MXC6226XU-B - Memsic Inc.

Powerful Sensing Solutions for a Better Life

MXC6226XU - DTOS Accelerometer

One Technology Drive, Suite 325 Andover, MA 01810, USA

Tel: +1 978 738 0900 Fax: +1 978 738 0196

www.memsic.com

July 23, 2013

Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its

use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by

implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o

MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.

Document Version 1.3

Page 1 of 15

DTOS ACCELEROMETER

Digital Thermal Orientation Sensing Accelerometer

MXC6226XU

Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER

MXC6226XU: Fully Integrated Thermal Acceleromete

MXC6226XU - DTOS Accelerometer

One Technology Drive, Suite 325 Andover, MA 01810, USA

Tel: +1 978 738 0900 Fax: +1 978 738 0196

www.memsic.com

July 23, 2013

Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its

use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by

implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o

MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.

Document Version 1.3

Page 2 of 15

Features

 Fully Integrated Thermal Accelerometer

 X/Y Axis, 8 bit, Acceleration A/D Output (± 2g)

 Absolute 0G offset less than +/- 50mg

 4-position Orientation Detecti on

 Shake Detection with Interrupt

 Programmable Shake Threshold

 Shake Direction Detection

 I2C Interface

 Power Down Mode

 Shock Survival Greater than 50,000 g

 Operating Supply Voltage from 2.5V to 5.5V with

1.8V compatible I/O

 Produces no Mechanical Sounds ("click")

 Package Size 3x3x1mm

Applications

 Consumer:

Cell Phones

Digital Still Cameras (DSC)

Digital Video Cameras (DVC)

LCD TV

Toys

MP3, MP4 Players

 Household Safety:

Fan Heaters

Halogen Lamps

Iron

Cooling Fans

General Description

The MEMSIC Digital Thermal Orientation Sensor (DTOS) is the world's first

fully-integrated orientation sensor. Its operation is based on our patented

MEMS-thermal technology and is built using a standard 0.18um CMOS process.

DTOS contains no moving parts (such as a ball) and thus eliminates field-reliability

and repeatability issues associated with competitive products. It also eliminates the

"click" sounds typically heard in ball based orientation sensors. Shock survival is

greater than 50,000g. DTOS detects four orientations, shake and shake direction.

In addition, it provides X/Y axis acceleration signals with very low 0g offset. An I2C

interface is used to communicate with this device and an interrupt pin (INT) is

provided for shake and orientation. The DTOS also has a power down enabled

through the I2C interface.

Functional Block Diagram

Figure 1

The DTOS is packaged in a hermetically sealed 6-pin surface mount package (3 mm

x 3 mm x 1mm); the product is RoHS compatible and operates over -20~70℃

temperature range.

Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER

MXC6226XU: Fully Integrated Thermal Acceleromete

MXC6226XU - DTOS Accelerometer

One Technology Drive, Suite 325 Andover, MA 01810, USA

Tel: +1 978 738 0900 Fax: +1 978 738 0196

www.memsic.com

July 23, 2013

Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its

use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by

implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o

MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.

Document Version 1.3

Page 3 of 15

Figure 2

Top View

Figure 3

Side View

Figure 4

Bottom View

LCC6 Package Drawing Package Thickness:

1.05mm +/- 0.1mm

Pin Description: LCC6 Package

Pin Name Description

1 INT This pin is the DTOS interrupt output. The logic level on this pin reflects the state of the INT bit in the STATUS

register. INT is set w hen t he or i en t ation differs fro m the l ast or i en t a t io n r ea d by the processo r, or a shake event

is detected. INT is cleared upon reading of the STATUS register.

2 NC During normal operation, this pin must be left floating.

3 VDD This is the power supply input. The DC voltage should be between 2.5 and 5.5 volts.

4 I2C SCL This pin is the s er ial clock line for th e I2C i n te r face. Since the DTOS only oper ates as a slave device, this pin is

always an input.

5 I2C SDA This pin is the serial data line for the I2C interface. It is an I/O pin that functions as an input during a write, and

an output during a read from the DTOS.

