TM
Revision: E
SMD1210 Surface Mount PTC Devices R.O.C. Patent#415624
SOLDER PAD LAYOUTS
(Dimension in mm)
FIGURE
TS TF
聚鼎科技股份有限公司 Polytronics Technology Corp.
新竹市科學工業園區展業㆒路9號6樓之3 6F-3, No.9 Prosperity Rd. I, SBIP, Hsin-Chu, Taiwan TEL:886-3-5643931 FAX:886-3-5644624 E-mail:pttc6368@ms22.hinet.net Http://www.pttc.com.tw
Page: 6 of 8
PHYSICAL DIMENSIONS (mm)
A B C D E
Part Number Min. Max. Min. Max. Min. Max. Min. Min. Max.
SMD1210P005TS 3.00 3.43 2.35 2.80 0.75 1.25 0.25 0.20 0.50
SMD1210P010TS 3.00 3.43 2.35 2.80 0.75 1.25 0.25 0.20 0.50
SMD1210P020TS 3.00 3.43 2.35 2.80 0.60 1.00 0.25 0.20 0.50
SMD1210P035TS 3.00 3.43 2.35 2.80 0.50 0.85 0.25 0.20 0.50
SMD1210P050TS 3.00 3.43 2.35 2.80 0.50 0.85 0.25 0.20 0.50
SMD1210P075TS 3.00 3.43 2.35 2.80 0.50 0.85 0.25 0.20 0.50
SMD1210P110TS 3.00 3.43 2.35 2.80 0.90 1.30 0.25 0.20 0.50
SMD1210P150TS 3.00 3.43 2.35 2.80 0.80 1.80 0.25 0.20 0.50
All products may be followed by suffix TF
ENVIRONMENTAL SPECIFICATIONS
Operating/Storage
Temperature
-40℃ to +85℃
Maximum Device Surface
Temperature in Tripped State
125℃
Passive Aging +85℃, 1000 hours ±5% typical resistance change
Humidity Aging +85℃, 85%R.H. 1000 hours ±5% typical resistance change
Thermal Shock MIL-STD-202 Method 107G
+85℃/-40℃ 20 times -30% typical resistance change
Solvent Resistance MIL-STD-202, Method 215 No change
Vibration MIL-STD-883C, Method 2007.1, Condition A No change
PHYSICAL SPECIFICATIONS
Terminal Material Solder-Plated Copper (Solder Material: 63/37 SnPb or Tin(Sn))
Lead Solderability Meets EIA Specification RS186-9E, ANSI/J-STD-002 Category 3.
Packaging 8 mm tape on 7 inch reel per EIA-481-1(equivalent to IEC286, part3)
2000 devices per reel for P150TS
3000 devices per reel for P005TS,P010TS,P020TSTS,P110TS
for the others: 4000 devices per reel.
◎ Specifications are subject to change without notice. 04/09/2004