1
Precision Edge®
SY89547L
Micrel, Inc.
M9999-091809
hbwhelp@micrel.com or (408) 955-1690
DESCRIPTION
Selects among four differential inputs
Provides two copies of the selected input
Guaranteed AC performance over temp and voltage:
• DC-to > 3.2Gbps data rate throughput
• < 620ps In-to-Out tpd
• < 150ps tr/tf
Unique input isolation design minimizes crosstalk
Ultra-low jitter design:
• < 1psRMS random jitter
• < 10psPP deterministic jitter
• < 10psPP total jitter (clock)
• < 0.7psRMS crosstalk-induced jitter
Internal input termination
Unique input termination and VT pin accepts DC-
coupled and AC-coupled inputs (LVDS, LVPECL,
CML)
350mV LVDS output swing
Power supply 3.3V ±10%
–40°C to +85°C temperature range
Available in 32-pin (5mm x 5mm) MLF® package
FEATURES
3.3V, 3.2Gbps DIFFERENTIAL 4:1 LVDS
MULTIPLEXER with 1:2 FANOUT and
INTERNAL TERMINATION
Precision Edge®
SY89547L
APPLICATIONS
SONET/SDH multi-channel select applications
Fibre Channel applications
GigE applications
Rev.: D Amendment: /0
Issue Date:
September 2009
The SY89547L is a precision, high-speed 4:1 differential
multiplexer that provides two copies of the selected input.
The high speed LVDS (350mV) compatible outputs with a
guaranteed throughput of up to 3.2Gbps over temperature
and voltage.
The SY89547L differential inputs include Micrel’s unique,
3-pin internal termination design that allows access to the
termination network through a VT pin. This feature allows
the device to easily interface to different logic standards,
both AC- and DC-coupled without external resistor-bias and
termination networks. The result is a clean, stub-free, low
jitter interface solution.
The SY89547L operates from a single 3.3V supply, and
is guaranteed over the full industrial temperature range
(–40°C to +85°C). For applications that require a 2.5V supply,
consider the SY89546U. For applications that only require
one differential output, consider the SY89544U or SY89545L.
The SY89547L is part of a Micrel’s Precision Edge® product
family. All support documentation can be found on Micrel’s
web site at: www.micrel.com.
TYPICAL PERFORMANCE
FUNCTIONAL BLOCK DIAGRAM
Precision Edge®
IN0
/IN0
V
T0
50
50
IN1
/IN1
V
T1
50
50Q0
/Q0
0
1
MUX
4:1 MUX
1:2 Fanout
LVDS
IN2
/IN2
V
T2
50
50
2
IN3
/IN3
V
T3
50
50
3S0 S1
SEL0 (CMOS/TTL)
SEL1 (CMOS/TTL)
Q1
/Q1
Precision Edge is a registered trademark of Micrel, Inc.
Micro
LeadFrame and MLF are registered trademarks of Amkor Technology, Inc.
0
50
100
150
200
250
300
350
400
0 1000 2000 3000 4000 5000 6000
OUTPUT AMPLITUDE (mV)
FREQUENCY (MHz)
Output Amplitude
vs. Frequency
2
Precision Edge®
SY89547LMicrel, Inc.
M9999-091809
hbwhelp@micrel.com or (408) 955-1690
Pin Number Pin Name Pin Function
4, 2, 32, IN0, /IN0, Differential Inputs: These input pairs are the differential signal inputs to the device. