LMK01000
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LMK01000 Family LMK01000 Family 1.6 GHz High Performance Clock Buffer, Divider, and
Distributor
Check for Samples: LMK01000
1FEATURES • 3.15 to 3.45 V operation
• Package: 48 pin LLP (7.0 x 7.0 x 0.8 mm)
2• 30 fs additive jitter (100 Hz to 20 MHz)
• Dual clock inputs LVDS LVPECL
Device
• Programmable output channels (0 to 1600 Outputs Outputs
MHz) LMK01000 3 5
• External synchronization LMK01010 8 0
LMK01020 0 8
• Pin compatible family of clocking devices
TARGET APPLICATIONS
• High performance Clock Distribution
• Wireless Infrastructure
• Medical Imaging
• Wired Communications
• Test and Measurement
• Military / Aerospace
DESCRIPTION
The LMK01000 family provides an easy way to divide and distribute high performance clock signals throughout
the system. These devices provide best-in-class noise performance and are designed to be pin-to-pin and
footprint compatible with LMK03000/LMK02000 family of precision clock conditioners.
The LMK01000 family features two programmable clock inputs (CLKin0 and CLKin1) that allow the user to
dynamically switch between different clock domains.
Each device features 8 clock outputs with independently programmable dividers and delay adjustments. The
outputs of the device can be easily synchronized by an external pin (SYNC*).
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2008–2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
CLKin0
CLKin0*
CLKout0
CLKout0*
CLKout1
CLKout1*
CLKout2
CLKout2*
CLKout3
CLKout3*
CLKout4
CLKout4*
CLKout5
CLKout5*
CLKout6
CLKout6*
CLKout7
CLKout7*
Divider
Delay
Mux
Divider
Delay
Mux
Divider
Delay
Mux
Divider
Delay
Mux
Divider Delay Mux
Divider Delay Mux
Divider Delay Mux
Divider Delay Mux
Distribution Path CLK
DATA
LE
Control
Registers
PWire
Port Device
Control
GOE
SYNC*
CLKin1
CLKin1*
Low Clock Buffers
High Clock Buffers
Mux
LMK010x0
Clock Divider and
Distributor CLKout7
CLKout4
CLKout1
CLKout0 Serializer/
Deserializer
LMX2531
PLL+VCO
ADC
FPGA
CLKin0
CLKin1
LMK010x0
Clock Divider and
Distributor CLKout7
CLKout0
LMX2531
PLL+VCO
ADC
CLKin1
ADC
LMK01000
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System Diagram
Functional Block Diagram
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GND
NC
Vcc1
Vcc2
Vcc3
Vcc4
Vcc5
Vcc6
Vcc7
Vcc8
Vcc9
Vcc10
Vcc11
Vcc12
Vcc13
Vcc14
CLKPWire
DATAPWire
LEPWire
NC
NC
NC
GOE
Test
CLKout0
CLKout0*
CLKout1
CLKout1*
CLKout2
CLKout2*
CLKout3
CLKout3*
GND
SYNC*
CLKin0
CLKin0*
NC
CLKin1
CLKin1*
Bias
CLKout4
CLKout4*
CLKout5
CLKout5*
CLKout6
CLKout6*
CLKout7
CLKout7*
4748 46 45 44 43 42 41 40 39 38 37
11
12
10
9
8
7
6
5
4
3
2
1
1413 15 16 17 18 19 20 21 22 23 24
26
25
27
28
29
30
31
32
33
34
35
36
DAP
LLP-48
Top Down View
LMK01000
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Connection Diagram
Figure 1. 48-Pin LLP Package
Pin Functions
Pin Descriptions
Pin # Pin Name I/O Description
1, 25 GND - Ground
2, 7, 9,10, 32 NC - No Connect. Pin is not connected to the die.
3, 8, 13, 16, 19, 22, 26, Vcc1, Vcc2, Vcc3, Vcc4, Vcc5, Vcc6, Vcc7, Vcc8, - Power Supply
30, 31, 33, 37, 40, 43, 46 Vcc9, Vcc10, Vcc11, Vcc12, Vcc13, Vcc14
4 CLKuWire I MICROWIRE Clock Input
5 DATAuWire I MICROWIRE Data Input
6 LEuWire I MICROWIRE Latch Enable Input
11 GOE I Global Output Enable
This is an output pin used strictly for test purposes
and should be not connected for normal operation.
12 Test O However, any load of an impedance of more than 1
kΩis acceptable.
14, 15 CLKout0, CLKout0* O Clock Output 0
17, 18 CLKout1, CLKout1* O Clock Output 1
20, 21 CLKout2, CLKout2* O Clock Output 2
23, 24 CLKout3, CLKout3* O Clock Output 3
27 SYNC* I Global Clock Output Synchronization
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Pin Descriptions (continued)
Pin # Pin Name I/O Description
28, 29 CLKin0,CLKin0* I CLKin 0 Input; Must be AC coupled
34, 35 CLKin1, CLKin1* I CLKin 1 Input; Must be AC coupled
36 Bias I Bias Bypass
38, 39 CLKout4, CLKout4* O Clock Output 4
41, 42 CLKout5, CLKout5* O Clock Output 5
44, 45 CLKout6, CLKout6* O Clock Output 6
47, 48 CLKout7, CLKout7* O Clock Output 7
DAP DAP - Die Attach Pad should be connected to ground.
The LMK01000 family is footprint compatible with the LMK03000/02000 family of devices. All CLKout pins are
pin-to-pin compatible, and CLKin0 and CLKin1 are equivalent to OSCin and Fin, respectively.
Device Configuration Information
Output LMK01000 LMK01010 LMK01020
CLKout0 LVDS LVDS LVPECL
CLKout1 LVDS LVDS LVPECL
CLKout2 LVDS LVDS LVPECL
CLKout3 LVPECL LVDS LVPECL
CLKout4 LVPECL LVDS LVPECL
CLKout5 LVPECL LVDS LVPECL
CLKout6 LVPECL LVDS LVPECL
CLKout7 LVPECL LVDS LVPECL
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2)
Parameter Symbol Ratings Units
Power Supply Voltage VCC -0.3 to 3.6 V
Input Voltage VIN -0.3 to (VCC + 0.3) V
Storage Temperature Range TSTG -65 to 150 °C
Lead Temperature (solder 4 s) TL+260 °C
Junction Temperature TJ125 °C
(1) "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.