6 GND This is the ground pin for the DTOS.

Absolute Maximum Ratings*

Supply Voltage (VDD) ………………...-0.5 V to +7.0V

Storage Temperature ………………..-40°C to +150°C

Acceleration ……………………………… ……..50, 000 g

*Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress

rating only; the functional operation of the device at these or any other conditions above those indicated in the operational

sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Electrical Specifications1

Parameter (Units) Conditions Minimum Typical Maximum

Operating Voltage Range (V) 2.5 5.5

VIO(I2C interface)(V) 1.62 1.8 VDD

Supply Current (mA) In power-up mode 1.2

In power-down mode 0.0004 0.001

Turn-On Ti me (ms)2 300 500

Turn-off Ti me (ms) 0.5

Operating Temperature Range (℃) -20 +70

VDD Rise Time (ms)3 10

Notes: 1 All specifications are at 3V and room temperature unless otherwise noted. 2 Time to obtain valid data after existing

power-down mode. 3 Maximum allowable power supply rise time from 0.25V to 2.5V (minimum). Slower VDD rise time may cause

erroneous data retrieval from OTP memory at power-up.

Sensor Characteristics1

Parameter (Units) Conditions Minimum Typical Maximum

Measurement Range (g) X/Y Axis ± 2.0

Alignment Error (°) X/Y Axis ± 1.0 ± 2.0

Sensitivity Error (%) X/Y Ax is -5 0 5

Sensitivity (LSB/g) X/Y Axis 64

Sensitivity Drift Over Temperature (%) Delta from 25 ℃ (-20 ℃ - 70 ℃) ± 12 ± 18

Zero g Offset Bias Level (mg) X/Y Axis (25 ℃) -30 +30

Zero g Offset Temperature coefficient (mg/℃) X/Y Axis (-20 ℃ - 70 ℃) 0.3

3dB Signal Bandwidth (Hz) 10

Notes: 1 All specifications are at 3V and room temperature unless otherwise noted.

Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER

MXC6226XU: Fully Integrated Thermal Acceleromete

MXC6226XU - DTOS Accelerometer

One Technology Drive, Suite 325 Andover, MA 01810, USA

Tel: +1 978 738 0900 Fax: +1 978 738 0196

www.memsic.com

July 23, 2013

Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its

use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by

implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o

MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.

Document Version 1.3

Page 4 of 15

Figure 5

Digit al Parameters

Symbol Parameter (Units) Minimum Typical Maximum

VIH High Level Input Voltage (Volts) 0.7*VIO

VIL Low Level Input Voltage (Volts) 0.3*VIO

VHYS Hysteresis of Schmitt Trigger Input (Volts) 0.1

IIL Input Leakage, All Inputs (uA) -10 10

VOH High Level Output Voltage (Volts) 0.8*VIO

VOL Low Level Output Vo ltage (Volts) 0.2*VIO

Digit al Switching Characteristics

Symbol Parameter (Units) Minimum Typical Maximum

top Operating Valid Time (ms)1 20

fSCL SCK Clock Frequency (kHz) 0 400

tr Rise Time (us) 0.3

tf Fall Time (us) 0.3

tlow SCL Low Time (us) 1.3

thigh SCL High Time (us) 0.6

tHD;D Data Hold Time (us) 0 0.9

tSU;D Data Set-Up Time (us) 0.1

tSU;S Start Set-Up Time (us) 0.6

tHD;S Start Hold Time (us) 0.6

tSU;P Stop Set-Up Time (us) 0.6

tBF Bus Free Time Between Star t a nd Stop (us) 1.3

Notes: 1 Time to operate DTOS through I2C interface after power being supplied to VDD. 2. It is not recommended to keep both

SCL and SDA signals low for over 10ms.

VDD

SDA

SCL

top

tHD;S

tlow tr

tHD;D

tSU;D

thigh tSU;S

tSU;P

tBF

P S

Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER

MXC6226XU: Fully Integrated Thermal Acceleromete

MXC6226XU - DTOS Accelerometer

One Technology Drive, Suite 325 Andover, MA 01810, USA

Tel: +1 978 738 0900 Fax: +1 978 738 0196

www.memsic.com

July 23, 2013

Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its

use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by

implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o

MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.

Document Version 1.3

Page 5 of 15

Circuit Schematics

Figure 6

Note:

 R1 and R2 are pull-up resistors, the value can be

determined by customer according to the requirement of

the host device, and the recommendation value is

2.7KOhm.

 INT does not need any pull-up/pull-down resistor

 If INT is not used, keep it disconnected (don't pull up or

pull down)

 Leave NC pin as no connection.

