Publication# 14128 Rev. IAmendment/0
Issue Date: May 1995
Advanced
Micro
Devices
MACH210A-7/10/12
MACH210-12/15/20
MACH210AQ-12/15/20
High-Density EE CMOS Programmable Logic
FINAL COM’L: -7/10/12/15/20, Q-12/15/20 IND: -12/14/18/24
DISTINCTIVE CHARACTERISTICS
44 Pins
64 Macrocells
7.5 ns tPD Commercial
12 ns tPD Industrial
133 MHz fCNT
38 Inputs; 210A Inputs have built-in pull-up
resistors
Peripheral Component Interconnect (PCI)
compliant
32 Outputs
64 Flip-flops; 2 clock choices
4 “PAL22V16” blocks with buried macrocells
Pin-compatible with MACH110, MACH111,
MACH211, and MACH215
GENERAL DESCRIPTION
The MACH210 is a member of AMD’s high-performance
EE CMOS MACH 2 device family. This device has
approximately six times the logic macrocell capability of
the popular PAL22V10 without loss of speed.
The MACH210 consists of four PAL blocks intercon-
nected by a programmable switch matrix. The four PAL
blocks are essentially “PAL22V16” structures complete
with product-term arrays and programmable macro-
cells, including additional buried macrocells. The switch
matrix connects the PAL blocks to each other and to all
input pins, providing a high degree of connectivity
between the fully-connected PAL blocks. This allows
designs to be placed and routed efficiently.
The MACH210 has two kinds of macrocell: output and
buried. The MACH210 output macrocell provides regis-
tered, latched, or combinatorial outputs with program-
mable polarity. If a registered configuration is chosen,
the register can be configured as D-type or T-type to
help reduce the number of product terms. The register
type decision can be made by the designer or by the
software. All output macrocells can be connected to an
I/O cell. If a buried macrocell is desired, the internal
feedback path from the macrocell can be used, which
frees up the I/O pin for use as an input.
The MACH210 has dedicated buried macrocells which,
in addition to the capabilities of the output macrocell,
also provide input registers or latches for use in
synchronizing signals and reducing setup time require-
ments.
AMD
MACH210-7/10/12/15/20, Q-12/15/202
BLOCK DIAGRAM
Switch Matrix
I/O Cells
Macrocells
I/O Cells
Macrocells
8
8
8
I/O Cells
Macrocells
I/O0–I/O7
Macrocells
I/O Cells
Macrocells
8
8
8
8
8
888
8
I0–I1,
I3–I4
I/O8–I/O15
2
I/O16–I/O23 CLK0/I2,
CLK1/I5
I/O24–I/O31
14128I-1
44 x 68
AND Logic Array
and
Logic Allocator
22 22
22 22
44 x 68
AND Logic Array
and
Logic Allocator
4
2
8
44 x 68
AND Logic Array
and
Logic Allocator
44 x 68
AND Logic Array
and
Logic Allocator
8
2
OE
Macrocells
8
8
Macrocells Macrocells
OE
OE OE
AMD
3MACH210-7/10/12/15/20, Q-12/15/20
CONNECTION DIAGRAM
Top View
PLCC
14128I-2
I/O5
I/O6
I/O7
I0
I1
CLK0/I2
I/O8
I/O9
GND
I/O10
I/O11
I/O4
I/O3
I/O2
I/O1
I/O0
GND
VCC
I/O31
I/O30
I/O29
I/O28
I/O27
I/O26
I/O25
I3
I4
I/O24
CLK1/I5
GND
I/O23
I/O22
I/O21
I/O12
I/O13
I/O14
VCC
GND
I/O16
I/O15
I/O17
I/O18
I/O19
I/O20
7
8
9
10
11
12
13
15
16
14
17
561324 4443424140
29
30
31
32
33
34
35
36
37
38
39
18 282726252423222119 20
Note:
Pin-compatible with MACH110, MACH111, MACH211, and MACH215.
AMD
MACH210-7/10/12/15/20, Q-12/15/204
CONNECTION DIAGRAM
Top View
TQFP
1
2
3
4
5
6
7
8
9
10
11
I/O27
I/O26
I/O25
I/O24
CLK1/I5
GND
I4
I3
I/O23
I/O22
I/O21
33
32
31
30
29
28
27
26
25
24
23
I/O5
I/O6
I/O7
I0
I1
GND
CLK0/I2
I/O8
I/O9
I/O10
I/O11
44
43
42
41
40
39
38
37
36
35
34
I/O4
I/O3
I/O2
I/O1
I/O0
GND
VCC
I/O31
I/O30
I/O29
I/O28
12
13
14
15
16
17
18
19
20
21
22
I/O12
I/O13
I/O14
I/O15
VCC
GND
I/O16
I/O17
I/O18
I/O19
I/O20
14128I-3
Note:
Pin-compatible with MACH111 and MACH211.
PIN DESIGNATIONS
CLK/I = Clock or Input
GND = Ground
I = Input
I/O = Input/Output
VCC = Supply Voltage
AMD
MACH210-7/10/12/15/20, Q-12/15/20 (Com’l) 5
ORDERING INFORMATION
Commercial Products
AMD programmable logic products for commercial applications are available with several ordering options. The order number
(Valid Combination) is formed by a combination of:
OPERATING CONDITIONS
C = Commercial (0°C to +70 °C)
FAMILY TYPE
MACH = Macro Array CMOS High-Speed
SPEED
-7 = 7.5 ns tPD
-10 = 10 ns tPD
-12 = 12 ns tPD
-15 = 15 ns tPD
-20 = 20 ns tPD
MACH210A-7
MACH210A-10
MACH210A-12
MACH210-12
MACH210-15
MACH210-20
MACH210AQ-12
MACH210AQ-15
MACH210AQ-20
MACH -7 J C
Valid Combinations
The Valid Combinations table lists configurations
planned to be supported in volume for this device. Con-
sult the local AMD sales office to confirm availability of
specific valid combinations or to check on newly re-
leased combinations.
Valid Combinations
OPTIONAL PROCESSING
Blank = Standard Processing
210A
DEVICE NUMBER
210 = 64 Macrocells, 44 Pins
210A = 64 Macrocells, 44 Pins, Input Pull-Up Resistors
210AQ = 64 Macrocells, 44 Pins, Input Pull-Up Resistors,
Quarter Power
PACKAGE TYPE
J = 44-Pin Plastic Leaded Chip
Carrier (PL 044)
V = 44-Pin Thin Quad Flat Pack
(PQT044)
JC
JC,
VC
AMD
6 MACH210-12/14/18/24 (Ind)
ORDERING INFORMATION
Industrial Products
AMD programmable logic products for industrial applications are available with several ordering options. The order number (Valid
Combination) is formed by a combination of:
OPERATING CONDITIONS
I = Industrial (–40°C to +85 °C)
FAMILY TYPE
MACH = Macro Array CMOS High-Speed
SPEED
-12 = 12 ns tPD
-14 = 14.5 ns tPD
-18 = 18 ns tPD
-24 = 24 ns tPD
MACH210A-12
MACH210A-14
MACH210-14
MACH210-18
MACH210-24
MACH -12 J I
Valid Combinations
The Valid Combinations table lists configurations
planned to be supported in volume for this device. Con-
sult the local AMD sales office to confirm availability of
specific valid combinations or to check on newly re-
leased combinations.
Valid Combinations
OPTIONAL PROCESSING
Blank = Standard Processing
210A
DEVICE NUMBER
210 = 64 Macrocells, 44 Pins
210A = 64 Macrocells, 44 Pins, Input Pull-Up Resistors
PACKAGE TYPE
J = 44-Pin Plastic Leaded Chip
Carrier (PL 044)
JI
AMD
7MACH210-7/10/12/15/20, Q-12/15/20
FUNCTIONAL DESCRIPTION
The MACH210 consists of four PAL blocks connected
by a switch matrix. There are 32 I/O pins and 4
dedicated input pins feeding the switch matrix. These
signals are distributed to the four PAL blocks for efficient
design implementation. There are two clock pins that
can also be used as dedicated inputs.
The MACH210A inputs and I/O pins have built-in pull-up
resistors. While it is always a good design practice to tie
unused pins high, the 210A pull-up resistors provide
design security and stability in the event that unused
pins are left disconnected.
The PAL Blocks
Each PAL block in the MACH210 (Figure 1) contains a
64-product-term logic array, a logic allocator, 8 output
macrocells, 8 buried macrocells, and 8 I/O cells. The
switch matrix feeds each PAL block with 22 inputs. This
makes the PAL block look effectively like an independ-
ent “PAL22V16” with 8 buried macrocells.
In addition to the logic product terms, two output enable
product terms, an asynchronous reset product term,
and an asynchronous preset product term are provided.
One of the two output enable product terms can be
chosen within each I/O cell in the PAL block. All flip-flops
within the PAL block are initialized together.
The Switch Matrix
The MACH210 switch matrix is fed by the inputs and
feedback signals from the PAL blocks. Each PAL block
provides 16 internal feedback signals and 8 I/O
feedback signals. The switch matrix distributes these
signals back to the PAL blocks in an efficient manner
that also provides for high performance. The design
software automatically configures the switch matrix
when fitting a design into the device.
The Product-term Array
The MACH210 product-term array consists of 64
product terms for logic use, and 4 special-purpose
product terms. Two of the special-purpose product
terms provide programmable output enable; one pro-
vides asynchronous reset, and one provides asynchro-
nous preset.
The Logic Allocator
The logic allocator in the MACH210 takes the 64 logic
product terms and allocates them to the 16 macrocells
as needed. Each macrocell can be driven by up to 16
product terms. The design software automatically
configures the logic allocator when fitting the design into
the device.
Table 1 illustrates which product term clusters are
available to each macrocell within a PAL block. Refer to
Figure 1 for cluster and macrocell numbers.
Table 1. Logic Allocation
Available
Output Buried Clusters
M0C0, C1, C2
M1C0, C1, C2, C3
M2C1, C2, C3, C4
M3C2, C3, C4, C5
M4C3, C4, C5, C6
M5C4, C5, C6, C7
M6C5, C6, C7, C8
M7C6, C7, C8, C9
M8C7, C8, C9, C10
M9C8, C9, C10, C11
M10 C9, C10, C11, C12
M11 C10, C11, C12, C13
M12 C11, C12, C13, C14
M13 C12, C13, C14, C15
M14 C13, C14, C15
M15 C14, C15
Macrocell
The Macrocell
The MACH210 has two types of macrocell: output and
buried. The output macrocells can be configured as
either registered, latched, or combinatorial, with pro-
grammable polarity. The macrocell provides internal
feedback whether configured with or without the flip-
flop. The registers can be configured as D-type or
T-type, allowing for product-term optimization.
The flip-flops can individually select one of two clock/
gate pins, which are also available as data inputs. The
registers are clocked on the LOW-to-HIGH transition of
the clock signal. The latch holds its data when the gate
input is HIGH, and is transparent when the gate input is
LOW. The flip-flops can also be asynchronously initial-
ized with the common asynchronous reset and preset
product terms.
The buried macrocells are the same as the output
macrocells if they are used for generating logic. In that
case, the only thing that distinguishes them from the
output macrocells is the fact that there is no I/O cell
connection, and the signal is only used internally. The
buried macrocell can also be configured as an input
register or latch.
AMD
MACH210-7/10/12/15/20, Q-12/15/208
The I/O Cell
The I/O cell in the MACH210 consists of a three-state
output buffer. The three-state buffer can be configured
in one of three ways: always enabled, always disabled,
or controlled by a product term. If product term control is
chosen, one of two product terms may be used to
provide the control. The two product terms that are
available are common to all I/O cells in a PAL block.
These choices make it possible to use the macrocell as
an output, an input, a bidirectional pin, or a three-state
output for use in driving a bus.
PCI Compliance
The MACH210A-7/10 is fully compliant with the
PCI
Local Bus Specification
published by the PCI Special
Interest Group. The MACH210A-7/10’s predictable
timing ensures compliance with the PCI AC specifica-
tions independent of the design. On the other hand, in
CPLD and FPGA architectures without predictable
timing, PCI compliance is dependent upon routing and
product term distribution.
AMD
9MACH210-7/10/12/15/20, Q-12/15/20
14128I-4
0 4 8 12 16 20 24 28 4032 43
36
0 4 8 12 16 20 24 28 4032 43
36
8
I/O
Cell I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Switch
Matrix
Output Enable
Output Enable
Asynchronous Reset
Asynchronous Preset
CLK0
CLK1
2
2
2
2
2
2
2
2
2
16
0I/O
Cell
I/O
Cell
I/O
Cell
I/O
Cell
I/O
Cell
I/O
Cell
Buried
Macro
cell
Output
Macro
cell
2
2
2
2
2
2
2
Buried
Macro
cell
Output
Macro
cell
Output
Macro
cell
Buried
Macro
cell
Output
Macro
cell
Buried
Macro
cell
Output
Macro
cell
Buried
Macro
cell
Output
Macro
cell
Buried
Macro
cell
Output
Macro
cell
Buried
Macro
cell
Output
Macro
cell
Buried
Macro
cell
I/O
Cell
Logic Allocator
63
C0
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
C11
C12
C13
C14
C15
M3
M6
M5
M4
M2
M1
M0
M9
M8
M7
M10
M11
M12
M13
M14
M15
Figure 1. MACH210 PAL Block
AMD
10 MACH210A-7 (Com’l)
ABSOLUTE MAXIMUM RATINGS
Storage Temperature –65°C to +150°C. . . . . . . . . . .
Ambient Temperature
with Power Applied –55°C to +125°C. . . . . . . . . . . . .
Supply Voltage with
Respect to Ground –0.5 V to +7.0 V. . . . . . . . . . . . .
DC Input Voltage –0.5 V to VCC + 0.5 V. . . . . . . . . . .
DC Output or
I/O Pin Voltage –0.5 V to VCC + 0.5 V. . . . . . . . . . . .
Static Discharge Voltage 2001 V. . . . . . . . . . . . . . . . .
Latchup Current
(TA = 0°C to +70°C) 200 mA. . . . . . . . . . . . . . . . . . . .
Stresses above those listed under Absolute Maximum Ratings
may cause permanent device failure. Functionality at or above
these limits is not implied. Exposure to Absolute Maximum
Ratings for extended periods may affect device reliability. Pro-
gramming conditions may differ.
OPERATING RANGES
Commercial (C) Devices
Temperature (TA) Operating
in Free Air 0°C to +70°C. . . . . . . . . . . . . . . . . . . . . . .
Supply Voltage (VCC) with
Respect to Ground +4.75 V to +5.25 V. . . . . . . . . . . .
Operating ranges define those limits between which the func-
tionality of the device is guaranteed.
DC CHARACTERISTICS over COMMERCIAL operating ranges unless otherwise specified
Parameter
Symbol Parameter Description Test Conditions Min Typ Max Unit
VOH Output HIGH Voltage IOH = –3.2 mA, VCC = Min 2.4 V
VIN = VIH or VIL
VOL Output LOW Voltage IOL = 16 mA, V CC = Min 0.5 V
VIN = VIH or VIL
VIH Input HIGH Voltage Guaranteed Input Logical HIGH 2.0 V
Voltage for all Inputs (Note 1)
VIL Input LOW Voltage Guaranteed Input Logical LOW 0.8 V
Voltage for all Inputs (Note 1)
IIH Input HIGH Leakage Current VIN = 5.25 V, V CC = Max (Note 2) 10 µA
IIL Input LOW Leakage Current VIN = 0 V, VCC = Max (Note 2) –100 µA
IOZH Off-State Output Leakage VOUT = 5.25 V, V CC = Max 10 µA
Current HIGH VIN = VIH or VIL (Note 2)
IOZL Off-State Output Leakage VOUT = 0 V, V CC = Max –100 µA
Current LOW VIN = VIH or VIL (Note 2)
ISC Output Short-Circuit Current VOUT = 0.5 V, VCC = Max (Note 3) –30 –160 mA
ICC Supply Current VIN = 0 V, Outputs Open (IOUT = 0 mA) 130 mA
VCC = 5.0 V, f = 25 MHz, TA = 25°C
(Note 4)
Notes:
1. These are absolute values with respect to device ground and all overshoots due to system or tester noise are included.
2. I/O pin leakage is the worst case of I
IL
and I
OZL
(or I
IH
and I
OZH
).
3. Not more than one output should be shorted at a time and duration of the short-circuit should not exceed one second.
V
OUT
= 0.5 V has been chosen to avoid test problems caused by tester ground degradation.
4. This parameter is measured with a 16-bit up/down counter pattern. This pattern is programmed in each PAL block and
capable of being loaded, enabled, and reset.
AMD
11MACH210A-7 (Com’l)
CAPACITANCE (Note 1)
Parameter
Symbol Parameter Description Test Conditions Typ Unit
CIN Input Capacitance V IN = 2.0 V VCC = 5.0 V, TA = 25°C, 6 pF
COUT Output Capacitance VOUT = 2.0 V f = 1 MHz 8 pF
SWITCHING CHARACTERISTICS over COMMERCIAL operating ranges
Parameter
Symbol Parameter Description Min Max Unit
tPD Input, I/O, or Feedback to Combinatorial Output 7.5 ns
tSSetup Time from Input, I/O or Feedback to Clock D-Type 5.5 ns
T-Type 6.5 ns
tHRegister Data Hold Time 0 ns
tCO Clock to Output 5ns
t
WL Clock Width LOW 3 ns
tWH HIGH 3 ns
D-Type 100 MHz
T-Type 91 MHz
fMAX D-Type 133 MHz
T-Type 125 MHz
166.7 MHz
tSL Setup Time from Input, I/O, or Feedback to Gate 5.5 ns
tHL Latch Data Hold Time 0 ns
tGO Gate to Output 6ns
t
GWL Gate Width LOW 3 ns
tPDL Input, I/O, or Feedback to Output Through 9.5 ns
Transparent Input or Output Latch
tSIR Input Register Setup Time 2 ns
tHIR Input Register Hold Time 2 ns
tICO Input Register Clock to Combinatorial Output 11 ns
tICS Input Register Clock to Output Register Setup D-Type 9 ns
T-Type 10 ns
tWICL Input Register Clock Width LOW 3 ns
tWICH HIGH 3 ns
fMAXIR Maximum Input Register Frequency 166.7 MHz
tSIL Input Latch Setup Time 2 ns
tHIL Input Latch Hold Time 2 ns
tIGO Input Latch Gate to Combinatorial Output 12 ns
tIGOL Input Latch Gate to Output Through Transparent Output Latch 14 ns
tSLL Setup Time from Input, I/O, or Feedback Through 7.5 ns
Transparent Input Latch to Output Latch Gate
Maximum
Frequency
External Feedback
Internal Feedback (fCNT)
No Feedback
-7
AMD
12 MACH210A-7 (Com’l)
SWITCHING CHARACTERISTICS over COMMERCIAL operating ranges (continued)
Parameter
Symbol Parameter Description Min Max Unit
tIGS Input Latch Gate to Output Latch Setup 10 ns
tWIGL Input Latch Gate Width LOW 3 ns
tPDLL Input, I/O, or Feedback to Output Through Transparent 11.5 ns
Input and Output Latches
tAR Asynchronous Reset to Registered or Latched Output 12 ns
tARW Asynchronous Reset Width 8 ns
tARR Asynchronous Reset Recovery Time 8 ns
tAP Asynchronous Preset to Registered or Latched Output 12 ns
tAPW Asynchronous Preset Width 8 ns
tAPR Asynchronous Preset Recovery Time 8 ns
tEA Input, I/O, or Feedback to Output Enable 7.5 ns
tER Input, I/O, or Feedback to Output Disable 7.5 ns
-7
Note:
1. These parameters are not 100% tested, but are evaluated at initial characterization and at any time the design is modified
where capacitance may be affected.
AMD
13
MACH210A-10/12 (Com’l)
ABSOLUTE MAXIMUM RATINGS
Storage Temperature –65°C to +150°C. . . . . . . . . . .
Ambient Temperature
with Power Applied –55°C to +125°C. . . . . . . . . . . . .
Supply Voltage with
Respect to Ground –0.5 V to +7.0 V. . . . . . . . . . . . .
DC Input Voltage –0.5 V to VCC + 0.5 V. . . . . . . . . . .
DC Output or
I/O Pin Voltage –0.5 V to VCC + 0.5 V. . . . . . . . . . . .
Static Discharge Voltage 2001 V. . . . . . . . . . . . . . . . .
Latchup Current (TA = 0°C to +70°C) 200 mA. . . . . .
Stresses above those listed under Absolute Maximum Ratings
may cause permanent device failure. Functionality at or above
these limits is not implied. Exposure to Absolute Maximum
Ratings for extended periods may affect device reliability.
Programming conditions may differ.
OPERATING RANGES
Commercial (C) Devices
Temperature (TA) Operating
in Free Air 0°C to +70°C. . . . . . . . . . . . . . . . . . . . . . .
Supply Voltage (VCC) with
Respect to Ground +4.75 V to +5.25 V. . . . . . . . . . . .
Operating ranges define those limits between which the func-
tionality of the device is guaranteed.
DC CHARACTERISTICS over COMMERCIAL operating ranges unless otherwise specified
Parameter
Symbol Parameter Description Test Conditions Min Typ Max Unit
VOH Output HIGH Voltage IOH = –3.2 mA, VCC = Min 2.4 V
VIN = VIH or VIL
VOL Output LOW Voltage IOL = 16 mA, V CC = Min 0.5 V
VIN = VIH or VIL
VIH Input HIGH Voltage Guaranteed Input Logical HIGH 2.0 V
Voltage for all Inputs (Note 1)
VIL Input LOW Voltage Guaranteed Input Logical LOW 0.8 V
Voltage for all Inputs (Note 1)
IIH Input HIGH Leakage Current VIN = 5.25 V, V CC = Max (Note 2) 10 µA
IIL Input LOW Leakage Current VIN = 0 V, V CC = Max (Note 2) –100 µA
IOZH Off-State Output Leakage VOUT = 5.25 V, V CC = Max 10 µA
Current HIGH V IN = VIH or VIL (Note 2)
IOZL Off-State Output Leakage VOUT = 0 V, VCC = Max –100 µA
Current LOW VIN = VIH or VIL (Note 2)
ISC Output Short-Circuit Current VOUT = 0.5 V, VCC = Max (Note 3) –30 –160 mA
ICC Supply Current (Typical) VCC = 5V, TA = 25°C, f = 25 MHz 135 mA
(Note 4)
Notes:
1. These are absolute values with respect to device ground and all overshoots due to system or tester noise are included.
2. I/O pin leakage is the worst case of I
IL
and I
OZL
(or I
IH
and I
OZH
).
3. Not more than one output should be shorted at a time and duration of the short-circuit should not exceed one second.
V
OUT
= 0.5 V has been chosen to avoid test problems caused by tester ground degradation.