(2) This device is a high performance integrated circuit with ESD handling precautions. Handling of this device should only be done at ESD
protected work stations. The device is rated to a HBM-ESD of > 2 kV, a MM-ESD of > 200 V, and a CDM-ESD of > 1.2 kV.
Recommended Operating Conditions
Parameter Symbol Min Typ Max Units
Ambient Temperature TA-40 25 85 °C
Power Supply Voltage VCC 3.15 3.3 3.45 V
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Package Thermal Resistance
Package θJA θJ-PAD (Thermal Pad)
48-Lead LLP (1) 27.4° C/W 5.8° C/W
(1) Specification assumes 16 thermal vias connect the die attach pad to the embedded copper plane on the 4-layer JEDEC board. These
vias play a key role in improving the thermal performance of the LLP. It is recommended that the maximum number of vias be used in
the board layout.
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Electrical Characteristics (1)
(3.15 V ≤Vcc ≤3.45 V, -40 °C ≤TA≤85 °C, Differential Inputs/Outputs; except as specified. Typical values represent most
likely parametric norms at Vcc = 3.3 V, TA= 25 °C, and at the Recommended Operation Conditions at the time of product
characterization and are not guaranteed).
Symbol Parameter Conditions Min Typ Max Units
Current Consumption
All outputs LMK01000 271
enabled, no LMK01010 160
divide or delay
( CLKoutX_MUX LMK01020 338
= Bypassed )
Power Supply Current
ICC (2) LVDS 17.8 mA
Per channel, no LVPECL
divide or delay (Includes
(CLKoutX_MUX 40
Emitter
= Bypassed ) Resistors)
ICCPD Power Down Current POWERDOWN = 1 1
CLKin0, CLKin0*, CLKin1, CLKin1*
fCLKin CLKin Frequency Range 1 1600 MHz
(3)(4)
SLEWCLKin CLKin Frequency Input Slew Rate V/ns
0.5
fCLKin ≤800 MHz 30 70
DUTYCLKin CLKin Frequency Input Duty Cycle %
fCLKin > 800 MHz 40 60
PCLKin Input Power Range for CLKin or CLKin* AC coupled -13 5 dBm
Clock Distribution Section--Delays
fCLKoutX ≤1 GHz
(Delay is limited to maximum 2250
programmable value)
DelayCLKout Maximum Allowable Delay(4) ps
fCLKoutX > 1 GHz 0.5/f
(Delay is limited to 1/2 of a CLKou
period) tX
Clock Distribution Section - Divides
fCLKinX ≤1300 MHz 1 510
Allowable divide range. (Note that 1 is the only
DivideCLKoutX n/a
1300 MHz < fCLKinX ≤1600
allowable odd divide value) 1 2
MHz
Clock Distribution Section - LVDS Clock Outputs
fCLKoutX =80
RL= 100 Ω200 MHz
Bandwidth = fCLKoutX =
JitterADD Additive RMS Jitter (5) 100 Hz to 20 30 fs
800 MHz
MHz fCLKoutX =
Vboost = 1 25
1600 MHz
fCLKoutX =-156
200 MHz
RL= 100 ΩfCLKoutX =
Noise Floor Divider Noise Floor(5) -153 dBc/Hz
Vboost = 1 800 MHz
fCLKoutX =-148
1600 MHz
(1) The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and
are not guaranteed.
(2) See section 3.2 for more current consumption / power dissipation calculation information.
(3) For all frequencies the slew rate, SLEWCLKin1, is measured between 20% and 80%.
(4) Specification is guaranteed by characterization and is not tested in production.
(5) The noise floor of the divider is measured as the far out phase noise of the divider. Typically this offset is 40 MHz, but for lower
frequencies this measurement offset can be as low as 5 MHz due to measurement equipment limitations. If the delay is used, then use
section 1.3.
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Electrical Characteristics (1) (continued)
(3.15 V ≤Vcc ≤3.45 V, -40 °C ≤TA≤85 °C, Differential Inputs/Outputs; except as specified. Typical values represent most
likely parametric norms at Vcc = 3.3 V, TA= 25 °C, and at the Recommended Operation Conditions at the time of product
characterization and are not guaranteed).
Symbol Parameter Conditions Min Typ Max Units
Equal loading and identical
tSKEW CLKoutX to CLKoutY (4) clock configuration -30 ±4 30 ps
RL= 100 Ω
Vboost=0 250 350 450
VOD Differential Output Voltage (6) mV
Vboost=1 390
Change in magnitude of VOD for complementary
ΔVOD RL= 100 Ω-50 50 mV
output states 1.07 1.37
VOS Output Offset Voltage RL= 100 Ω1.25 V
0 0
Change in magnitude of VOS for complementary
ΔVOS RL= 100 Ω-35 35 mV
output states
ISA Clock Output Short Circuit Current Single ended outputs shorted -24 24 mA
ISB single ended to GND
Clock Output Short Circuit Current Complementary outputs tied
ISAB -12 12 mA
differential together
Clock Distribution Section - LVPECL Clock Outputs
fCLKoutX =65
RL= 100 Ω200 MHz
Bandwidth = fCLKoutX =
JitterADD Additive RMS Jitter(5) 100 Hz to 20 25 fs
800 MHz
MHz fCLKoutX =
Vboost = 1 25
1600 MHz
fCLKoutX =-158
200 MHz
RL= 100 ΩfCLKoutX =
Noise Floor Divider Noise Floor(7) -154 dBc/Hz
Vboost = 1 800 MHz
fCLKoutX =-148
1600 MHz
Equal loading and identical
clock configuration
tSKEW CLKoutX to CLKoutY (8) -30 ±3 30 ps
Termination = 50 Ωto Vcc - 2
VVcc -
VOH Output High Voltage V
0.98
Termination = 50 Ωto Vcc - 2
VVcc -
VOL Output Low Voltage V
1.8
Vboost = 0 660 810 965
VOD Differential Output Voltage (9) mV
Vboost = 1 865
Digital LVTTL Interfaces (10)
VIH High-Level Input Voltage 2.0 Vcc V
VIL Low-Level Input Voltage 0.8 V
IIH High-Level Input Current VIH = Vcc -5.0 5.0 µA
IIL Low-Level Input Current VIL = 0 -40.0 5.0 µA
Vcc -
VOH High-Level Output Voltage IOH = +500 µA V
0.4
VOL Low-Level Output Voltage IOL = -500 µA 0.4 V
(6) See characterization plots to see how this parameter varies over frequency.
