT

VCC+ –V

CC– Supply voltage(2) 5.5 V

±Supply

VID Differential input voltage(3) V

voltage

VIInput voltage range (any input) VCC– –0.4 V

CC+ +0.4 V

VOOutput voltage range VCC– –0.4 V

CC+ +0.4 V

IIInput current(4) ±10 mA

IOOutput current ±50 mA

DGS package 165

θJA Package thermal impedance(5)(6) °C/W

DRC package TBD

TJOperating virtual junction temperature 150 °C

Tstg Storage temperature range –65 150 °C

(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating

conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.

(3) Differential voltages are at IN+ with respect to IN–.

(4) Excessive input current will flow if a differential input voltage in excess of approximately 0.6 V is applied between the inputs, unless

some limiting resistance is used.

(5) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient

temperature is PD=(T

J(max) – TA)/θJA. Operating at the absolute maximum TJof 150°C can affect reliability.

(6) The package thermal impedance is calculated in accordance with JESD 51-7.

TYP UNIT

Human-Body Model 1500 V

Machine Model 150 V

MIN MAX UNIT

VCC+ –V

CC– Supply voltage 2.7 5 V

TAOperating free-air temperature –40 85 °C

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Electrical Characteristics

LMV712

LOW-POWER LOW-NOISE HIGH-OUTPUT RRIO DUAL OPERATIONAL AMPLIFIER

WITH INDEPENDENT SHUTDOWN

SLOS485–JANUARY 2006

VCC+ = 2.7 V, VCC– = GND, VCM = 1.35 V, and RL>1MΩ(unless otherwise noted)

PARAMETER TEST CONDITIONS TAMIN TYP MAX UNIT

25°C0.43

VIO Input offset voltage VCM = 0.85 V and 1.85 V mV

–40°Cto85°C3.2

25°C5.5115

IIB Input bias current pA

–40°Cto85°C130

25°C5075

Common-mode

CMRR 0 ≤VCM ≤2.7 V dB

rejection ratio –40°Cto85°C45

25°C7090

VCM =0.85V –40°Cto85°C68

Power-supply

PSRR 2.7 V ≤VCC+ ≤5V dB

rejection ratio 25°C7090

VCM =1.85V –40°Cto85°C68

CMRR ≥50 dB –0.3 –0.2

Common-mode

CMVR 25°CV

voltage range 2.9 3

25°C1525

Sourcing VO=0 –40°Cto85°C12

Output

ISC mA

short-circuit current(1) 25°C2550

Sinking VO=2.7V –40°Cto85°C22

25°C 2.62 2.68

VOH –40°Cto85°C2.6

RL=10kΩto 1.35 V 25°C 0.01 0.12

VOL –40°Cto85°C0.15

VOOutput voltage swing V

25°C 2.52 2.55

VOH –40°Cto85°C2.5

RL= 600 Ωto 1.35 V 25°C 0.05 0.23

VOL –40°Cto85°C0.3

Output voltage level

VO(SD) 25°C10200mV

in shutdown mode

25°C 1.22 1.7

ON mode mA

–40°Cto85°C1.9

Supply current

ICC per channel 25°C 0.12 1.5

Shutdown mode μA

–40°Cto85°C2

25°C80115

Sourcing RL=10kΩ,

VO= 1.35 V to 2.3 V –40°Cto85°C76

25°C80113

Sinking RL=10kΩ,

VO=0.4Vto1.35V –40°Cto85°C76

Large-signal

AVOL dB

voltage gain 25°C8097

Sourcing RL= 600 Ω,

VO= 1.35 V to 2.2 V –40°Cto85°C76

25°C80100

Sinking RL= 600 Ω,

VO=0.5Vto1.35V –40°Cto85°C76

ON mode 2.4 to 2.7 2 to 2.7

VSD Shutdown pin voltage 25°CV

Shutdown mode 0 to 0.8 0 to 1

GBWP Gain bandwidth product 25°C 5 MHz

SR(2) Slew rate 25°C5V/μs

ΦmPhase margin 25°C60°

Input referred

Vnf=1kHz 25°C20nV/√Hz

voltage noise

(1) Shorting the output to either supply rail adversely affects reliability.

(2) Number specified is the slower of the positive and negative slew rates.

www.ti.com

LMV712

LOW-POWER LOW-NOISE HIGH-OUTPUT RRIO DUAL OPERATIONAL AMPLIFIER

WITH INDEPENDENT SHUTDOWN

SLOS485–JANUARY 2006

Electrical Characteristics (continued)

VCC+ = 2.7 V, VCC– = GND, VCM = 1.35 V, and RL>1MΩ(unless otherwise noted)

PARAMETER TEST CONDITIONS TAMIN TYP MAX UNIT

2.2 4

Turn-on time from

T(on) 25°Cμs

shutdown 4.6

www.ti.com

Electrical Characteristics

LMV712

LOW-POWER LOW-NOISE HIGH-OUTPUT RRIO DUAL OPERATIONAL AMPLIFIER

WITH INDEPENDENT SHUTDOWN

SLOS485–JANUARY 2006

VCC+ = 5 V, VCC– = GND, VCM = 2.5 V, and RL>1MΩ(unless otherwise noted)