4. Measured with a 16-bit up/down counter pattern. This pattern is programmed in each PAL block and is capable of being
loaded, enabled, and reset.
AMD
MACH210A-10/12 (Com’l)
14
CAPACITANCE (Note 1)
Parameter
Symbol Parameter Description Test Conditions Typ Unit
CIN Input Capacitance V IN = 2.0 V VCC = 5.0 V, TA = 25°C, 6 pF
COUT Output Capacitance VOUT = 2.0 V f = 1 MHz 8 pF
SWITCHING CHARACTERISTICS over COMMERCIAL operating ranges (Note 2)
Parameter
Symbol Parameter Description Min Max Min Max Unit
tPD Input, I/O, or Feedback to Combinatorial Output
(Note 3) 10 12 ns
D-Type 6.5 7 ns
T-Type 7.5 8 ns
tHRegister Data Hold Time 0 0 ns
tCO Clock to Output (Note 3) 6 8 ns
tWL Clock LOW 5 6 ns
tWH Width HIGH 5 6 ns
D-Type 80 66.7 MHz
T-Type 74 62.5 MHz
fMAX D-Type 100 83.3 MHz
T-Type 91 76.9 MHz
100 83.3 MHz
tSL Setup Time from Input, I/O, or Feedback to Gate 6.5 7 ns
tHL Latch Data Hold Time 0 0 ns
tGO Gate to Output (Note 3) 7 10 ns
tGWL Gate Width LOW 5 6 ns
tPDL Input, I/O, or Feedback to Output Through
Transparent Input or Output Latch 12 14 ns
tSIR Input Register Setup Time 2 2 ns
tHIR Input Register Hold Time 2 2 ns
tICO Input Register Clock to Combinatorial Output 13 15 ns
tICS Input Register Clock to Output Register Setup D-Type 10 12 ns
T-Type 11 13 ns
tWICL Input Register LOW 5 6 ns
tWICH Clock Width HIGH 5 6 ns
fMAXIR Maximum Input Register Frequency 1/(tWICL + tWICH) 100 83.3 MHz
tSIL Input Latch Setup Time 2 2 ns
tHIL Input Latch Hold Time 2 2 ns
tIGO Input Latch Gate to Combinatorial Output 14 17 ns
tIGOL Input Latch Gate to Output Through Transparent
Output Latch 16 19 ns
tSLL Setup Time from Input, I/O, or Feedback Through
Transparent Input Latch to Output Latch Gate 8.5 9 ns
tIGS Input Latch Gate to Output Latch Setup 11 13 ns
Maximum
Frequency
(Note 1)
Setup Time from Input, I/O,
or Feedback to Clock
External Feedback 1/(t S + t CO)
Internal Feedback (fCNT)
No Feedback 1/(tS + tH)
-10 -12
tS
AMD
15
MACH210A-10/12 (Com’l)
SWITCHING CHARACTERISTICS over COMMERCIAL operating ranges (Note 2)
(continued)
Parameter
Symbol Parameter Description Min Max Min Max Unit
tWIGL Input Latch Gate Width LOW 5 6 ns
tPDLL Input, I/O, or Feedback to Output Through Transparent
Input and Output Latches 14 16 ns
tAR Asynchronous Reset to Registered or Latched Output 25 16 ns
tARW Asynchronous Reset Width (Note 1) 10 12 ns
tARR Asynchronous Reset Recovery Time (Note 1) 10 8 ns
tAP Asynchronous Preset to Registered or Latched Output 15 16 ns
tAPW Asynchronous Preset Width (Note 1) 10 12 ns
tAPR Asynchronous Preset Recovery Time (Note 1) 10 8 ns
tEA Input, I/O, or Feedback to Output Enable (Note 3) 10 12 ns
tER Input, I/O, or Feedback to Output Disable (Note 3) 10 12 ns
Notes:
1. These parameters are not 100% tested, but are evaluated at initial characterization and at any time the design is modified
where capacitance may be affected.
2. See Switching Test Circuit, for test conditions.
3. Parameters measured with 16 outputs switching.
-10 -12
AMD
MACH210A-12/14 (Ind)
16
ABSOLUTE MAXIMUM RATINGS
Storage Temperature –65°C to +150°C. . . . . . . . . . .
Ambient Temperature
with Power Applied –55°C to +125°C. . . . . . . . . . . . .
Supply Voltage with
Respect to Ground –0.5 V to +7.0 V. . . . . . . . . . . . .
DC Input Voltage –0.5 V to VCC + 0.5 V. . . . . . . . . . .
DC Output or
I/O Pin Voltage –0.5 V to VCC + 0.5 V. . . . . . . . . . . .
Static Discharge Voltage 2001 V. . . . . . . . . . . . . . . . .
Latchup Current (TA = 0°C to +70°C) 200 mA. . . . . .
Stresses above those listed under Absolute Maximum Ratings
may cause permanent device failure. Functionality at or above
these limits is not implied. Exposure to Absolute Maximum
Ratings for extended periods may affect device reliability.
Programming conditions may differ.
INDUSTRIAL OPERATING RANGES
Temperature (TA) Operating
in Free Air –40°C to +85°C. . . . . . . . . . . . . . . . . . . . .
Supply Voltage (VCC) with
Respect to Ground +4.5 V to +5.5 V. . . . . . . . . . . . . .
Operating ranges define those limits between which the func-
tionality of the device is guaranteed.
DC CHARACTERISTICS over COMMERCIAL operating ranges unless otherwise specified
Parameter
Symbol Parameter Description Test Conditions Min Typ Max Unit
VOH Output HIGH Voltage IOH = –3.2 mA, VCC = Min 2.4 V
VIN = VIH or VIL
VOL Output LOW Voltage IOL = 16 mA, V CC = Min 0.5 V
VIN = VIH or VIL
VIH Input HIGH Voltage Guaranteed Input Logical HIGH 2.0 V
Voltage for all Inputs (Note 1)
VIL Input LOW Voltage Guaranteed Input Logical LOW 0.8 V
Voltage for all Inputs (Note 1)
IIH Input HIGH Leakage Current VIN = 5.25 V, V CC = Max (Note 2) 10 µA
IIL Input LOW Leakage Current VIN = 0 V, V CC = Max (Note 2) –100 µA
IOZH Off-State Output Leakage VOUT = 5.25 V, V CC = Max 10 µA
Current HIGH V IN = VIH or VIL (Note 2)
IOZL Off-State Output Leakage VOUT = 0 V, VCC = Max –100 µA
Current LOW VIN = VIH or VIL (Note 2)
ISC Output Short-Circuit Current VOUT = 0.5 V, VCC = Max (Note 3) –30 –160 mA
ICC Supply Current (Typical) VCC = 5V, TA = 25°C, f = 25 MHz 135 mA
(Note 4)
Notes:
1. These are absolute values with respect to device ground and all overshoots due to system or tester noise are included.
2. I/O pin leakage is the worst case of I
IL
and I
OZL
(or I
IH
and I
OZH
).
3. Not more than one output should be shorted at a time and duration of the short-circuit should not exceed one second.
V
OUT
= 0.5 V has been chosen to avoid test problems caused by tester ground degradation.
4. Measured with a 16-bit up/down counter pattern. This pattern is programmed in each PAL block and is capable of being
loaded, enabled, and reset.
AMD
17
MACH210A-12/14 (Ind)
CAPACITANCE (Note 1)
Parameter
Symbol Parameter Description Test Conditions Typ Unit
CIN Input Capacitance V IN = 2.0 V VCC = 5.0 V, TA = 25°C, 6 pF
COUT Output Capacitance VOUT = 2.0 V f = 1 MHz 8 pF
SWITCHING CHARACTERISTICS over COMMERCIAL operating ranges (Note 2)
Parameter
Symbol Parameter Description Min Max Min Max Unit
tPD Input, I/O, or Feedback to Combinatorial Output
(Note 3) 12 14.5 ns
D-Type 8 8.5 ns
T-Type 9 10 ns
tHRegister Data Hold Time 0 0 ns
tCO Clock to Output (Note 3) 7.5 10 ns
tWL Clock LOW 6 7.5 ns
tWH Width HIGH 6 7.5 ns
D-Type 64 53 MHz
T-Type 59 50 MHz
fMAX D-Type 80 61.5 MHz
T-Type 72.5 57 MHz
80 66.5 MHz
tSL Setup Time from Input, I/O, or Feedback to Gate 8 8.5 ns
tHL Latch Data Hold Time 0 0 ns
tGO Gate to Output (Note 3) 8.5 12 ns
tGWL Gate Width LOW 6 7.5 ns
tPDL Input, I/O, or Feedback to Output Through
Transparent Input or Output Latch 14.5 17 ns
tSIR Input Register Setup Time 2.5 2.5 ns
tHIR Input Register Hold Time 3 3 ns
tICO Input Register Clock to Combinatorial Output 16 18 ns
tICS Input Register Clock to Output Register Setup D-Type 12 14.5 ns
T-Type 13 16 ns
tWICL Input Register LOW 6 7.5 ns
tWICH Clock Width HIGH 6 7.5 ns
fMAXIR Maximum Input Register Frequency 1/(tWICL + tWICH) 80 66.5 MHz
tSIL Input Latch Setup Time 2.5 2.5 ns
tHIL Input Latch Hold Time 3 3 ns
tIGO Input Latch Gate to Combinatorial Output 17 20.5 ns
tIGOL Input Latch Gate to Output Through Transparent
Output Latch 19.5 23 ns
tSLL Setup Time from Input, I/O, or Feedback Through
Transparent Input Latch to Output Latch Gate 10.5 11 ns
tIGS Input Latch Gate to Output Latch Setup 13.5 16 ns
Maximum
Frequency
(Note 1)
Setup Time from Input, I/O,
or Feedback to Clock
External Feedback 1/(t S + t CO)
Internal Feedback (fCNT)
No Feedback 1/(tS + tH)
-12 -14
tS
AMD
MACH210A-12/14 (Ind)
18
SWITCHING CHARACTERISTICS over COMMERCIAL operating ranges (Note 2)
(continued)
Parameter
Symbol Parameter Description Min Max Min Max Unit
tWIGL Input Latch Gate Width LOW 6 7.5 ns
tPDLL Input, I/O, or Feedback to Output Through Transparent
Input and Output Latches 17 19.5 ns
tAR Asynchronous Reset to Registered or Latched Output 19.5 19.5 ns
tARW Asynchronous Reset Width (Note 1) 12 14.5 ns
tARR Asynchronous Reset Recovery Time (Note 1) 12 10 ns
tAP Asynchronous Preset to Registered or Latched Output 18 19.5 ns
tAPW Asynchronous Preset Width (Note 1) 12 14.5 ns
tAPR Asynchronous Preset Recovery Time (Note 1) 12 10 ns
tEA Input, I/O, or Feedback to Output Enable (Note 3) 12 14.5 ns
tER Input, I/O, or Feedback to Output Disable (Note 3) 12 14.5 ns
Notes:
1. These parameters are not 100% tested, but are evaluated at initial characterization and at any time the design is modified
where capacitance may be affected.
2. See Switching Test Circuit, for test conditions.
3. Parameters measured with 16 outputs switching.
-12 -14
AMD
19
MACH210-12/15/20 (Com’l)
ABSOLUTE MAXIMUM RATINGS
Storage Temperature –65°C to +150°C. . . . . . . . . . .
Ambient Temperature
with Power Applied –55°C to +125°C. . . . . . . . . . . . .