(7) The noise floor of the divider is measured as the far out phase noise of the divider. Typically this offset is 40 MHz, but for lower
frequencies this measurement offset can be as low as 5 MHz due to measurement equipment limitations. If the delay is used, then use
section 1.3.
(8) Specification is guaranteed by characterization and is not tested in production.
(9) See characterization plots to see how this parameter varies over frequency.
(10) Applies to GOE, LD, and SYNC*.
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tCES tCS
D27 D26 D25 D24
tCH tCWH tCWL
D23 D0 A3 A2 A1 A0
MSB LSB
DATAuWire
CLKuWire
LEuWire
tES
tEWH
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Electrical Characteristics (1) (continued)
(3.15 V ≤Vcc ≤3.45 V, -40 °C ≤TA≤85 °C, Differential Inputs/Outputs; except as specified. Typical values represent most
likely parametric norms at Vcc = 3.3 V, TA= 25 °C, and at the Recommended Operation Conditions at the time of product
characterization and are not guaranteed).
Symbol Parameter Conditions Min Typ Max Units
Digital MICROWIRE Interfaces (11)
VIH High-Level Input Voltage 1.6 Vcc V
VIL Low-Level Input Voltage 0.4 V
IIH High-Level Input Current VIH = Vcc -5.0 5.0 µA
IIL Low-Level Input Current VIL = 0 -5.0 5.0 µA
MICROWIRE Timing
tCS Data to Clock Set Up Time See Data Input Timing 25 ns
tCH Data to Clock Hold Time See Data Input Timing 8 ns
tCWH Clock Pulse Width High See Data Input Timing 25 ns
tCWL Clock Pulse Width Low See Data Input Timing 25 ns
tES Clock to Enable Set Up Time See Data Input Timing 25 ns
tCES Enable to Clock Set Up Time See Data Input Timing 25 ns
tEWH Enable Pulse Width High See Data Input Timing 25 ns
(11) Applies to CLKuWire, DATAuWire, and LEuWire.
Serial Data Timing Diagram
Data bits set on the DATAuWire signal are clocked into a shift register, MSB first, on each rising edge of the
CLKuWire signal. On the rising edge of the LEuWire signal, the data is sent from the shift register to the
addressed register determined by the LSB bits. After the programming is complete the CLKuWire, DATAuWire,
and LEuWire signals should be returned to a low state. The slew rate of CLKuWire, DatauWire, and LEuWire
should be at least 30 V/µs.
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Distribution
Path
SYNC*
CLKout0
CLKout1
CLKout2
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Functional Description
The LMK01000 family includes a programmable divider, a phase synchronization circuit, a programmable delay,
a clock output mux, and an LVDS or LVPECL output buffer in each channel. This allows multiple integer-related
and phase-adjusted copies of the reference to be distributed to up to eight system components.
This family of devices comes in a 48-pin LLP package that is pin-to-pin and footprint compatible with other
LMK02000/LMK03000 family of clocking devices.
BIAS PIN
To properly use the device, bypass Bias (pin 36) with a low leakage 1 µF capacitor connected to Vcc. This is
important for low noise performance.
CLKin0/CLKin0* and CLKin1/CLKin1 INPUT PORTS
The device can be driven either by the CLKin0/CLKin0* or the CLKin1/CLKin1* pins. The choice of which one to
use is software selectable. These input ports must be AC coupled. To drive these inputs in a single ended
fashion, AC ground the complementary input.
When choosing AC coupling capacitors for clock signals 0.1 µF is a good starting point, but lower frequencies
may require higher value capacitors while higher frequencies may use lower value capacitors.
CLKout DELAYS
Each individual clock output includes a delay adjustment. Clock output delay registers (CLKoutX_DLY) support a
150 ps step size and range from 0 to 2250 ps of total delay. When the delay is enabled it adds to the output
noise floor; the total additive noise is 10(log( 10^(Output Noise Floor/10) + 10^(Delay Noise Floor/10) ). Refer to
the Typical Performance Characteristics plots for the Delay Noise Floor information.
LVDS/LVPECL OUTPUTS
Each LVDS or LVPECL output may be disabled individually by programming the CLKoutX_EN bits. All the
outputs may be disabled simultaneously by pulling the GOE pin low or programming EN_CLKout_Global to 0.
GLOBAL CLOCK OUTPUT SYNCHRONIZATION
The SYNC* pin synchronizes the clock outputs. When the SYNC* pin is held in a logic low state, the divided
outputs are also held in a logic low state. When the SYNC* pin goes high, the divided clock outputs are activated
and will transition to a high state simultaneously. Clocks in the Bypassed state are not affected by SYNC* and
are always synchronized with the divided outputs.
The SYNC* pin must be held low for greater than one clock cycle of the Frequency Input port, also known as the
distribution path. Once this low event has been registered, the outputs will not reflect the low state for four more
cycles. When the SYNC* pin becomes high, the outputs will not simultaneously transition high until four more
distribution path clock cycles have passed. See the SYNC* timing diagram for further detail. In the timing
diagram below the clocks are programmed as CLKout0_MUX = Bypassed, CLKout1_MUX = Divided,
CLKout1_DIV = 2, CLKout2_MUX = Divided, and CLKout2_DIV = 4.
SYNC* Timing Diagram
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The SYNC* pin provides an internal pull-up resistor as shown on the functional block diagram. If the SYNC* pin
is not terminated externally the clock outputs will operate normally. If the SYNC* function is not used, clock
output synchronization is not guaranteed.
CONNECTION TO LVDS OUTPUTS
LMK01000 and LMK01010 LVDS outputs can be connected in AC or DC coupling configurations; however, in DC
coupling configuration, proper conditions must be presented by the LVDS receiver. To ensure such conditions,
we recommend the usage of LVDS receivers without fail-safe or internal input bias such as National
Semiconductor's DS90LV110T. The LMK01000 family LVDS drivers provide the adequate DC bias for the LVDS
receiver. We recommend AC coupling when using LVDS receivers with fail-safe or internal input bias.