Landing Pattern (Unit: mm)

1 INT

2 NC

3 VDD

6 GND

5 SDA

4 SCL

Figure 7

Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER

MXC6226XU: Fully Integrated Thermal Acceleromete

MXC6226XU - DTOS Accelerometer

One Technology Drive, Suite 325 Andover, MA 01810, USA

Tel: +1 978 738 0900 Fax: +1 978 738 0196

www.memsic.com

July 23, 2013

Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its

use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by

implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o

MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.

Document Version 1.3

Page 6 of 15

Reflow Profile

Figure 8

Reflow Profile

Note:

 Reflow is limited to two cycles.

 If a second reflow cycle is implemented, it should be applied

only after device has cooled down to 25℃ (room temperature)

 Figure 8 is the reflow profile for Pb free process

 The peak temperature on the sensor surface must be limited

to under 260℃ for 10 seconds.

 Follow solder paste supplier’s recommendations for the best

SMT quality.

Manual Soldering

Figure 9

‘606’ is the laser marking designating the product type, and ‘xxx’ is the lot number

Note:

 When soldering manually or repairing via soldering iron for the

DTOS, the time must be limited to less than 10 seconds and

the temperature must not exceed 275℃. If a heat gun is used,

the time must be limited to less than 10seconds and the

temperature must not exceed 270℃

 Avoid bending the PCB after the sensor assembly

Low Temperature Glass

Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER

MXC6226XU: Fully Integrated Thermal Acceleromete

MXC6226XU - DTOS Accelerometer

One Technology Drive, Suite 325 Andover, MA 01810, USA

Tel: +1 978 738 0900 Fax: +1 978 738 0196

www.memsic.com

July 23, 2013

Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its

use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by

implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o

MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.

Document Version 1.3

Page 7 of 15

Orientation State Bits OR [1,0]

Gravity direction

Figure 10

Orient ation/Shake Characteristics

DTOS Output state response to orientation

If the sensor is rotated past the 45 degree threshold, the orientation bits will change only if the

sensor stays in the same state for a defined period of time. If the sensor crosses back before this

time period, the orientation bits remain unchanged. This is to prevent dithering of the orientation

state. Four user programmable hysteresis time periods are available: 160, 320, 640 and 1280ms.

Figure 11 Figure 12

DTOS can detect orientation changes with up to 60 degrees of off-axis tilt

DTOS Shake Detection

Shake and shake direction are orthogonal to screen orientation. An interrupt pin (INT) is set high

and must be cleared by the MCU via the I2C interface. Four user programmable thresholds are

available: 0.5g, 1g, 1.5g and 2g, , and these can be applied either to the X-axis, Y-axis, or both

axes.

Figure 13

Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER

MXC6226XU: Fully Integrated Thermal Acceleromete

MXC6226XU - DTOS Accelerometer

One Technology Drive, Suite 325 Andover, MA 01810, USA

Tel: +1 978 738 0900 Fax: +1 978 738 0196

www.memsic.com

July 23, 2013

Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its

use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by

implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o

MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.

Document Version 1.3

Page 8 of 15

DTOS I2C Interface

A slave mode I2C interface, capable of operating in standard or fast mode, is implemented on the DTOS. The interface uses a serial data line (SDA)

and a serial clock line (SCL) to achieve bi-directional communication between master and slave devices. A master (typically a microprocessor)

initiates all data transfers to and from the device, and generates the SCL clock that synchronizes the data transfer. The SDA pin on the DTOS

operates both as an input and an open drain output. Since the DTOS only operates as a slave device, the SCL pin is always an input. There are

external pull-up resistors on the I2C bus lines. Devices that drive the I2C bus lines do so through open-drain n-channel driver transistors, creating a

wired NOR type arrangement.

Data on SDA is only allowed to change when SCL is low. A high to low transition on SDA when SCL is high is indicative of a START condition,

whereas a low to high transition on SDA when SCL is high is indicative of a STOP condition. When t he interface is not busy, both SCL and SDA are

high. A data transmission is initiated by the master pulling SDA low while SCL is high, generating a START condition. The data transmission occurs

serially in 8 bit bytes, with the MSB transmitted first. During each byte of transmitted data, the master will generate 9 clock pulses. The first 8 clock

pulses are used to clock the data, the 9th clock pulse is for the acknowledge bit. After the 8 bits of data are clocked in, the transmitting device

releases SDA, and the receiving device pulls it down so that it is stable low during the entire 9th clock pulse. By doing this, the receiving device

"acknowledges" that it has received the transmitted byte. If the slave receiver does not generate an acknowledge, then the master device can

generate a STOP condition and abort the transfer. If the master is the receiver in a data transfer, then it must signal the end of data to the slave by not

generating an acknowledge on the last byte that was clocked out of the slave. The slave must release SDA to allow the master to generate a STOP or

repeated START condition.