Supply Voltage with
Respect to Ground –0.5 V to +7.0 V. . . . . . . . . . . . .
DC Input Voltage –0.5 V to VCC + 0.5 V. . . . . . . . . . .
DC Output or
I/O Pin Voltage –0.5 V to VCC + 0.5 V. . . . . . . . . . . .
Static Discharge Voltage 2001 V. . . . . . . . . . . . . . . . .
Latchup Current (TA = 0°C to +70°C) 200 mA. . . . . .
Stresses above those listed under Absolute Maximum Ratings
may cause permanent device failure. Functionality at or above
these limits is not implied. Exposure to Absolute Maximum
Ratings for extended periods may affect device reliability.
Programming conditions may differ.
OPERATING RANGES
Commercial (C) Devices
Temperature (TA) Operating
in Free Air 0°C to +70°C. . . . . . . . . . . . . . . . . . . . . . .
Supply Voltage (VCC) with
Respect to Ground +4.75 V to +5.25 V. . . . . . . . . . . .
Operating ranges define those limits between which the func-
tionality of the device is guaranteed.
DC CHARACTERISTICS over COMMERCIAL operating ranges unless otherwise specified
Parameter
Symbol Parameter Description Test Conditions Min Typ Max Unit
VOH Output HIGH Voltage IOH = –3.2 mA, VCC = Min 2.4 V
VIN = VIH or VIL
VOL Output LOW Voltage IOL = 16 mA, V CC = Min 0.5 V
VIN = VIH or VIL
VIH Input HIGH Voltage Guaranteed Input Logical HIGH 2.0 V
Voltage for all Inputs (Note 1)
VIL Input LOW Voltage Guaranteed Input Logical LOW 0.8 V
Voltage for all Inputs (Note 1)
IIH Input HIGH Leakage Current VIN = 5.25 V, V CC = Max (Note 2) 10 µA
IIL Input LOW Leakage Current VIN = 0 V, V CC = Max (Note 2) –10 µA
IOZH Off-State Output Leakage VOUT = 5.25 V, V CC = Max 10 µA
Current HIGH V IN = VIH or VIL (Note 2)
IOZL Off-State Output Leakage VOUT = 0 V, VCC = Max –10 µA
Current LOW VIN = VIH or VIL (Note 2)
ISC Output Short-Circuit Current VOUT = 0.5 V, VCC = Max (Note 3) –30 –160 mA
ICC Supply Current (Typical) VCC = 5V, TA = 25°C, f = 25 MHz 120 mA
(Note 4)
Notes:
1. These are absolute values with respect to device ground and all overshoots due to system or tester noise are included.
2. I/O pin leakage is the worst case of I
IL
and I
OZL
(or I
IH
and I
OZH
).
3. Not more than one output should be shorted at a time and duration of the short-circuit should not exceed one second.
V
OUT
= 0.5 V has been chosen to avoid test problems caused by tester ground degradation.
4. Measured with a 16-bit up/down counter pattern. This pattern is programmed in each PAL block and is capable of being
loaded, enabled, and reset.
AMD
MACH210-12/15/20 (Com’l)
20
CAPACITANCE (Note 1)
Parameter
Symbol Parameter Description Test Conditions Typ Unit
CIN Input Capacitance V IN = 2.0 V VCC = 5.0 V, TA = 25°C, 6 pF
COUT Output Capacitance VOUT = 2.0 V f = 1 MHz 8 pF
SWITCHING CHARACTERISTICS over COMMERCIAL operating ranges (Note 2)
Parameter
Symbol Parameter Description Min Max Min Max Min Max Unit
tPD Input, I/O, or Feedback to Combinatorial Output
(Note 3) 12 15 20 ns
D-type 7 10 13 ns
T-type 8 11 14 ns
tHRegister Data Hold Time 0 0 0 ns
tCO Clock to Output (Note 3) 8 10 12 ns
tWL Clock LOW 6 6 8 ns
tWH Width HIGH 6 6 8 ns
D-type 66.7 50 40 MHz
T-type 62.5 47.6 38.5 MHz
fMAX D-type 83.3 66.6 50 MHz
T-type 76.9 62.5 47.6 MHz
83.3 83.3 62.5 MHz
tSL Setup Time from Input, I/O, or Feedback to Gate 7 10 13 ns
tHL Latch Data Hold Time 0 0 0 ns
tGO Gate to Output (Note 3) 10 11 12 ns
tGWL Gate Width LOW 6 6 8 ns
tPDL Input, I/O, or Feedback to Output Through
Transparent Input or Output Latch 14 17 22 ns
tSIR Input Register Setup Time 2 2 2 ns
tHIR Input Register Hold Time 2 2.5 3 ns
tICO Input Register Clock to Combinatorial Output 15 18 23 ns
tICS Input Register Clock to Output Register Setup 12 15 20 ns
13 16 21 ns
tWICL Input Register LOW 6 6 8 ns
tWICH Clock Width HIGH 6 6 8 ns
fMAXIR Maximum Input Register Frequency 1/(tWICL + tWICH) 83.3 83.3 62.5 MHz
tSIL Input Latch Setup Time 2 2 2 ns
tHIL Input Latch Hold Time 2 2.5 3 ns
tIGO Input Latch Gate to Combinatorial Output 17 20 25 ns
tIGOL Input Latch Gate to Output Through Transparent
Output Latch 19 22 27 ns
tSLL Setup Time from Input, I/O, or Feedback Through
Transparent Input Latch to Output Latch Gate 9 12 15 ns
tIGS Input Latch Gate to Output Latch Setup 13 16 21 ns
Maximum
Frequency
(Note 1)
Setup Time from Input, I/O,
or Feedback to Clock
External Feedback 1/(t S + t CO)
Internal Feedback (fCNT)
No Feedback 1/(tWL + tWH)
-15 -20
D-type
T-type
tS
-12
AMD
21
MACH210-12/15/20 (Com’l)
SWITCHING CHARACTERISTICS over COMMERCIAL operating ranges (Note 2)
(continued)
Parameter
Symbol Parameter Description Min Max Min Max Min Max Unit
tWIGL Input Latch Gate Width LOW 6 6 8 ns
tPDLL Input, I/O, or Feedback to Output Through Transparent
Input and Output Latches 16 19 24 ns
tAR Asynchronous Reset to Registered or Latched Output 16 20 25 ns
tARW Asynchronous Reset Width (Note 1) 12 15 20 ns
tARR Asynchronous Reset Recovery Time (Note 1) 8 10 15 ns
tAP Asynchronous Preset to Registered or Latched Output 16 20 25 ns
tAPW Asynchronous Preset Width (Note 1) 12 15 20 ns
tAPR Asynchronous Preset Recovery Time (Note 1) 8 10 15 ns
tEA Input, I/O, or Feedback to Output Enable (Note 3) 12 15 20 ns
tER Input, I/O, or Feedback to Output Disable (Note 3) 12 15 20 ns
Notes:
1. These parameters are not 100% tested, but are evaluated at initial characterization and at any time the design is modified
where capacitance may be affected.
2. See Switching Test Circuit, for test conditions.
3. Parameters measured with 16 outputs switching.
-15 -20-12
AMD
MACH210-14/18/24 (Ind)
22
ABSOLUTE MAXIMUM RATINGS
Storage Temperature –65°C to +150°C. . . . . . . . . . .
Ambient Temperature
With Power Applied –55°C to +125°C. . . . . . . . . . . . .
Supply Voltage with
Respect to Ground –0.5 V to +7.0 V. . . . . . . . . . . . .
DC Input Voltage –0.5 V to VCC
+ 0.5 V. . . . . . . . . . . .
DC Output or I/O
Pin Voltage –0.5 V to VCC
+ 0.5 V. . . . . . . . . . . . . . . .
Static Discharge Voltage 2001 V. . . . . . . . . . . . . . . .
Latchup Current
(TA = –40°C to +85°C) 200 mA. . . . . . . . . . . . . . . . . .
Stresses above those listed under Absolute Maximum Ratings
may cause permanent device failure. Functionality at or above
these limits is not implied. Exposure to Absolute Maximum
Ratings for extended periods may affect device reliability.
Programming conditions may differ.
INDUSTRIAL OPERATING RANGES
Ambient Temperature (TA)
Operating in Free Air –40°C to +85°C. . . . . . . . . . . .
Supply Voltage (VCC)
with Respect to Ground +4.5 V to +5.5 V. . . . . . . . . .
Operating ranges define those limits between which the func-
tionality of the device is guaranteed.
DC CHARACTERISTICS over INDUSTRIAL operating ranges unless otherwise
specified
Parameter
Symbol Parameter Description Test Conditions Min Typ Max Unit
VOH Output HIGH Voltage IOH = –3.2 mA, VCC = Min 2.4 V
VIN = VIH or VIL
VOL Output LOW Voltage IOL = 16 mA, VCC = Min 0.5 V
VIN = VIH or VIL
VIH Input HIGH Voltage Guaranteed Input Logical HIGH 2.0 V
Voltage for all Inputs (Note 1)
VIL Input LOW Voltage Guaranteed Input Logical LOW 0.8 V
Voltage for all Inputs (Note 1)
IIH Input HIGH Leakage Current VIN = 5.25 V, VCC = Max (Note 2) 10 µA
IIL Input LOW Leakage Current VIN = 0 V, VCC = Max (Note 2) –10 µA
IOZH Off-State Output Leakage VOUT = 5.25 V, VCC = Max 10 µA
Current HIGH VIN = VIH or VIL (Note 2)
IOZL Off-State Output Leakage VOUT = 0 V, VCC = Max –10 µA
Current LOW VIN = VIH or VIL (Note 2)
ISC Output Short-Circuit Current VOUT = 0.5 V, V CC = Max (Note 3) –30 –160 mA
Supply Current (Typical) VCC = 5 V, TA = 25°C, f = 25 MHz (Note 4) 120 mA
Notes:
1. These are absolute values with respect to device ground and all overshoots due to system and/or tester noise are included.
2. I/O pin leakage is the worst case of I
IL
and I
OZL
(or I
IH
and I
OZH
).
3. Not more than one output should be shorted at a time. Duration of the short-circuit should not exceed one second.
V
OUT
= 0.5 V has been chosen to avoid test problems caused by tester ground degradation.
4. Measured with a 16-bit up/down counter pattern. This pattern is programmed in each PAL block and is capable of
being loaded, enabled, and reset.