CLKout OUTPUT STATES
Each clock output may be individually enabled with the CLKoutX_EN bits. Each individual output enable control
bit is gated with the Global Output Enable input pin (GOE) and the Global Output Enable bit
(EN_CLKout_Global).
All clock outputs can be disabled simultaneously if the GOE pin is pulled low by an external signal or
EN_CLKout_Global is set to 0.
CLKoutX EN_CLKout GOE pin Clock X Output State
_EN bit _Global bit
1 1 Low Low
Don't care 0 Don't care Off
0 Don't care Don't care Off
1 1 High / No Connect Enabled
When an LVDS output is in the Off state, the outputs are at a voltage of approximately 1.5 volts. When an
LVPECL output is in the Off state, the outputs are at a voltage of approximately 1 volt.
GLOBAL OUTPUT ENABLE
The GOE pin provides an internal pull-up resistor. If it is not terminated externally, the clock output states are
determined by the Clock Output Enable bits (CLKoutX_EN) and the EN_CLKout_Global bit.
POWER-ON-RESET
When supply voltage to the device increases monotonically from ground to Vcc, the power-on-reset circuit sets
all registers to their default values, which are specified in the General Programming Information section. Voltage
should be applied to all Vcc pins simultaneously.
General Programming Information
The LMK01000 family device is programmed using several 32-bit registers. The registers consist of a data field
and an address field. The last 4 register bits, ADDR[3:0] form the address field. The remaining 28 bits form the
data field DATA[27:0].
During programming, LEuWire is low and serial data is clocked in on the rising edge of clock (MSB first). When
LEuWire goes high, data is transferred to the register bank selected by the address field. Only registers R0 to R7
and R14 need to be programmed for proper device operation.
It is required to program register R14.
RECOMMENDED PROGRAMMING SEQUENCE
The recommended programming sequence involves programming R0 with the reset bit set (RESET = 1) to
ensure the device is in a default state. It is not necessary to program R0 again, but if R0 is programmed again,
the reset bit is programmed clear (RESET = 0). An example programming sequence is shown below.
• Program R0 with the reset bit set (RESET = 1). This ensures the device is in a default state. When the reset
bit is set in R0, the other R0 bits are ignored.
– If R0 is programmed again, the reset bit is programmed clear (RESET = 0).
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• Program R0 to R7 as necessary with desired clocks with appropriate enable, mux, divider, and delay settings.
• Program R14 with global clock output bit, power down setting.
– R14 must be programmed in accordance with the register map as shown in the register map (See Section
2.2).
Table 1. Register Map
Re
gis 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
ter
Data [27:0] A3 A2 A1 A0
CL
RE CLKout0 Ko CLKout0_DIV CLKout0_DLY
R0 SE 0 0 0 0 0 0 0 0 0 0 0 0 _MUX ut0 0 0 0 0
[7:0] [3:0]
T [1:0] _E
N
CL
CLKout1 Ko CLKout1_DIV CLKout1_DLY
R1 0 0 0 0 0 0 0 0 0 0 0 0 0 _MUX ut1 0 0 0 1
[7:0] [3:0]
[1:0] _E
N
CL
CLKout2 Ko CLKout2_DIV CLKout2_DLY
R2 0 0 0 0 0 0 0 0 0 0 0 0 0 _MUX ut2 0 0 1 0
[7:0] [3:0]
[1:0] _E
N
CL
CLKout3 Ko CLKout3_DIV CLKout3_DLY
R3 0 0 0 0 0 0 0 0 0 0 0 0 0 _MUX ut3 0 0 1 1
[7:0] [3:0]
[1:0] _E
N
CL
CLKout4 Ko CLKout4_DIV CLKout4_DLY
R4 0 0 0 0 0 0 0 0 0 0 0 0 0 _MUX ut4 0 1 0 0
[7:0] [3:0]
[1:0] _E
N
CL
CLKout5 Ko CLKout5_DIV CLKout5_DLY
R5 0 0 0 0 0 0 0 0 0 0 0 0 0 _MUX ut5 0 1 0 1
[7:0] [3:0]
[1:0] _E
N
CL
CLKout6 Ko CLKout6_DIV CLKout6_DLY
R6 0 0 0 0 0 0 0 0 0 0 0 0 0 _MUX ut6 0 1 1 0
[7:0] [3:0]
[1:0] _E
N
CL
CLKout7 Ko CLKout7_DIV CLKout7_DLY
R7 0 0 0 0 0 0 0 0 0 0 0 0 0 _MUX ut7 0 1 1 1
[7:0] [3:0]
[1:0] _E
N
Vb
R9000000000000001o0010101000001001
ost
EN
CL PO
_C
Kin W
LK
R1 _S ER
010out 00000000000000000000001110
4 EL DO
_G
EC W
lob
T N
al
REGISTER R0 to R7
Registers R0 through R7 control the eight clock outputs. Register R0 controls CLKout0, Register R1 controls
CLKout1, and so on. There is one additional bit in register R0 called RESET. Aside from this, the functions of
these bits are identical. The X in CLKoutX_MUX, CLKoutX_DIV, CLKoutX_DLY, and CLKoutX_EN denote the
actual clock output which may be from 0 to 7.
Table 2. Default Register Settings after Power-on-Reset
Default Bit
Bit Name Bit State Bit Description Register
Bit Value Location
RESET 0 No reset, normal operation Reset to power on defaults R0 31
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Table 2. Default Register Settings after Power-on-Reset (continued)
Default Bit
Bit Name Bit State Bit Description Register
Bit Value Location
CLKoutX_MUX 0 Bypassed CLKoutX mux mode 18:17
CLKoutX_EN 0 Disabled CLKoutX enable 16
R0 to R7
CLKoutX_DIV 1 Divide by 2 CLKoutX clock divide 15:8
CLKoutX_DLY 0 0 ps CLKoutX clock delay 7:4
CLKin_SELECT 0 CLKin1 Select CLKin0 or CLKin1 29
EN_CLKout_Global 1 Normal - CLKouts normal Global clock output enable R14 27
POWERDOWN 0 Normal - Device active Device power down 26
Reset Bit -- R0 only
This bit is only in register R0. The use of this bit is optional and it should be set to '0' if not used. Setting this bit
to a '1' forces all registers to their power-on-reset condition and therefore automatically clears this bit. If this bit is
set, all other R0 bits are ignored and R0 needs to be programmed again if used with its proper values and
RESET = 0.