The master initiates a data transfer by generating a START condition. After a data transmission is complete, the master may terminate the data

transfer by generating a STOP condition. The bus is considered to be free again a certain time after the STOP condition. Alternatively, the master can

keep the bus busy by generating a repeated START condition instead of a STOP condition. This repeated START condition is functionally identical to

a START condition that follows a STOP. Each device that sits on the I2C bus has a unique 7-bit address.

The first byte transmitted by the master following a START is used to address the slave device.

The first 7 bits contain the address of the slave device, and the 8th bit is the R/W* bit (read = 1, write = 0; the asterisk indicates active low, and is used

instead of a bar). If the transmitted address matches up to that of the DTOS, then the DTOS will acknowledge receipt of the address, and prepare to

receive or send data.

If the master is writing to the DTOS, then the next byte that the DTOS receives, following the address byte, is loaded into the address counter internal

to the DTOS. The contents of the address counter indicate which register on the DTOS is being accessed. If the master now wants to write data to the

DTOS, it just continues to send 8-bit bytes. Each byte of data is latched into the register on the DTOS that the address counter points to. The address

counter is incremented after the transmission of each byte.

If the master wants to read data from the DTOS, it first needs to write the address of the register it wants to begin reading data fro m to the DTOS

address counter. It does this by generating a START, followed by the address byte containing the DTOS address, with R/W* = 0. The next transmitted

byte is then loaded into the DTOS address counter. Then, the master repeats the START condition and re-transmits the DTOS address, but this time

with the R/W* bit set to 1. During the next transmission period, a byte of data from the DTOS register that is addressed by the contents of the address

counter will be transmitted from the DTOS to the master. As in the case of the master writing to the DTOS, the contents of the address counter will be

incremented after the transmission of each byte. The prot ocol for m ultiple byte reads and writes bet ween a master and a slave d evice is depicted in

Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER

MXC6226XU: Fully Integrated Thermal Acceleromete

MXC6226XU - DTOS Accelerometer

One Technology Drive, Suite 325 Andover, MA 01810, USA

Tel: +1 978 738 0900 Fax: +1 978 738 0196

www.memsic.com

July 23, 2013

Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its

use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by

implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o

MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.

Document Version 1.3

Page 9 of 15

Figure 14.

Figure 14

The 7-bit I2C address for DTOS is set as 0010110b.

Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER

MXC6226XU: Fully Integrated Thermal Acceleromete

MXC6226XU - DTOS Accelerometer

One Technology Drive, Suite 325 Andover, MA 01810, USA

Tel: +1 978 738 0900 Fax: +1 978 738 0196

www.memsic.com

July 23, 2013

Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its

use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by

implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o

MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.

Document Version 1.3

Page 10 of 15

User Register Summary

Address Name Definition Access Default

$00 XOUT 8-bit x-axis acceleration output read 00000000

$01 YOUT 8-bit y-axis acceleration output read 00000000

$02 STATUS orientation and shake status read 00000000

$04 DETECTION Power down, ori entation and shake detection parameters write 00000000

$08 CHIP_ID Chip ID of MXC6226XU read xx100110

The registers available to the user on the DTOS are summarized in the table above. Each register contains 8 bits.

$00: XOUT – 8-bit x-axis acceleration output (read only)

D7 D6 D5 D4 D3 D2 D1 D0

XOUT[7] XOUT[6] XOUT[5] XOUT[4] XOUT[3] XOUT[2] XOUT[1] XOUT[0]

8-bit x-axis acceleration output. Data in 2's complement format with range of -128 to +127.

$01: YOUT – 8-bit y-axis acceleration output (read only)

D7 D6 D5 D4 D3 D2 D1 D0

YOUT[7] YOUT[6] YOUT[5] YOUT[4] YOUT[3] YOUT[2] YOUT[1] YOUT[0]

8-bit y-axis acceleration output. Data in 2's complement format with range of -128 to +127.