ICC
AMD
23
MACH210-14/18/24 (Ind)
CAPACITANCE (Note 1)
Parameter
Symbol Parameter Description Test Conditions Typ Unit
CIN Input Capacitance V IN = 2.0 V VCC = 5.0 V, TA = 25°C, 6 pF
COUT Output Capacitance VOUT = 2.0 V f = 1 MHz 8 pF
SWITCHING CHARACTERISTICS over INDUSTRIAL operating ranges (Note 2)
Parameter
Symbol Parameter Description Min Max Min Max Min Max Unit
tPD Input, I/O, or Feedback to Combinatorial Output 14.5 18 24 ns
(Note 3) D-type 8.5 12 16 ns
T-type 10 13.5 17 ns
tHRegister Data Hold Time 0 0 0 ns
tCO Clock to Output (Note 3) 10 12 14.5 ns
tWL Clock LOW 7.5 7.5 10 ns
tWH Width HIGH 7.5 7.5 10 ns
D-type 53 40 32 MHz
T-type 50 38 30.5 MHz
fMAX D-type 61.5 53 38 MHz
T-type 57 44 34.5 MHz
66.5 66.5 50 MHz
tSL Setup Time from Input, I/O, or Feedback to Gate 8.5 12 16 ns
tHL Latch Data Hold Time 0 0 0 ns
tGO Gate to Output (Note 3) 12 13.5 14.5 ns
tGWL Gate Width LOW 7.5 7.5 10 ns
tPDL Input, I/O, or Feedback to Output Through 17 20.5 26.5 ns
Transparent Input or Output Latch
tSIR Input Register Setup Time 2.5 2.5 2.5 ns
tHIR Input Register Hold Time 3 3.5 4 ns
tICO Input Register Clock to Combinatorial Output 18 22 28 ns
tICS Input Register Clock to Output Register Setup 14.5 18 24 ns
16 19.5 25.5 ns
tWICL Input Register LOW 7.5 7.5 10 ns
tWICH Clock Width HIGH 7.5 7.5 10 ns
fMAXIR Maximum Input Register Frequency 1/(tWICL + tWICH) 66.5 66.5 50 MHz
tSIL Input Latch Setup Time 2.5 2.5 2.5 ns
tHIL Input Latch Hold Time 3 3.5 4 ns
tIGO Input Latch Gate to Combinatorial Output 20.5 24 30 ns
tIGOL Input Latch Gate to Output Through Transparent 23 26.5 32.5 ns
Output Latch
tSLL Setup Time from Input, I/O, or Feedback Through 11 14.5 18 ns
Transparent Input Latch to Output Latch Gate
tIGS Input Latch Gate to Output Latch Setup 16 19.5 25.5 ns
tWIGL Input Latch Gate Width LOW 7.5 7.5 10 ns
tPDLL Input, I/O, or Feedback to Output Through Transparent 19.5 23 29 ns
Input and Output Latches
Maximum
Frequency
(Note 1)
Setup Time from Input, I/O,
or Feedback to Clock
External Feedback 1/(t S + tCO)
Internal Feedback (fCNT)
No Feedback 1/(tWL + tWH)
-18 -24
D-type
T-type
tS
-14
AMD
MACH210-14/18/24 (Ind)
24
SWITCHING CHARACTERISTICS over INDUSTRIAL operating ranges (Note 2)
(continued)
Parameter
Symbol Parameter Description Min Max Min Max Min Max Unit
tAR Asynchronous Reset to Registered or Latched Output 19.5 24 30 ns
tARW Asynchronous Reset Width (Note 1) 14.5 18 24 ns
tARR Asynchronous Reset Recovery Time (Note 1) 10 12 18 ns
tAP Asynchronous Preset to Registered or Latched Output 19.5 24 30 ns
tAPW Asynchronous Preset Width (Note 1) 14.5 18 24 ns
tAPR Asynchronous Preset Recovery Time (Note 1) 10 12 18 ns
tEA Input, I/O, or Feedback to Output Enable (Note 3) 14.5 18 24 ns
tER Input, I/O, or Feedback to Output Disable (Note 3) 14.5 18 24 ns
Notes:
1. These parameters are not 100% tested, but are evaluated at initial characterization and at any time the design is modified
where capacitance may be affected.
2. See Switching Test Circuit, for test conditions.
3. Parameters measured with 16 outputs switching.
-18 -24-14
AMD
25
MACH210AQ-12 (Com’l)
ABSOLUTE MAXIMUM RATINGS
Storage Temperature –65°C to +150°C. . . . . . . . . . .
Ambient Temperature
with Power Applied –55°C to +125°C. . . . . . . . . . . . .
Supply Voltage with
Respect to Ground –0.5 V to +7.0 V. . . . . . . . . . . . .
DC Input Voltage –0.5 V to VCC + 0.5 V. . . . . . . . . . .
DC Output or
I/O Pin Voltage –0.5 V to VCC + 0.5 V. . . . . . . . . . . .
Static Discharge Voltage 2001 V. . . . . . . . . . . . . . . . .
Latchup Current (TA = 0°C to +70°C) 200 mA. . . . . .
Stresses above those listed under Absolute Maximum Ratings
may cause permanent device failure. Functionality at or above
these limits is not implied. Exposure to Absolute Maximum
Ratings for extended periods may affect device reliability.
Programming conditions may differ.
OPERATING RANGES
Commercial (C) Devices
Temperature (TA) Operating
in Free Air 0°C to +70°C. . . . . . . . . . . . . . . . . . . . . . .
Supply Voltage (VCC) with
Respect to Ground +4.75 V to +5.25 V. . . . . . . . . . . .
Operating ranges define those limits between which the func-
tionality of the device is guaranteed.
DC CHARACTERISTICS over COMMERCIAL operating ranges unless otherwise specified
Parameter
Symbol Parameter Description Test Conditions Min Typ Max Unit
VOH Output HIGH Voltage IOH = –3.2 mA, VCC = Min 2.4 V
VIN = VIH or VIL
VOL Output LOW Voltage IOL = 16 mA, V CC = Min 0.5 V
VIN = VIH or VIL
VIH Input HIGH Voltage Guaranteed Input Logical HIGH 2.0 V
Voltage for all Inputs (Note 1)
VIL Input LOW Voltage Guaranteed Input Logical LOW 0.8 V
Voltage for all Inputs (Note 1)
IIH Input HIGH Leakage Current VIN = 5.25 V, V CC = Max (Note 2) 10 µA
IIL Input LOW Leakage Current VIN = 0 V, V CC = Max (Note 2) –100 µA
IOZH Off-State Output Leakage VOUT = 5.25 V, VCC = Max 10 µA
Current HIGH V IN = VIH or VIL (Note 2)
IOZL Off-State Output Leakage VOUT = 0 V, VCC = Max –100 µA
Current LOW VIN = VIH or VIL (Note 2)
ISC Output Short-Circuit Current VOUT = 0.5 V, VCC = Max (Note 3) –30 –160 mA
ICC Supply Current (Typical) VCC = 5 V, TA = 25°C, f = 25 MHz 45 mA
(Note 4)
Notes:
1. These are absolute values with respect to device ground and all overshoots due to system or tester noise are included.
2. I/O pin leakage is the worst case of I
IL
and I
OZL
(or I
IH
and I
OZH
).
3. Not more than one output should be shorted at a time and duration of the short-circuit should not exceed one second.
V
OUT
= 0.5 V has been chosen to avoid test problems caused by tester ground degradation.
4. Measured with a 16-bit up/down counter pattern. This pattern is programmed in each PAL block and is capable of being
loaded, enabled, and reset.
AMD
MACH210AQ-12 (Com’l)
26
CAPACITANCE (Note 1)
Parameter
Symbol Parameter Description Test Conditions Typ Unit
CIN Input Capacitance V IN = 2.0 V VCC = 5.0 V, TA = 25°C, 6 pF
COUT Output Capacitance VOUT = 2.0 V f = 1 MHz 8 pF
SWITCHING CHARACTERISTICS over COMMERCIAL operating ranges (Note 2)
Parameter
Symbol Parameter Description Min Max Unit
tPD Input, I/O, or Feedback to Combinatorial Output 12 ns
D-type 12 ns
T-type 13 ns
tHRegister Data Hold Time 0 ns
tCO Clock to Output 6ns
t
WL Clock LOW 6 ns
tWH Width HIGH 6 ns
D-type 55.6 MHz
T-type 52.6 MHz
fMAX D-type 83.3 MHz
T-type 76.9 MHz
83.3 MHz
tSL Setup Time from Input, I/O, or Feedback to Gate 12 ns
tHL Latch Data Hold Time 0 ns
tGO Gate to Output 7ns
t
GWL Gate Width LOW 6 ns
tPDL Input, I/O, or Feedback to Output Through
Transparent Input or Output Latch 14 ns
tSIR Input Register Setup Time 2 ns
tHIR Input Register Hold Time 2.5 ns
tICO Input Register Clock to Combinatorial Output 17 ns
tICS Input Register Clock to Output Register Setup D-type 15 ns
T-type 16 ns
tWICL Input Register LOW 6 ns
tWICH Clock Width HIGH 6 ns
fMAXIR Maximum Input Register Frequency 83.3 MHz
tSIL Input Latch Setup Time 2 ns
tHIL Input Latch Hold Time 2.5 ns
tIGO Input Latch Gate to Combinatorial Output 19 ns
tIGOL Input Latch Gate to Output Through Transparent
Output Latch 20 ns
tSLL Setup Time from Input, I/O, or Feedback Through
Transparent Input Latch to Output Latch Gate 13 ns
tIGS Input Latch Gate to Output Latch Setup 16 ns
Maximum
Frequency
(Note 1)
Setup Time from Input, I/O,
or Feedback to Clock
External Feedback
Internal Feedback (fCNT)
-12
tS
No Feedback
AMD
27
MACH210AQ-12 (Com’l)
SWITCHING CHARACTERISTICS over COMMERCIAL operating ranges (Note 2)
(continued)
Parameter
Symbol Parameter Description Min Max Unit
tWIGL Input Latch Gate Width LOW 6 ns
tPDLL Input, I/O, or Feedback to Output Through Transparent
Input and Output Latches 18 ns
tAR Asynchronous Reset to Registered or Latched Output 24 ns
tARW Asynchronous Reset Width (Note 1) 19 ns
tARR Asynchronous Reset Recovery Time (Note 1) 19 ns
tAP Asynchronous Preset to Registered or Latched Output 24 ns
tAPW Asynchronous Preset Width (Note 1) 19 ns
tAPR Asynchronous Preset Recovery Time (Note 1) 19 ns
tEA Input, I/O, or Feedback to Output Enable 12 ns
tER Input, I/O, or Feedback to Output Disable 12 ns
Notes:
1. These parameters are not 100% tested, but are evaluated at initial characterization and at any time the design is modified
where capacitance may be affected.
2. See Switching Test Circuit, for test conditions.
-12
AMD
MACH210AQ-15/20 (Com’l)
28
ABSOLUTE MAXIMUM RATINGS
Storage Temperature –65°C to +150°C. . . . . . . . . . .
Ambient Temperature
with Power Applied –55°C to +125°C. . . . . . . . . . . . .
Supply Voltage with
Respect to Ground –0.5 V to +7.0 V. . . . . . . . . . . . .
DC Input Voltage –0.5 V to VCC + 0.5 V. . . . . . . . . . .
DC Output or
I/O Pin Voltage –0.5 V to VCC + 0.5 V. . . . . . . . . . . .
Static Discharge Voltage 2001 V. . . . . . . . . . . . . . . . .
Latchup Current (TA = 0°C to +70°C) 200 mA. . . . . .
Stresses above those listed under Absolute Maximum Ratings
may cause permanent device failure. Functionality at or above
these limits is not implied. Exposure to Absolute Maximum
Ratings for extended periods may affect device reliability.
Programming conditions may differ.
OPERATING RANGES
Commercial (C) Devices
Temperature (TA) Operating
in Free Air 0°C to +70°C. . . . . . . . . . . . . . . . . . . . . . .
Supply Voltage (VCC) with
Respect to Ground +4.75 V to +5.25 V. . . . . . . . . . . .
Operating ranges define those limits between which the func-
tionality of the device is guaranteed.