CLKoutX_MUX[1:0] -- Clock Output Multiplexers
These bits control the Clock Output Multiplexer for each clock output. Changing between the different modes
changes the blocks in the signal path and therefore incurs a delay relative to the Bypassed mode. The different
MUX modes and associated delays are listed below.
CLKoutX_MUX[1:0] Mode Added Delay Relative to Bypassed Mode
0 Bypassed (default) 0 ps
1 Divided 100 ps
400 ps
2 Delayed (In addition to the programmed delay)
500 ps
3 Divided and Delayed (In addition to the programmed delay)
CLKoutX_DIV[7:0] -- Clock Output Dividers
These bits control the clock output divider value. In order for these dividers to be active, the respective
CLKoutX_MUX (See Section 2.3.2) bit must be set to either "Divided" or "Divided and Delayed" mode. After all
the dividers are programed, the SYNC* pin must be used to ensure that all edges of the clock outputs are
aligned (See Section 1.5). By adding the divider block to the output path a fixed delay of approximately 100 ps is
incurred.
The actual Clock Output Divide value is twice the binary value programmed as listed in the table below.
CLKoutX_DIV[7:0] Clock Output Divider value
0 0 0 0 0 0 0 0 Invalid
0 0 0 0 0 0 0 1 2 (default)
00000010 4
00000011 6
00000100 8
00000101 10
........ ...
11111111 510
12 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Links: LMK01000
LMK01000
www.ti.com
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
CLKoutX_DLY[3:0] -- Clock Output Delays
These bits control the delay stages for each clock output. In order for these delays to be active, the respective
CLKoutX_MUX (See Section 2.3.2) bit must be set to either "Delayed" or "Divided and Delayed" mode. By
adding the delay block to the output path a fixed delay of approximately 400 ps is incurred in addition to the
delay shown in the table below.
CLKoutX_DLY[3:0] Delay (ps)
0 0 (default)
1 150
2 300
3 450
4 600
5 750
6 900
7 1050
8 1200
9 1350
10 1500
11 1650
12 1800
13 1950
14 2100
15 2250
CLKoutX_EN bit -- Clock Output Enables
These bits control whether an individual clock output is enabled or not. If the EN_CLKout_Global bit is set to zero
or if GOE pin is held low, all CLKoutX_EN bit states will be ignored and all clock outputs will be disabled.
CLKoutX_EN bit Conditions CLKoutX State
0 EN_CLKout_Global bit = 1 Disabled (default)
GOE pin = High / No Connect 1
1 Enabled
REGISTER R9
R9 only needs to be programmed if Vboost is set to 1. Program all other bits in R9 as indicated in register map
(See Section 2.2)
Vboost - Voltage Boost Bit
Enabling this bit sets all clock outputs in voltage boost mode which increases the voltage at these outputs. This
can improve the noise floor performance of the output, but also increases current consumption, and can cause
the outputs to be too high to meet the LVPECL/LVDS specifications.
Vboost bit fCLKoutX < 1300 MHz 1300 MHz ≤fCLKoutX < 1500 1500 MHz ≤fCLKoutX ≤1600 MHz
MHz
0 Recommended to hit voltage level Insufficient voltage level for LVDS/LVPECL specifications, but saves
specifications for LVPECL/LVDS current
1 Voltage May overdrive LVPECL/LVDS Voltage is sufficient for Insufficient voltage for
specifications, but noise floor is about 2-4 dB LVDS/LEVPECL specifications. LVDS/LVPECL specifications, but
better and current consumption is increased Current consumption is still higher than when Vboost=0.
increased, but noise floor is Increased current consumption.
about the same.
Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Links: LMK01000
OSCin
LMX2531 100 pF
Fout CLKin1
DATA
CLK
LE
Microcontroller
CLK
DATA
CLKuWire
DATAuWire
LE
LEuWire
LMK010X0
100 nF
100 nF
OSCin*
LEuWire
Test
Test
VrefVCO
VregBUF
VregDIG
3.3 :4.7 PF
10 nF
0.22 :470 nF
0.22 :470 nF
10 nF
10 nF
VregPLL1
VregPLL2
CLKin1*
100 pF
3.0 V
VregVCO
VccVCO
VccDIG
VccBUF
VccPLL
Vtune
CPout
C1_LF
C2_LF
R2_LF
3.3 V
Vcc1
...
Vcc2
...
Vcc13
Vcc14
CE
Bias
SYNC*
GOE
CLKout0
CLKout0*
...
CLKout7
CLKout7*
To Other Devices
100 nF
LMK01000
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
www.ti.com
REGISTER R14
The LMK01000 family requires register R14 to be programmed as shown in the register map (See Section 2.2).
POWERDOWN Bit -- Device Power Down
This bit can power down the device. Enabling this bit powers down the entire device and all blocks, regardless of
the state of any of the other bits or pins.
POWERDOWN bit Mode
0 Normal Operation (default)
1 Entire Device Powered Down
EN_CLKout_Global Bit -- Global Clock Output Enable
This bit overrides the individual CLKoutX_EN bits. When thisbit is set to 0, all clock outputs are disabled,
regardless of thestate of any of the other bits or pins.
EN_CLKout_Global bit Clock Outputs
0 All Off
1 Normal Operation (default)
CLKin_SELECT Bit -- Device CLKin Select
This bit determines which CLKin pin is used.
CLKin bit Mode
0 CLKin1 (default)
1 CLKin0
Application Information
SYSTEM LEVEL DIAGRAM
The following shows a typical application for a LMK01000 family device. In this setup the clock may be divided,
skewed, and redistributed.
