SFN08A, SFN08B
BI Technologies Corporation
4200 Bonita Place
Fullerton, CA 92835 USA
Website: www.bitechnologies.com
May 6, 2009 page 2 of 3 BI technologies
PACKAGE POWER, WATTS @ 70°C4
SFN08 0.4
POWER DERATING CURVE
ENVIRONMENTAL (MIL-R-83401)
Thermal Shock plus Power Conditioning ∆R 0.25%
Short Time Overload ∆R 0.1%
Terminal Strength ∆R 0.1%
Moisture Resistance ∆R 0.2%
Mechanical Shock ∆R 0.25%
Vibration ∆R 0.25%
Low Temperature Operation ∆R 0.05%
High Temperature Exposure ∆R 0.1%
Resistance to Solder Heat ∆R 0.1%
Marking Permanency Per MIL-STD-202, Method 215
Flammability UL-94V-0 Rated
Storage Temperature Range -55°C to +125°C
MECHANICAL
Pad Plating 80/20 Tin Lead (non-RoHS compliant)
100 matte Tin (RoHS compliant)
Pad Material Copper Alloy
Pad Coplanarity 0.003” (0.08 mm)
Substrate Material Silicon
Resistor Material Passivated Nichrome
Body Material Molded Epoxy
4 Maximum power per resistor @ 70°C is 100 mW, not to exceed package power.