DC CHARACTERISTICS over COMMERCIAL operating ranges unless otherwise specified
Parameter
Symbol Parameter Description Test Conditions Min Typ Max Unit
VOH Output HIGH Voltage IOH = –3.2 mA, VCC = Min 2.4 V
VIN = VIH or VIL
VOL Output LOW Voltage IOL = 16 mA, V CC = Min 0.5 V
VIN = VIH or VIL
VIH Input HIGH Voltage Guaranteed Input Logical HIGH 2.0 V
Voltage for all Inputs (Note 1)
VIL Input LOW Voltage Guaranteed Input Logical LOW 0.8 V
Voltage for all Inputs (Note 1)
IIH Input HIGH Leakage Current VIN = 5.25 V, V CC = Max (Note 2) 10 µA
IIL Input LOW Leakage Current VIN = 0 V, V CC = Max (Note 2) –100 µA
IOZH Off-State Output Leakage VOUT = 5.25 V, V CC = Max 10 µA
Current HIGH V IN = VIH or VIL (Note 2)
IOZL Off-State Output Leakage VOUT = 0 V, VCC = Max –100 µA
Current LOW VIN = VIH or VIL (Note 2)
ISC Output Short-Circuit Current VOUT = 0.5 V, VCC = Max (Note 3) –30 –160 mA
ICC Supply Current (Typical) VCC = 5V, TA = 25°C, f = 25 MHz 45 mA
(Note 4)
Notes:
1. These are absolute values with respect to device ground and all overshoots due to system or tester noise are included.
2. I/O pin leakage is the worst case of I
IL
and I
OZL
(or I
IH
and I
OZH
).
3. Not more than one output should be shorted at a time and duration of the short-circuit should not exceed one second.
V
OUT
= 0.5 V has been chosen to avoid test problems caused by tester ground degradation.
4. Measured with a 16-bit up/down counter pattern. This pattern is programmed in each PAL block and is capable of being
loaded, enabled, and reset.
AMD
29
MACH210AQ-15/20 (Com’l)
CAPACITANCE (Note 1)
Parameter
Symbol Parameter Description Test Conditions Typ Unit
CIN Input Capacitance VIN = 2.0 V VCC = 5.0 V, TA = 25°C, 6 pF
COUT Output Capacitance VOUT = 2.0 V f = 1 MHz 8 pF
SWITCHING CHARACTERISTICS over COMMERCIAL operating ranges (Note 2)
Parameter
Symbol Parameter Description Min Max Min Max Unit
tPD Input, I/O, or Feedback to Combinatorial Output
(Note 3) 15 20 ns
D-type 13 17 ns
T-type 14 18 ns
tHRegister Data Hold Time 0 0 ns
tCO Clock to Output (Note 3) 7 8 ns
tWL Clock LOW 6 8 ns
tWH Width HIGH 6 8 ns
D-type 50 40 MHz
T-type 47.6 38.4 MHz
fMAX D-type 58.8 45.4 MHz
T-type 55.5 43.4 MHz
D-type 76.9 58.8 MHz
T-type 71.4 55.5 MHz
tSL Setup Time from Input, I/O, or Feedback to Gate 13 17 ns
tHL Latch Data Hold Time 0 0 ns
tGO Gate to Output (Note 3) 8 8 ns
tGWL Gate Width LOW 6 8 ns
tPDL Input, I/O, or Feedback to Output Through
Transparent Input or Output Latch 17 22 ns
tSIR Input Register Setup Time 2 2 ns
tHIR Input Register Hold Time 2.5 3 ns
tICO Input Register Clock to Combinatorial Output 18 23 ns
tICS Input Register Clock to Output Register Setup 17 22 ns
18 23 ns
tWICL Input Register LOW 6 8 ns
tWICH Clock Width HIGH 6 8 ns
fMAXIR Maximum Input Register Frequency 1/(tWICL + tWICH) 83.3 62.5 MHz
tSIL Input Latch Setup Time 2 2 ns
tHIL Input Latch Hold Time 2.5 3 ns
tIGO Input Latch Gate to Combinatorial Output 20 25 ns
tIGOL Input Latch Gate to Output Through Transparent
Output Latch 22 27 ns
tSLL Setup Time from Input, I/O, or Feedback Through
Transparent Input Latch to Output Latch Gate 15 19 ns
tIGS Input Latch Gate to Output Latch Setup 18 23 ns
Maximum
Frequency
(Note 1)
Setup Time from Input, I/O,
or Feedback to Clock
External Feedback 1/(t S + t CO)
Internal Feedback (fCNT)
No Feedback 1/(tS + tH)
-15 -20
D-type
T-type
tS
AMD
MACH210AQ-15/20 (Com’l)
30
SWITCHING CHARACTERISTICS over COMMERCIAL operating ranges (Note 2)
(continued)
Parameter
Symbol Parameter Description Min Max Min Max Unit
tWIGL Input Latch Gate Width LOW 6 8 ns
tPDLL Input, I/O, or Feedback to Output Through Transparent
Input and Output Latches 19 24 ns
tAR Asynchronous Reset to Registered or Latched Output 25 30 ns
tARW Asynchronous Reset Width (Note 1) 20 25 ns
tARR Asynchronous Reset Recovery Time (Note 1) 20 25 ns
tAP Asynchronous Preset to Registered or Latched Output 25 30 ns
tAPW Asynchronous Preset Width (Note 1) 20 25 ns
tAPR Asynchronous Preset Recovery Time (Note 1) 20 25 ns
tEA Input, I/O, or Feedback to Output Enable (Note 3) 15 20 ns
tER Input, I/O, or Feedback to Output Disable (Note 3) 15 20 ns
Notes:
1. These parameters are not 100% tested, but are evaluated at initial characterization and at any time the design is modified
where capacitance may be affected.
2. See Switching Test Circuit, for test conditions.
3. Parameters measured with 16 outputs switching.
-15 -20
AMD
31
MACH210AQ-18/24 (Ind)
ABSOLUTE MAXIMUM RATINGS
Storage Temperature –65°C to +150°C. . . . . . . . . . .
Ambient Temperature
With Power Applied –55°C to +125°C. . . . . . . . . . . . .
Supply Voltage with
Respect to Ground –0.5 V to +7.0 V. . . . . . . . . . . . .
DC Input Voltage –0.5 V to VCC
+ 0.5 V. . . . . . . . . . . . .
DC Output or I/O
Pin Voltage –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . .
Static Discharge Voltage 2001 V. . . . . . . . . . . . . . . .
Latchup Current
(TA = –40°C to +85°C) 200 mA. . . . . . . . . . . . . . . . . .
Stresses above those listed under Absolute Maximum Ratings
may cause permanent device failure. Functionality at or above
these limits is not implied. Exposure to Absolute Maximum
Ratings for extended periods may affect device reliability.
Programming conditions may differ.
INDUSTRIAL OPERATING RANGES
Ambient Temperature (TA)
Operating in Free Air –40°C to +85°C. . . . . . . . . . . .
Supply Voltage (VCC)
with Respect to Ground +4.5 V to +5.5 V. . . . . . . . . .
Operating ranges define those limits between which the func-
tionality of the device is guaranteed.
DC CHARACTERISTICS over INDUSTRIAL operating ranges unless otherwise
specified
Parameter
Symbol Parameter Description Test Conditions Min Typ Max Unit
VOH Output HIGH Voltage IOH = –3.2 mA, VCC = Min 2.4 V
VIN = VIH or VIL
VOL Output LOW Voltage IOL = 16 mA, VCC = Min 0.5 V
VIN = VIH or VIL
VIH Input HIGH Voltage Guaranteed Input Logical HIGH 2.0 V
Voltage for all Inputs (Note 1)
VIL Input LOW Voltage Guaranteed Input Logical LOW 0.8 V
Voltage for all Inputs (Note 1)
IIH Input HIGH Leakage Current VIN = 5.25 V, VCC = Max (Note 2) 10 µA
IIL Input LOW Leakage Current VIN = 0 V, VCC = Max (Note 2) –100 µA
IOZH Off-State Output Leakage VOUT = 5.25 V, VCC = Max 10 µA
Current HIGH VIN = VIH or VIL (Note 2)
IOZL Off-State Output Leakage VOUT = 0 V, VCC = Max –100 µA
Current LOW VIN = VIH or VIL (Note 2)
ISC Output Short-Circuit Current VOUT = 0.5 V, V CC = Max (Note 3) –30 –160 mA
ICC Supply Current (Typical) VCC = 5 V, TA = 25°C, f = 25 MHz (Note 4) 45 mA
Notes:
1. These are absolute values with respect to device ground and all overshoots due to system and/or tester noise are included.
2. I/O pin leakage is the worst case of I
IL
and I
OZL
(or I
IH
and I
OZH
).
3. Not more than one output should be shorted at a time. Duration of the short-circuit should not exceed one second.
V
OUT
= 0.5 V has been chosen to avoid test problems caused by tester ground degradation.
4. Measured with a 16-bit up/down counter pattern. This pattern is programmed in each PAL block and is capable of
being loaded, enabled, and reset.
AMD
MACH210AQ-18/24 (Ind)
32
CAPACITANCE (Note 1)
Parameter
Symbol Parameter Description Test Conditions Typ Unit
CIN Input Capacitance VIN = 2.0 V VCC = 5.0 V, TA = 25°C, 6 pF
COUT Output Capacitance VOUT = 2.0 V f = 1 MHz 8 pF
SWITCHING CHARACTERISTICS over INDUSTRIAL operating ranges (Note 2)
Parameter
Symbol Parameter Description Min Max Min Max Unit
tPD Input, I/O, or Feedback to Combinatorial Output 18 24 ns
(Note 3) D-type 16 20.5 ns
T-type 17 22 ns
tHRegister Data Hold Time 0 0 ns
tCO Clock to Output (Note 3) 8.5 10 ns
tWL Clock LOW 7.5 10 ns
tWH Width HIGH 7.5 10 ns
D-type 40 32 MHz
T-type 38 30.5 MHz
fMAX D-type 47 36 MHz
T-type 44 34.5 MHz
D-type 61.5 47 MHz
T-type 57 47 MHz
tSL Setup Time from Input, I/O, or Feedback to Gate 16 20.5 ns
tHL Latch Data Hold Time 0 0 ns
tGO Gate to Output (Note 3) 10 10 ns
tGWL Gate Width LOW 7.5 10 ns
tPDL Input, I/O, or Feedback to Output Through 20.5 26.5 ns
Transparent Input or Output Latch
tSIR Input Register Setup Time 2.5 2.5 ns
tHIR Input Register Hold Time 3.5 4 ns
tICO Input Register Clock to Combinatorial Output 22 28 ns
tICS Input Register Clock to Output Register Setup 20.5 26.5 ns
22 28 ns
tWICL Input Register LOW 7.5 10 ns
tWICH Clock Width HIGH 7.5 10 ns
fMAXIR Maximum Input Register Frequency 1/(tWICL + tWICH) 66.5 50 MHz
tSIL Input Latch Setup Time 2.5 2.5 ns
tHIL Input Latch Hold Time 3.5 4 ns
tIGO Input Latch Gate to Combinatorial Output 24 30 ns
tIGOL Input Latch Gate to Output Through Transparent 26.5 32.5 ns
Output Latch
tSLL Setup Time from Input, I/O, or Feedback Through 18 23 ns
Transparent Input Latch to Output Latch Gate
tIGS Input Latch Gate to Output Latch Setup 22 28 ns
tWIGL Input Latch Gate Width LOW 7.5 10 ns
tPDLL Input, I/O, or Feedback to Output Through Transparent 23 29 ns
Input and Output Latches
Maximum
Frequency
(Note 1)
Setup Time from Input, I/O,
or Feedback to Clock
External Feedback 1/(t S + tCO)
Internal Feedback (fCNT)
No Feedback 1/(tS + tH)
-18 -24
D-type
T-type
tS
AMD
33
MACH210AQ-18/24 (Ind)
SWITCHING CHARACTERISTICS over INDUSTRIAL operating ranges (Note 2)
(continued)
Parameter
Symbol Parameter Description Min Max Min Max Unit
tAR Asynchronous Reset to Registered or Latched Output 30 36 ns
tARW Asynchronous Reset Width (Note 1) 24 30 ns
tARR Asynchronous Reset Recovery Time (Note 1) 24 30 ns
tAP Asynchronous Preset to Registered or Latched Output 30 36 ns
tAPW Asynchronous Preset Width (Note 1) 24 30 ns
tAPR Asynchronous Preset Recovery Time (Note 1) 24 30 ns
tEA Input, I/O, or Feedback to Output Enable (Note 3) 18 24 ns
tER Input, I/O, or Feedback to Output Disable (Note 3) 18 24 ns
Notes:
1. These parameters are not 100% tested, but are evaluated at initial characterization and at any time the design is modified
where capacitance may be affected.