Figure 2. Typical Application
14 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Links: LMK01000
LMK01000
www.ti.com
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
CURRENT CONSUMPTION / POWER DISSIPATION CALCULATIONS (Vcc = 3.3 V, TA= 25° C)
Current Power
Power
Consumption Dissipated in
Block Condition Dissipated in
at 3.3 V LVPECL emitter
device (mW)
(mA) resistors (mW)
Core Current All outputs disabled. Includes input buffer currents. 19 62.7 -
Low clock buffer The low clock buffer is enabled anytime one of CLKout0 through 9 29.7 -
(internal) CLKout3 are enabled
High clock The high clock buffer is enabled anytime one of the CLKout4 9 29.7 -
buffer (internal) through CLKout7 are enabled
LVDS output, Bypassed mode 17.8 58.7 -
LVPECL output, Bypassed mode 40 72 60
(includes 120 Ωemitter resistors)
Output buffers LVPECL output, disabled mode 17.4 38.3 19.1
(includes 120 Ωemitter resistors)
LVPECL output, disabled mode. 0 0 -
No emitter resistors placed; open outputs
Additional current per channel due LVPECL Output 0.5 1.65 -
Vboost to setting Vboost from 0 to 1. LVDS Output 1.5 5.0
Divide enabled, divide = 2 5.3 17.5 -
Divide circuitry
per output Divide enabled, divide > 2 8.5 28.0 -
Delay enabled, delay < 8 5.8 19.1 -
Delay circuitry
per output Delay enabled, delay > 7 9.9 32.7 -
Entire device LMK01000 85.8 223.1 60
CLKout0 & LMK01010 63.6 209.9 -
CLKout4
enabled in LMK01020 108 236.4 120
Bypassed mode
Entire device LMK01000 323.8 768.5 300
all outputs LMK01010 212.8 702.3 -
enabled with no
delay and divide LMK01020 390.4 808.3 480
value of 2
From the above table, the current can be calculated in any configuration. For example, the current for the entire
device with 1 LVDS (CLKout0) & 1 LVPECL (CLKout4) output in Bypassed mode can be calculated by adding up
the following blocks: core current, low clock buffer, high clock buffer, one LVDS output buffer current, and one
LVPECL output buffer current. There will also be one LVPECL output drawing emitter current, but some of the
power from the current draw is dissipated in the external 120 Ωresistors which doesn't add to the power
dissipation budget for the device. If delays or divides are switched in, then the additional current for these stages
needs to be added as well.
For power dissipated by the device, the total current entering the device is multiplied by the voltage at the device
minus the power dissipated in any emitter resistors connected to any of the LVPECL outputs. If no emitter
resistors are connected to the LVPECL outputs, this power will be 0 watts. For example, in the case of 1 LVDS
(CLKout0) & 1 LVPECL (CLKout4) operating at 3.3 volts for LMK01000, we calculate 3.3 V × (10 + 9 + 9 + 17.8
+ 40) mA = 3.3 V × 85.8 mA = 283.1 mW. Because the LVPECL output (CLKout4) has the emitter resistors
hooked up and the power dissipated by these resistors is 60 mW, the total power dissipation is 283.1 mW - 60
mW = 223.1 mW. When the LVPECL output is active, ~1.9 V is the average voltage on each output as calculated
from the LVPECL Voh & Vol typical specification. Therefore the power dissipated in each emitter resistor is
approximately (1.9 V)2/ 120 Ω= 30 mW. When the LVPECL output is disabled, the emitter resistor voltage is
~1.07 V. Therefore the power dissipated in each emitter resistor is approximately (1.07 V)2/ 120 Ω= 9.5 mW.
THERMAL MANAGEMENT
Power consumption of the LMK01000 family device can be high enough to require attention to thermal
management. For reliability and performance reasons the die temperature should be limited to a maximum of
125 °C. That is, as an estimate, TA(ambient temperature) plus device power consumption times θJA should not
exceed 125 °C.
Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: LMK01000
0.33 mm, typ
1.2 mm, typ
5.0 mm, min
LMK01000
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
www.ti.com
The package of the device has an exposed pad that provides the primary heat removal path as well as excellent
electrical grounding to the printed circuit board. To maximize the removal of heat from the package a thermal
land pattern including multiple vias to a ground plane must be incorporated on the PCB within the footprint of the
package. The exposed pad must be soldered down to ensure adequate heat conduction out of the package. A
recommended land and via pattern is shown in Figure 3. More information on soldering LLP packages can be
obtained at www.national.com.
Figure 3. Recommended Land and Via Pattern
To minimize junction temperature it is recommended that a simple heat sink be built into the PCB (if the ground
plane layer is not exposed). This is done by including a copper area of about 2 square inches on the opposite
side of the PCB from the device. This copper area may be plated or solder coated to prevent corrosion but
should not have conformal coating (if possible), which could provide thermal insulation. The vias shown in
Figure 3 should connect these top and bottom copper layers and to the ground layer. These vias act as “heat
pipes” to carry the thermal energy away from the device side of the board to where it can be more effectively
dissipated.
TERMINATION AND USE OF CLOCK OUTPUTS
When terminating clock drivers keep in mind these guidelines for optimum phase noise and jitter performance:
• Transmission line theory should be followed for good impedance matching to prevent reflections.
• Clock drivers should be presented with the proper loads.
– LVDS drivers are current drivers and require a closed current loop.
– LVPECL drivers are open emitter and require a DC path to ground.
• Receivers should be presented with a signal biased to their specified DC bias level (common mode voltage)
for proper operation. Some receivers have self-biasing inputs that automatically bias to the proper voltage
level. In this case, the signal should normally be AC coupled.
It is possible to drive a non-LVPECL or non-LVDS receiver with a LVDS or LVPECL driver as long as the above
guidelines are followed. Check the datasheet of the receiver or input being driven to determine the best
termination and coupling method to be sure the receiver is biased at the optimum DC voltage (common mode
voltage). For example, when driving the OSCin/OSCin* input of the LMK01000 family, OSCin/OSCin* should be
AC coupled because OSCin/ OSCin* biases the signal to the proper DC level, see Figure 2. This is only slightly
different from the AC coupled cases described (See Section 3.4.2) because the DC blocking capacitors are
placed between the termination and the OSCin/OSCin* pins, but the concept remains the same, which is the
receiver (OSCin/ OSCin*) set the input to the optimum DC bias voltage (common mode voltage), not the driver.