$02: STATUS – orientation and shake status register (read only)

D7 D6 D5 D4 D3 D2 D1 D0

INT SH[1] SH[0] TILT ORI[1] ORI[0] OR[1] OR[0]

OR[1:0] is a 2-bit indication of the device orientation, according to the following scheme (also shown visually in Figure 10): OR[1:0] = 00 – device is

vertical in upright orientation; 01 – device is rotated 90 degrees clockwise; 10– device is vertical in inverted orientation; 11 – device is rotated 90

degrees counterclockwise. The bits OR[1:0] are indicative of "long-term" orientation. The orientation is determined by measuring the signs of the

quantities ax – ay, and ax + ay, as shown in Figure 12. The orientation measurement is ignored for any samples in which the magnitudes of ax and ay

are both less than 3/8 g (for example, during a free-fall event). In order for a new value of OR[1:0] to be written to the STATUS register, a valid

measurement of the new orientation must be measured a consecutive number of times determined by the setting of bits ORC[1:0] in the DETECTION

register. This provides a low-pass filtering and hysteresis effect that keeps a display from flickering near orientation boundaries.

ORI[1:0] is the instantaneous device orientation. It follows the same scheme as OR[1:0], except that it is updated every time a valid orientation

measurement is made, not subject to the same low-pass filtering as OR[1:0].

TILT is an indication of whether there is enough acceleration signal strength to make a valid orientation measurement. If TILT = 0, the orientation

measurement is valid, if TILT = 1, then the orientation measurement is invalid. TILT is updated every measurement cycle.

SH[1:0] indicate whether a shake event has taken place, and if so, its direction. Shake can only be detected in a direction perpendicular to the vertical

Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER

MXC6226XU: Fully Integrated Thermal Acceleromete

MXC6226XU - DTOS Accelerometer

One Technology Drive, Suite 325 Andover, MA 01810, USA

Tel: +1 978 738 0900 Fax: +1 978 738 0196

www.memsic.com

July 23, 2013

Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its

use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by

implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o

MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.

Document Version 1.3

Page 11 of 15

orientation of the device. When an acceleration perpendicular to the device orientation (ax for OR[1:0] = 01 or 11; ay for OR[1:0] = 00 or 10) is sensed

that has a magnitude greater than the value set by bits SHTH[1:0] in the DETECTION register, then shake detection begins. For a shake event to be

written to SH[1:0], the perpendicular acceleration must again exceed the magnitude set by SHTH[1:0] but with the opposite sign (if bit SHM = 0 in the

DETECTION register), or just reverse its sign (if bit SHM = 1 in the DETEC TION register). The above mentioned second acceleration events must

occur within a certain amount of time, set by SHC[1:0] in the DETECTION register, of the original breaking of the threshold.

If a shake is determined to have occurred, then th e direction of the shake can be determined b y the signs of the accelerations. The shake status is

indicated as shown in the following table:

SH[1] SH[0] Comment

0 0 no shake event

0 1 shake left

1 0 shake right

1 1 undefined

INT is the interrupt bit. Setting this bit high will cause the INT pin to output a high level. The INT bit will be set whenever either (1) The orientation, as

indicated by bits OR[1:0] changes, or (2) A shake event occurs. The microprocessor can then service the interrupt by reading the STATUS register.

Once a shake event occurs, no new shake events will be recorded until the interrupt has been serviced, although the orientation bits will continue to

be updated. The INT bit is cleared by reading the STATUS register.

$04: DETECTION – orientation and shake detection parameters (write only)

D7 D6 D5 D4 D3 D2 D1 D0

PD SHM SHTH[1] SHTH[0] SHC[1] SHC[0] ORC[1] ORC[0]

PD = 1 powers down the DTOS to a non-functional low power state with a maximum current drain of 1 uA.

ORC[1:0] sets the orientation hysteresis time period, which is the time period of consecutive valid new instantaneous orientation measurements that

must be made before a new orientation value is written into bits OR[1:0] in the STATUS register. The "long-term" orientation change is set by

ORC[1:0] as follows: 00 – 160ms, 01 – 320ms, 10 – 640ms, 11 – 1280ms nominally.