2. See Switching Test Circuit, for test conditions.
3. Parameters measured with 16 outputs switching.
-18 -24
AMD
34 MACH210-7/10/12/15/20, Q-12/15/20
TYPICAL CURRENT VS. VOLTAGE (I-V) CHARACTERISTICS
VCC = 5.0 V, TA = 25°C
Input
14128I-6
20
–40
–60
–80
–2 –1 123
Output, HIGH
II (mA)
VI (V)
–20
14128I-5
IOH (mA)
VOH (V)
25
–50
–75
–100
–3 –2 –1
123
–25
–125
–150
45
45
–100
–0.8 –0.6 –0.4 .2–0.2–1.0
Output, LOW
.4 .6 1.0.8
60
40
20
–20
–40
80
–60
–80
IOL (mA)
VOL (V)
14128I-7
AMD
MACH210-7/10/12/15/20, Q-12/15/20 35
TYPICAL ICC CHARACTERISTICS
VCC = 5 V, TA = 25°C
14128I-8
150
125
100
75
50
25
00 10203040 506070 8090100
MACH210A
MACH210
MACH210AQ
ICC (mA)
Frequency (MHz)
The selected “typical” pattern is a 16-bit up/down counter. This pattern is programmed in each PAL block and is capable of
being loaded, enabled, and reset.
Maximum frequency shown uses internal feedback and a D-type register.
AMD
36 MACH210-7/10/12/15/20, Q-12/15/20
TYPICAL THERMAL CHARACTERISTICS
Measured at 25°C ambient. These parameters are not tested.
Parameter
Symbol Parameter Description TQFP PLCC Unit
θjc Thermal impedance, junction to case 11.3 15 °C/W
θja Thermal impedance, junction to ambient 41 40 °C/W
θjma Thermal impedance, junction to 200 lfpm air 35 36 °C/W
400 lfpm air 33.7 33 °C/W
600 lfpm air 32.6 31 °C/W
800 lfpm air 32 29 °C/W
Plastic
θ
jc Considerations
The data listed for plastic
θ
jc are for reference only and are not recommended for use in calculating junction temperatures. The
heat-flow paths in plastic-encapsulated devices are complex, making the
θ
jc measurement relative to a specific location on the
package surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of the
package. Furthermore,
θ
jc tests on packages are performed in a constant-temperature bath, keeping the package surface at a
constant temperature. Therefore, the measurements can only be used in a similar environment.
Typ
ambient with air flow
AMD
37MACH210-7/10/12/15/20, Q-12/15/20
SWITCHING WAVEFORMS
Notes:
1. V
T
= 1.5 V.
2. Input pulse amplitude 0 V to 3.0 V.
3. Input rise and fall times 2 ns–4 ns typical.
tPD
Input, I/O, or
Feedback
Combinatorial
Output
VT
VT
Combinatorial Output
VT
Input, I/O,
or Feed-
back
Registered
Output
Registered Output
tS
tCO
VT
tH
VT
Clock
tWH
Clock
Clock Width
tWL
VT
Combinatorial
Output
Registered Input (MACH 2 and 4)
tSIR
tICO
VT
tHIR
VT
Input
Register
Clock
Registered
Input
Latched Output (MACH 2, 3, and 4)
Gate
Gate Width (MACH 2, 3, and 4)
tGWS
VT
VT
VT
VT
tICS
Input Register to Output Register Setup
(MACH 2 and 4)
Output
Register
Clock
Input
Register
Clock
Registered
Input
tPDL
Input, I/O, or
Feedback
Latched
Out
Gate
VT
tHL
tSL
tGO
VT
VT
14128I-9
14128I-10 14128I-11
14128I-12 14128I-13
14128I-14 14128I-15
AMD
MACH210-7/10/12/15/20, Q-12/15/2038
SWITCHING WAVEFORMS
Notes:
1. V
T
= 1.5 V.
2. Input pulse amplitude 0 V to 3.0 V.
3. Input rise and fall times 2 ns–4 ns typical.
Latched Input (MACH 2 and 4)
Latched Input and Output
(MACH 2, 3, and 4)
Latched
In
Output
Latch Gate
Latched
Out
tSLL
Combinatorial
Output
Gate tHIL
tSIL
tIGO
Latched
In
tPDLL
tIGOL
tIGS
Input
Latch Gate
VT
VT
VT
VT
VT
VT
14128I-16
14128I-17
AMD
39MACH210-7/10/12/15/20, Q-12/15/20
SWITCHING WAVEFORMS
tWICH
Clock
Input Register Clock Width
(MACH 2 and 4)
VT
tWICL
VT
VT
tARW
VT
tAR
Asynchronous Reset
Input, I/O, or
Feedback
Registered
Output
Clock
tARR
Asynchronous Preset
Registered
Output
Clock
VT
VT
Outputs
Output Disable/Enable
tER tEA
VOH - 0.5V
VOL + 0.5V
Notes:
1. V
T
= 1.5 V.
2. Input pulse amplitude 0 V to 3.0 V.
3. Input rise and fall times 2 ns–4 ns typical.
Input, I/O,
or Feedback
VT
VT
Input, I/O, or
Feedback
tAPW
VT
tAP
tAPR
Input
Latch
Gate
Input Latch Gate Width
(MACH 2 and 4)
tWIGL
VT
14128I-18 14128I-19
14128I-20 14128I-21
14128I-22
AMD
MACH210-7/10/12/15/20, Q-12/15/2040
KEY TO SWITCHING WAVEFORMS
KS000010-PAL
Must be
Steady
May
Change
from H to L
May
Change
from L to H
Does Not
Apply
Don’t Care,
Any Change
Permitted
Will be
Steady
Will be
Changing
from H to L
Will be
Changing
from L to H
Changing,
State
Unknown
Center
Line is High-
Impedance
“Off” State
WAVEFORM INPUTS OUTPUTS
SWITCHING TEST CIRCUIT
Measured
Specification S1CLR1R2Output Value
tPD, tCO Closed 1.5 V
tEA Z → H: Open 35 pF 1.5 V
Z → L: Closed 300 Ω390 Ω
tER H →Z: Open 5 pF H →Z: VOH – 0.5 V
L →Z: Closed L →Z: VOL + 0.5 V
Commercial
14128I-23
CL
Output
R1
R2
S1
Test Point
5 V
*Switching several outputs simultaneously should be avoided for accurate measurement.
AMD
41MACH210-7/10/12/15/20, Q-12/15/20
fMAX PARAMETERS
The parameter fMAX is the maximum clock rate at which
the device is guaranteed to operate. Because the flexi-
bility inherent in programmable logic devices offers a
choice of clocked flip-flop designs, fMAX is specified for
three types of synchronous designs.
The first type of design is a state machine with feedback
signals sent off-chip. This external feedback could go
back to the device inputs, or to a second device in a
multi-chip state machine. The slowest path defining the
period is the sum of the clock-to-output time and the in-
put setup time for the external signals (tS + tCO). The re-
ciprocal, fMAX, is the maximum frequency with external
feedback or in conjunction with an equivalent speed de-
vice. This fMAX is designated “fMAX external.”
The second type of design is a single-chip state ma-
chine with internal feedback only. In this case, flip-flop
inputs are defined by the device inputs and flip-flop out-
puts. Under these conditions, the period is limited by the
internal delay from the flip-flop outputs through the inter-
nal feedback and logic to the flip-flop inputs. This fMAX is
designated “fMAX internal”. A simple internal counter is a
good example of this type of design; therefore, this pa-
rameter is sometimes called “fCNT.”
The third type of design is a simple data path applica-
tion. In this case, input data is presented to the flip-flop
and clocked through; no feedback is employed. Under
these conditions, the period is limited by the sum of the
data setup time and the data hold time (tS + tH). However,
a lower limit for the period of each fMAX type is the mini-
mum clock period (tWH + tWL). Usually, this minimum
clock period determines the period for the third fMAX, des-
ignated “fMAX no feedback.”
For devices with input registers, one additional fMAX pa-
rameter is specified: fMAXIR. Because this involves no
feedback, it is calculated the same way as fMAX no feed-
back. The minimum period will be limited either by the
sum of the setup and hold times (tSIR + tHIR) or the sum of
the clock widths (tWICL + tWICH). The clock widths are nor-
mally the limiting parameters, so that fMAXIR is specified
as 1/(tWICL + tWICH). Note that if both input and output reg-
isters are use in the same path, the overall frequency will
be limited by tICS.
All frequencies except fMAX internal are calculated from
other measured AC parameters. fMAX internal is meas-
ured directly.
tHIR
tSIR
LOGIC REGISTER
tt
CLK
(SECOND
CHIP)
SCO
t
S
f
MAX External; 1/(tS + t CO)
LOGIC REGISTER
CLK
fMAX Internal (fCNT)
LOGIC REGISTER
t
CLK
S
fMAX No Feedback; 1/(tS + tH) or 1/(tWH + t WL)
14128I-24
LOGIC
REGISTER
CLK
fMAXIR ; 1/(tSIR + tHIR) or 1/(tWICL + tWICH)
AMD
MACH210-7/10/12/15/20, Q-12/15/2042
ENDURANCE CHARACTERISTICS
The MACH families are manufactured using AMD’s
advanced Electrically Erasable process. This technol-
ogy uses an EE cell to replace the fuse link used in
bipolar parts. As a result, the device can be erased and
reprogrammed, a feature which allows 100% testing at
the factory.
Endurance Characteristics
Parameter
Symbol Parameter Description Min Units Test Conditions
10 Years Max Storage
Temperature
20 Years Max Operating
Temperature
N Max Reprogramming Cycles 100 Cycles Normal Programming
Conditions
tDR Min Pattern Data Retention Time
AMD
43MACH210-7/10/12/15/20, Q-12/15/20
INPUT/OUTPUT EQUIVALENT SCHEMATICS
Input
I/O
Preload
Circuitry
ESD
Protection
Feedback
Input
VCC
VCC
1 kΩ
100 kΩ
VCC
VCC
100 kΩ
1 kΩ
14128I-25
AMD
MACH210-7/10/12/15/20, Q-12/15/2044
POWER-UP RESET
The MACH devices have been designed with the capa-
bility to reset during system power-up. Following power-
up, all flip-flops will be reset to LOW. The output state
will depend on the logic polarity. This feature provides
extra flexibility to the designer and is especially valuable
in simplifying state machine initialization. A timing dia-
gram and parameter table are shown below. Due to the
synchronous operation of the power-up reset and the
wide range of ways VCC can rise to its steady state, two
conditions are required to insure a valid power-up reset.
These conditions are:
1. The VCC rise must be monotonic.
2. Following reset, the clock input must not be driven
from LOW to HIGH until all applicable input and
feedback setup times are met.