Termination for DC Coupled Differential Operation
For DC coupled operation of an LVDS driver, terminate with 100 Ωas close as possible to the LVDS receiver as
shown in Figure 4. To ensure proper LVDS operation when DC coupling it is recommend to use LVDS receivers
without fail-safe or internal input bias such as National Semiconductor's DS90LV110T. The LVDS driver will
provide the DC bias level for the LVDS receiver. For operation with LMK01000 family LVDS drivers it is
recommend to use AC coupling with LVDS receivers that have an internal DC bias voltage. Some fail-safe
circuitry will present a DC bias (common mode voltage) which will prevent the LVDS driver from working
correctly. This precaution does not apply to the LVPECL drivers.
16 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Links: LMK01000
CLKoutX
CLKoutX*
LVPECL
Receiver
120:
100:Trace
(Differential)
120:
Vcc
Vcc
LVPECL
Driver
82:82:
CLKoutX
CLKoutX*
LVPECL
Receiver
50:
100:Trace
(Differential)
50:
Vcc - 2 V
Vcc - 2 V
LVPECL
Driver
CLKoutX
CLKoutX*
LVDS
Receiver
100:
100:Trace
(Differential)
LVDS
Driver
LMK01000
www.ti.com
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
Figure 4. Differential LVDS Operation, DC Coupling
For DC coupled operation of an LVPECL driver, terminate with 50 Ωto Vcc - 2 V as shown in Figure 5.
Alternatively terminate with a Thevenin equivalent circuit (120 Ωresistor connected to Vcc and an 82 Ωresistor
connected to ground with the driver connected to the junction of the 120 Ωand 82 Ωresitors) as shown in
Figure 6 for Vcc = 3.3 V.
Figure 5. Differential LVPECL Operation, DC Coupling
Figure 6. Differential LVPECL Operation, DC Coupling, Thevenin Equivalent
Termination for AC Coupled Differential Operation
AC coupling allows for shifting the DC bias level (common mode voltage) when driving different receiver
standards. Since AC coupling prevents the driver from providing a DC bias voltage at the receiver it is important
to ensure the receiver is biased to its ideal DC level.
When driving LVDS receivers with an LVDS driver, the signal may be AC coupled by adding DC blocking
capacitors, however the proper DC bias point needs to be established at the receiver. One way to do this is with
the termination circuitry in Figure 7.
Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Links: LMK01000
CLKoutX
CLKoutX* 50:
50:Trace
50:
Load
Vcc - 2V
Vcc - 2V
LVPECL
Driver
CLKoutX
CLKoutX*
120:120:
0.1 PF
0.1 PFLVPECL
Reciever
100:Trace
(Differential)
LVPECL
Driver
82:
120:
Vcc
82:
120:
Vcc
CLKoutX
CLKoutX*
0.1 PF
0.1 PF
LVDS
Receiver
50:
100:Trace
(Differential)
LVDS
Driver
50:
Vbias
LMK01000
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
www.ti.com
Figure 7. Differential LVDS Operation, AC Coupling
LVPECL drivers require a DC path to ground. When AC coupling an LVPECL signal use 120 Ωemitter resistors
close to the LVPECL driver to provide a DC path to ground as shown in Figure 11. For proper receiver operation,
the signal should be biased to the DC bias level (common mode voltage) specified by the receiver. The typical
DC bias voltage (common mode voltage) for LVPECL receivers is 2 V. A Thevenin equivalent circuit (82 Ω
resistor connected to Vcc and a 120 Ωresistor connected to ground with the driver connected to the junction of
the 82 Ωand 120 Ωresistors) is a valid termination as shown in Figure 8 for Vcc = 3.3 V. Note: this Thevenin
circuit is different from the DC coupled example in Figure 6.
Figure 8. Differential LVPECL Operation, AC Coupling, Thevenin Equivalent
Termination for Single-Ended Operation
A balun can be used with either LVDS or LVPECL drivers to convert the balanced, differential signal into an
unbalanced, single-ended signal.
It is possible to use an LVPECL driver as one or two separate 800 mV p-p signals. When DC coupling one of the
LMK01000 family LVPECL drivers, the termination should still be 50 Ωto Vcc - 2 V as shown in Figure 9. Again
the Thevenin equivalent circuit (120 Ωresistor connected to Vcc and an 82 Ωresistor connected to ground with
the driver connected to the junction of the 120 Ωand 82 Ωresistors) is a valid termination as shown in Figure 10
for Vcc = 3.3 V.
Figure 9. Single-Ended LVPECL Operation, DC Coupling
18 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Links: LMK01000
0.1 PF
0.1 PF
50:Trace
50:
LMK
Input
Clock Source
CLKoutX
CLKoutX*
120:
120:
0.1 PF
0.1 PF
50:Trace
50:
Load
50:
LVPECL
Driver
CLKoutX
CLKoutX*
82:
50:Trace
120:
Load
Vcc
82:
120:
Vcc
LVPECL
Driver
LMK01000
www.ti.com
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
Figure 10. Single-Ended LVPECL Operation, DC Coupling, Thevenin Equivalent
When AC coupling an LVPECL driver use a 120 Ωemitter resistor to provide a DC path to ground and ensure a
50 Ωtermination with the proper DC bias level for the receiver. The typical DC bias voltage for LVPECL
receivers is 2 V (See Section 3.4.1). If the other driver is not used it should be terminated with either a proper AC
or DC termination. This latter example of AC coupling a single-ended LVPECL signal can be used to measure
single-ended LVPECL performance using a spectrum analyzer or phase noise analyzer. When using most RF
test equipment no DC bias point (0 V DC) is expected for safe and proper operation. The internal 50 Ω
termination the test equipment correctly terminates the LVPECL driver being measured as shown in Figure 11.
When using only one LVPECL driver of a CLKoutX/CLKoutX* pair, be sure to properly terminated the unused
driver.
Figure 11. Single-Ended LVPECL Operation, AC Coupling
Conversion to LVCMOS Outputs
To drive an LVCMOS input with an LMK01000 family LVDS or LVPECL output, an LVPECL/LVDS to LVCMOS
converter such as National Semiconductor's DS90LV018A, DS90LV028A, DS90LV048A, etc. is required. For
best noise performance, LVPECL provides a higher voltage swing into input of the converter.
OSCin INPUT
In addition to LVDS and LVPECL inputs, OSCin can also be driven with a sine wave. The OSCin input can be
driven single-ended or differentially with sine waves. These configurations are shown in Figure 12 and Figure 13.