SHC[1:0] sets the shake events time window, which determines the time window allowed bet ween the first shake event (perpendicular acceleration

exceeding the threshold set by SHTH[1:0]) and the second shake event (acceleration breaking the threshold with opposite sign, SHM = 0, or just

reversing sign, SHM = 1). The time window is set by SHC[1:0] as follows: 00 – 80ms, 01 – 160ms, 10 – 320ms, 11 – 640ms nominally.

SHTH[1:0] sets the shake threshold that the perpendicular acceleration must exceed to trigger the first shake event. The settings for SHTH[1:0] are:

00 - 0.5 g, 01 – 1.0 g, 10 – 1.5 g, 11 – 2.0 g.

SHM is the shake mode bit. If SHM = 0, then for a shake to be detected, and written to SH[1:0] in the STATUS register, the second shake event must

break the threshold set by SHTH[1:0] with the opposite sign of the first shake event, within the time window set by SHC[1:0]. If SHM = 1, then the

second shake event must just have the opposite sign of the first shake event within the time window set by SHC[1:0].

$08 (6LSB): CHIP_ID – Chi p ID of MXC6226XU (read only)

D7 D6 D5 D4 D3 D2 D1 D0

Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER

MXC6226XU: Fully Integrated Thermal Acceleromete

MXC6226XU - DTOS Accelerometer

One Technology Drive, Suite 325 Andover, MA 01810, USA

Tel: +1 978 738 0900 Fax: +1 978 738 0196

www.memsic.com

July 23, 2013

Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its

use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by

implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o

MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.

Document Version 1.3

Page 12 of 15

ID[7] ID[6] ID[5] ID[4] ID[3] ID[2] ID[1] ID[0]

X X 1 0 0 1 1 0

Device identification register (6LSB) which is set as 26h for MXC6226XU.

Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER

MXC6226XU: Fully Integrated Thermal Acceleromete

MXC6226XU - DTOS Accelerometer

One Technology Drive, Suite 325 Andover, MA 01810, USA

Tel: +1 978 738 0900 Fax: +1 978 738 0196

www.memsic.com

July 23, 2013

Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its

use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by

implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o

MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.

Document Version 1.3

Page 13 of 15

Sensitivity/Offset Distribution (@ 25 , VDD = 3V)℃

OffsetX Distribution

100

200

300

400

500

600

700

800

900

1000

-24 -16 -9 -1 6 14 21

Offset(mg)

Frequency

Figure 15

OffsetY Distribution

100

200

300

400

500

600

700

800

900

1000

-24 -16 -9 -1 6 14 21

Offset(mg)

Frequency

Figure 16

SenX Distribution

100

200

300

400

500

600

700

800

61 62 63 64 65 66 67

Sen(LSB/g)

Frequency

Figure 17

Se nY Distri bu tion

100

200

300

400

500

600

700

800

61 62 63 64 65 66 67

Sen(LSB/g)

Frequency

Figure 18

Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER

MXC6226XU: Fully Integrated Thermal Acceleromete

MXC6226XU - DTOS Accelerometer

One Technology Drive, Suite 325 Andover, MA 01810, USA

Tel: +1 978 738 0900 Fax: +1 978 738 0196

www.memsic.com

July 23, 2013

Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its

use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by

implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o

MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.

Document Version 1.3

Page 14 of 15

Over Temperature Characteristics

Normalized OffX TC

-25

-20

-15

-10

-5

-40 -20 0 20 40 60 80

Temp(degC)

OffX(mg)

Figure 19

Normali zed OffY TC

-25

-20

-15

-10

-5

-40-200 20406080

Temp(degC)

OffY(mg)

Figure 20

No r m alized SenX TC

-0.02

0.00

0.02

0.04

0.06

0.08

0.10

0.12

0.14

0.16

0.18

-40-200 20406080

Temp(degC)

SenX

Figure 21

Normalized SenY TC

-0.02

0.00

0.02

0.04

0.06

0.08

0.10

0.12

0.14

0.16

0.18

-40-200 20406080

Temp(degC)

SenY

Figure 22

Powerful Sensing Solutions for a Better Life DTOS ACCELEROMETER

MXC6226XU: Fully Integrated Thermal Acceleromete

MXC6226XU - DTOS Accelerometer

One Technology Drive, Suite 325 Andover, MA 01810, USA

Tel: +1 978 738 0900 Fax: +1 978 738 0196

www.memsic.com

July 23, 2013

Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its

use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by

implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property o

MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.

Document Version 1.3

Page 15 of 15

Device Marking Illustration

Figure 23