Parameter
Symbol Parameter Descriptions Max Unit
tPR Power-Up Reset Time 10 µs
tSInput or Feedback Setup Time
tWL Clock Width LOW
See
Switching
Characteristics
tPR
tWL
tS
4 V VCC
Power
Registered
Output
Clock
14128I-26
Power-Up Reset Waveform
AMD
45MACH210-7/10/12/15/20, Q-12/15/20
USING PRELOAD AND OBSERVABILITY
In order to be testable, a circuit must be both controllable
and observable. To achieve this, the MACH devices
incorporate register preload and observability.
In preload mode, each flip-flop in the MACH device can
be loaded from the I/O pins, in order to perform
functional testing of complex state machines. Register
preload makes it possible to run a series of tests from a
known starting state, or to load illegal states and test for
proper recovery. This ability to control the MACH
device’s internal state can shorten test sequences,
since it is easier to reach the state of interest.
The observability function makes it possible to see the
internal state of the buried registers during test by
overriding each register’s output enable and activating
the output buffer. The values stored in output and buried
registers can then be observed on the I/O pins. Without
this feature, a thorough functional test would be
impossible for any designs with buried registers.
While the implementation of the testability features is
fairly straightforward, care must be taken in certain
instances to insure valid testing.
One case involves asynchronous reset and preset. If the
MACH registers drive asynchronous reset or preset
lines and are preloaded in such a way that reset or
preset are asserted, the reset or preset may remove the
preloaded data. This is illustrated in Figure 2. Care
should be taken when planning functional tests, so that
states that will cause unexpected resets and presets are
not preloaded.
Another case to be aware of arises in testing combinato-
rial logic. When an output is configured as combinato-
rial, the observability feature forces the output into
registered mode. When this happens, all product terms
are forced to zero, which eliminates all combinatorial
data. For a straight combinatorial output, the correct
value will be restored after the preload or observe
function, and there will be no problem. If the function
implements a combinatorial latch, however, it relies on
feedback to hold the correct value, as shown in Figure 3.
As this value may change during the preload or observe
operation, you cannot count on the data being correct
after the operation. To insure valid testing in these
cases, outputs that are combinatorial latches should not
be tested immediately following a preload or observe
sequence, but should first be restored to a known state.
All MACH 2 devices support both preload and
observability.
Contact individual programming vendors in order to
verify programmer support.
AR
Figure 2. Preload/Reset Conflict
Q1
On
Off
Preload
Mode
Q2
AR
Preloaded
HIGH
D
Q
Q1
D
Q
AR
Preloaded
HIGH
Q2
14128I-27
Figure 3. Combinatorial Latch
Set
Reset
14128I-28
AMD
MACH210-7/10/12/15/20, Q-12/15/2046
DEVELOPMENT SYSTEMS (subject to change)
For more information on the products listed below, please consult the AMD FusionPLD Catalog.
MANUFACTURER SOFTWARE DEVELOPMENT SYSTEMS
Advanced Micro Devices, Inc.
P.O. Box 3453, MS 1028
Sunnyvale, CA 94088-3543
(800) 222-9323 or (408) 732-2400
Advanced Micro Devices, Inc.
P.O. Box 3453, MS 1028
Sunnyvale, CA 94088-3543
(800) 222-9323 or (408) 732-2400
Advanced Micro Devices, Inc.
P.O. Box 3453, MS 1028
Sunnyvale, CA 94088-3543
(800) 222-9323 or (408) 732-2400
Advanced Micro Devices, Inc.
P.O. Box 3453, MS 1028
Sunnyvale, CA 94088-3543
(800) 222-9323 or (408) 732-2400
Cadence Design Systems
555 River Oaks Pkwy
San Jose, CA 95134
(408) 943-1234
Capilano Computing
960 Quayside Dr., Suite 406
New Westminster, B.C.
Canada V3M 6G2
(800) 444-9064 or (604) 552-6200
CINA, Inc.
P.O. Box 4872
Mountain View, CA 94040
(415) 940-1723
Data I/O Corporation
10525 Willows Road N.E.
P.O. Box 97046
Redmond, WA 98073-9746
(800) 332-8246 or (206) 881-6444
iNt GmbH
Busenstrasse 6
D-8033 Martinsried, Munich, Germany
(89) 857-6667
ISDATA GmbH
Daimlerstr. 51
D7500 Karlsruhe 21 Germany
Germany: 0721/75 10 87
U.S.: (510) 531-8553
Logic Modeling
19500 NW Gibbs Dr.
P.O. Box 310
Beaverton, OR 97075
(503) 690-6900
Logical Devices, Inc.
692 S. Military Trail
Deerfield Beach, FL 33442
(800) 331-7766 or (305) 428-6868
MACHXL Software
Ver. 2.0
ComposerPICTM Designer
(Requires MACH Fitter)
Verilog, LeapFrog, RapidSim Simulators
(Models also available from Logic Modeling)
Ver. 3.3
LOG/iCTM Software
(Requires MACH Fitter)
ABELTM-5 Software
(Requires MACH Fitter)
SynarioTM Software
MacABELTM Software
(Requires SmartPart MACH Fitter)
AMD-ABEL Software
Data I/O MACH Fitters
PROdeveloper/AMD
Software
PROsynthesis/AMD Software
Design Center/AMD
Software
SmartModelLibrary
SmartCAT Circuit Analyzer
PLDSim 90
CUPLTM Software
AMD
47MACH210-7/10/12/15/20, Q-12/15/20
MANUFACTURER TEST GENERATION SYSTEM
Acugen Software, Inc.
427-3 Amherst St., Suite 391
Nashua, NH 03063
(603) 891-1995
iNt GmbH
Busenstrasse 6
D-8033 Martinsried, Munich, Germany
(87) 857-6667
DEVELOPMENT SYSTEMS (subject to change) (continued)
Advanced Micro Devices is not responsible for any information relating to the products of third parties. The inclusion of such information is not a representation nor
an endorsement by AMD of these products.
ATGENTM Test Generation Software
MultiSIM Interactive Simulator
LASAR
PLDCheck 90
MANUFACTURER SOFTWARE DEVELOPMENT SYSTEMS
Mentor Graphics Corp.
8005 S.W. Boeckman Rd.
Wilsonville, OR 97070-7777
(800) 547-3000 or (503) 685-7000
MicroSim Corp.
20 Fairbanks
Irvine, CA 92718
(714) 770-3022
MINC Incorporated
6755 Earl Drive, Suite 200
Colorado Springs, CO 80918
(800) 755-FPGA or (719) 590-1155
OrCAD
3175 N.W. Aloclek Dr.
Hillsboro, OR 97124
(503) 690-9881
SUSIE–CAD
10000 Nevada Highway, Suite 201
Boulder City, NV 89005
(702) 293-2271
Teradyne EDA
321 Harrison Ave.
Boston, MA 02118
(800) 777-2432 or (617) 422-2793
Viewlogic Systems, Inc.
293 Boston Post Road West
Marlboro, MA 01752
(800) 442-4660 or (508) 480-0881
Programmable Logic Design Tools 386+
Schematic Design Tool 386+
Digital Simulation Tools
ViewPLD or PROPLD
(Requires PROSim Simulator MACH Fitter)
ViewSim Simulator
(Models for ViewSim also available
from Logic Modeling)
PLDesignerTM-XL Software
(Requires MACH Fitter)
PLDSynthesisTM
(Requires MACH Fitter)
QuickSim Simulator
(Models also available from Logic Modeling)
Design Center Software
(Requires MACH Fitter)
SUSIETM Simulator
AMD
MACH210-7/10/12/15/20, Q-12/15/2048
APPROVED PROGRAMMERS (subject to change)
For more information on the products listed below, please consult the AMD FusionPLD Catalog.
MANUFACTURER PROGRAMMER CONFIGURATION
Advin Systems, Inc.
1050-L East Duane Ave.
Sunnyvale, CA 94086
(408) 243-7000
BP Microsystems
100 N. Post Oak Rd.
Houston, TX 77055-7237
(800) 225-2102 or (713) 688-4600
Data I/O Corporation
10525 Willows Road N.E.
P.O. Box 97046
Redmond, WA 98073-9746
(800) 332-8246 or (206) 881-6444
Logical Devices Inc./Digelec
692 S. Military Trail
Deerfield Beach, FL 33442
(800) 331-7766 or (305) 428-6868
SMS North America, Inc.
16522 NE 135th Place
Redmond, WA 98052
(800) 722-4122
or
SMS
lm Grund 15
D-7988 Vangen Im Allgau, Germany
07522-5018
Stag Microsystems Inc.
1600 Wyatt Dr. Suite 3
Santa Clara, CA 95054
(408) 988-1118
or
Stag House
Martinfield, Welwyn Garden City
Herfordshire UK AL7 1JT
707-332148
System General
510 S. Park Victoria Dr.
Milpitas, CA 95035
(408) 263-6667
or
3F, No. 1, Alley 8, Lane 45
Bao Shing Rd., Shin Diau
Taipei, Taiwan
2-917-3005
BP1200
Pilot U84
Model 3900
Turpro-1
UniSiteTM AutoSite
Stag Quazar
Sprint/Expert
ALLPROTM–88
MANUFACTURER PROGRAMMER CONFIGURATION
Corelis, Inc.
12607 Hidden Creek Way, Suite H
Cerritos, California 70703
(310) 926-6727
Advanced Micro Devices
P.O. Box 3453, MS-1028
Sunnyvale, CA 94088-3453
(800) 222-9323
MACHpro
JTAG PROG
APPROVED ON-BOARD PROGRAMMERS
AMD
49MACH210-7/10/12/15/20, Q-12/15/20
PROGRAMMER SOCKET ADAPTERS (subject to change)
MANUFACTURER PART NUMBER
EDI Corporation
P.O. Box 366
Patterson, CA 95363
(209) 892-3270
Emulation Technology
2344 Walsh Ave., Bldg. F
Santa Clara, CA 95051
(408) 982-0660
Logical Systems Corp.
P.O. Box 6184
Syracuse, NY 13217-6184
(315) 478-0722
Procon Technologies, Inc.
1333 Lawrence Expwy, Suite 207
Santa Clara, CA 95051
(408) 246-4456
Contact Manufacturer
Contact Manufacturer
Contact Manufacturer
Contact Manufacturer
AMD
MACH210-7/10/12/15/20, Q-12/15/2050
PHYSICAL DIMENSIONS*
PL 044
44-Pin Plastic Leaded Chip Carrier (measured in inches)
TOP VIEW
SEATING PLANE
.685
.695 .650
.656
Pin 1 I.D.
.685
.695
.650
.656
.026
.032 .050 REF
.042
.056
.062
.083
.013
.021
.590
.630
.500
REF
.009
.015
.165
.180
.090
.120 16-038-SQ
PL 044
DA78
6-28-94 ae
SIDE VIEW
AMD
51MACH210-7/10/12/15/20, Q-12/15/20
PHYSICAL DIMENSIONS*
PQT044
44-Pin Thin Quad Flat Pack (measured in millimeters)
1.00 REF.
1.20 MAX
11° – 13°
11° – 13°
0.80 BSC
44
1
0.95
1.05
0.30
0.45
11.80
12.20
9.80
10.20
11.80
12.20
9.80
10.20
16-038-PQT-2_AH
PQT 44
5-4-95 ae
*For reference only. BSC is an ANSI standard for Basic Space Centering.
Trademarks
Copyright 1995 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, MACH, and PAL are registered trademarks of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