Figure 12. Single-Ended Sine Wave Input
Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Links: LMK01000
10 70
FREQUENCY (MHz)
10
5
0
-5
-10
-15
-20
POWER (dBm)
50 80
Minimum Recommended
Power for Differential
Operation
20 30 40 60 100
90
Minimum Recommended
Power for Single-Ended
Operation
0.1 PF
0.1 PFLMK
Input
100:
100:Trace
(Differential)
Clock Source
LMK01000
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
www.ti.com
Figure 13. Differential Sine Wave Input
Figure 14 shows the recommended power level for sine wave operation for both differential and single-ended
sources over frequency. The part will operate at power levels below the recommended power level, but as power
decreases the PLL noise performance will degrade. The VCO noise performance will remain constant. At the
recommended power level the PLL phase noise degradation from full power operation (8 dBm) is less than 2 dB.
Figure 14. Recommended OSCin Power for Operation with a Sine Wave Input
MORE THAN EIGHT OUTPUTS WITH AN LMK01000 FAMILY DEVICE
The LMK01000 family device can be used in conjunction with a LMK02000, LMK03000, LMK04000, or even
another LMK01000 device in order to produce more than 8 outputs. When doing this, attention needs to be given
to how the frequencies are assigned for each output to eliminate synchronization issues. Refer to AN-1864 for
more details.
GLOBAL DELAY THROUGH AN LMK01000 FAMILY DEVICE
The delay from CLKin to CLKout is determinsic, but can vary based on the engaged delays and divides as
discussed in Section 2.3.2 for the CLKoutX_MUX bit. In addition, there can be variations based on voltage,
temperature, and frequency. AN-1864 discusses this global delay in more detail.
20 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Links: LMK01000
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
LMK01000ISQ/NOPB ACTIVE WQFN RHS 48 1000 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K01000 I
LMK01000ISQE/NOPB ACTIVE WQFN RHS 48 250 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K01000 I
LMK01000ISQX/NOPB ACTIVE WQFN RHS 48 2500 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K01000 I
LMK01010ISQ/NOPB ACTIVE WQFN RHS 48 1000 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K01010 I
LMK01010ISQE/NOPB ACTIVE WQFN RHS 48 250 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K01010 I
LMK01010ISQX/NOPB ACTIVE WQFN RHS 48 2500 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K01010 I
LMK01020ISQ/NOPB ACTIVE WQFN RHS 48 1000 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K01020 I
LMK01020ISQE/NOPB ACTIVE WQFN RHS 48 250 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K01020 I
LMK01020ISQX/NOPB ACTIVE WQFN RHS 48 2500 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K01020 I
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 2
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LMK01000ISQ/NOPB WQFN RHS 48 1000 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1
LMK01000ISQE/NOPB WQFN RHS 48 250 178.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1
LMK01000ISQX/NOPB WQFN RHS 48 2500 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1
LMK01010ISQ/NOPB WQFN RHS 48 1000 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1
LMK01010ISQE/NOPB WQFN RHS 48 250 178.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1
LMK01010ISQX/NOPB WQFN RHS 48 2500 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1
LMK01020ISQ/NOPB WQFN RHS 48 1000 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1
LMK01020ISQE/NOPB WQFN RHS 48 250 178.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1
LMK01020ISQX/NOPB WQFN RHS 48 2500 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 12-Jun-2018
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMK01000ISQ/NOPB WQFN RHS 48 1000 367.0 367.0 38.0
LMK01000ISQE/NOPB WQFN RHS 48 250 210.0 185.0 35.0
LMK01000ISQX/NOPB WQFN RHS 48 2500 367.0 367.0 38.0
LMK01010ISQ/NOPB WQFN RHS 48 1000 367.0 367.0 38.0
LMK01010ISQE/NOPB WQFN RHS 48 250 210.0 185.0 35.0
LMK01010ISQX/NOPB WQFN RHS 48 2500 367.0 367.0 38.0
LMK01020ISQ/NOPB WQFN RHS 48 1000 367.0 367.0 38.0
LMK01020ISQE/NOPB WQFN RHS 48 250 210.0 185.0 35.0
LMK01020ISQX/NOPB WQFN RHS 48 2500 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 12-Jun-2018
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
SEE TERMINAL
DETAIL
48X 0.30
0.18
5.1 0.1
48X 0.5
0.3
0.8
0.7
(A) TYP
0.05
0.00
44X 0.5
2X
5.5
2X 5.5
A7.15
6.85 B
7.15
6.85
0.30
0.18
0.5
0.3
(0.2)
WQFN - 0.8 mm max heightRHS0048A
PLASTIC QUAD FLATPACK - NO LEAD
4214990/B 04/2018
DIM A
OPT 1 OPT 2
(0.1) (0.2)
PIN 1 INDEX AREA
0.08 C
SEATING PLANE
1
12 25
36
13 24
48 37
(OPTIONAL)
PIN 1 ID 0.1 C A B
0.05
EXPOSED
THERMAL PAD
49 SYMM
SYMM
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
SCALE 1.800
DETAIL
OPTIONAL TERMINAL
TYPICAL
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
48X (0.25)
48X (0.6)
( 0.2) TYP
VIA
44X (0.5)
(6.8)
(6.8)
(1.25) TYP
( 5.1)
(R0.05)
TYP
(1.25)
TYP
(1.05) TYP
(1.05)
TYP
WQFN - 0.8 mm max heightRHS0048A
PLASTIC QUAD FLATPACK - NO LEAD
4214990/B 04/2018
SYMM
1
12
13 24
25
36
37
48
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:12X
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
49
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
METAL EDGE
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)
EXPOSED
METAL
www.ti.com
EXAMPLE STENCIL DESIGN
48X (0.6)
48X (0.25)
44X (0.5)
(6.8)
(6.8)
16X
( 1.05)
(0.625) TYP
(R0.05) TYP
(1.25)
TYP
(1.25)
TYP
(0.625) TYP
WQFN - 0.8 mm max heightRHS0048A
PLASTIC QUAD FLATPACK - NO LEAD
4214990/B 04/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
49
SYMM
METAL
TYP
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 49
68% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:15X
SYMM
1
12
13 24
25
36
37
48
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