PARAMETER TEST CONDITIONS TAMIN TYP MAX UNIT

25°C0.43

VIO Input offset voltage VCM = 0.85 V and 1.85 V mV

–40°Cto85°C3.2

25°C5.5115

IIB Input bias current pA

–40°Cto85°C130

25°C5080

Common-mode

CMRR 0 ≤VCM ≤5V dB

rejection ratio –40°Cto85°C45

25°C7090

VCM =0.85V –40°Cto85°C68

Power-supply

PSRR 2.7 V ≤VCC+ ≤5V dB

rejection ratio 25°C7090

VCM =1.85V –40°Cto85°C68

CMRR ≥50 dB –0.3 –0.2

Common-mode

CMVR 25°CV

voltage range 5.2 5.3

25°C2035

Sourcing VO=0 –40°Cto85°C18

Output

ISC mA

short-circuit current(1) 25°C2550

Sinking VO=5V –40°Cto85°C21

25°C 4.92 4.98

VOH –40°Cto85°C4.9

RL=10kΩto 2.5 V 25°C 0.01 0.12

VOL –40°Cto85°C0.15

VOOutput voltage swing V

25°C 4.82 4.85

VOH –40°Cto85°C4.8

RL= 600 Ωto 2.5 V 25°C 0.05 0.23

VOL –40°Cto85°C0.3

Output voltage level

VO(SD) 25°C10200mV

in shutdown mode

25°C 1.17 1.7

ON mode mA

–40°Cto85°C1.9

Supply current

ICC per channel 25°C 0.12 1.5

Shutdown mode μA

–40°Cto85°C2

25°C80130

Sourcing RL=10kΩ,

VO=2.5Vto4.6V –40°Cto85°C76

25°C80130

Sinking RL=10kΩ,

VO=0.4Vto2.5V –40°Cto85°C76

Large-signal

AVOL dB

voltage gain 25°C80110

Sourcing RL= 600 Ω,

VO=2.5Vto4.6V –40°Cto85°C76

25°C80107

Sinking RL= 600 Ω,

VO=0.4Vto2.5V –40°Cto85°C76

ON mode 4.5 to 5 3.5 to 5

VSD Shutdown pin voltage 25°CV

Shutdown mode 0 to 0.8 0 to 1.5

GBWP Gain bandwidth product 25°C 5 MHz

SR(2) Slew rate 25°C5V/μs

ΦmPhase margin 25°C60°

Input referred

Vnf=1kHz 25°C20nV/√Hz

voltage noise

(1) Shorting the output to either supply rail adversely affects reliability.

(2) Number specified is the slower of the positive and negative slew rates.

www.ti.com

LMV712

LOW-POWER LOW-NOISE HIGH-OUTPUT RRIO DUAL OPERATIONAL AMPLIFIER

WITH INDEPENDENT SHUTDOWN

SLOS485–JANUARY 2006

Electrical Characteristics (continued)

VCC+ = 5 V, VCC– = GND, VCM = 2.5 V, and RL>1MΩ(unless otherwise noted)

PARAMETER TEST CONDITIONS TAMIN TYP MAX UNIT

1.6 4

Turn-on time

T(on) 25°Cμs

from shutdown 4.6

www.ti.com

TYPICAL CHARACTERISTICS

LMV712

LOW-POWER LOW-NOISE HIGH-OUTPUT RRIO DUAL OPERATIONAL AMPLIFIER

WITH INDEPENDENT SHUTDOWN

SLOS485–JANUARY 2006

GRAPH PREVIEWS

Supply Current per Channel vs Supply Voltage (ON Mode)

Supply Current per Channel vs Supply Voltage (Shutdown Mode)

Input Offset Voltage vs Common-Mode Voltage

Bias Current vs Common-Mode Voltage Over Temperature

Output Positive Swing vs Supply Voltage (RL= 600 Ω)

Output Negative Swing vs Supply Voltage (RL= 600 Ω)

Sourcing Current vs Output Voltage (VCC =2.7V)

Sourcing Current vs Output Voltage (VCC =5V)

Sinking Current vs Output Voltage (VCC =2.7V)

Sinking Current vs Output Voltage (VCC =5V)

PSRR vs Frequency (VCC =2.7V)

PSRR vs Frequency (VCC =5V)

CMRR vs Frequency (VCC =2.7V)

CMRR vs Frequency (VCC =5V)

Open-Loop Frequency Response vs RL(VCC±=2.7V)

Open-Loop Frequency Response vs RL(VCC±=5V)

Open-Loop Frequency Response vs CL(VCC±=2.7V)

Open-Loop Frequency Response vs CL(VCC±=5V)

Voltage Noise vs Frequency (VCC =2.7V)

Voltage Noise vs Frequency (VCC =5V)

Non-Inverting Large Signal Pulse Response (VCC =2.7V)

Non-Inverting Large Signal Pulse Response (VCC =5V)

Non-Inverting Small Signal Pulse Response (VCC =2.7V)

Non-Inverting Small Signal Pulse Response (VCC =5V)

Inverting Large Signal Pulse Response (VCC =2.7V)

Inverting Large Signal Pulse Response (VCC =5V)

Inverting Small Signal Pulse Response (VCC =2.7V)

Inverting Small Signal Pulse Response (VCC =5V)

Turn-On Response Time (VCC =5V)

Input Common-Mode Capacitance vs Common-Mode Voltage (VCC =5V)

PACKAGE OPTION ADDENDUM

www.ti.com 29-Jun-2012

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

LMV712IDGSR NRND MSOP DGS 10 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

LMV712IDGSRG4 NRND MSOP DGS 10 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

LMV712IDGST NRND MSOP DGS 10 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

LMV712IDGSTG4 NRND MSOP DGS 10 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LMV712IDGSR MSOP DGS 10 2500 330.0 12.4 5.3 3.3 1.3 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 3-Nov-2010

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LMV712IDGSR MSOP DGS 10 2500 370.0 355.0 55.0

PACKAGE MATERIALS INFORMATION

www.ti.com 3-Nov-2010

Pack Materials-Page 2

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any product or service without notice, and advise customers to obtain the latest version of relevant information

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pertaining to warranty, patent infringement, and limitation of liability.

TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent

TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily

performed, except those mandated by government requirements.

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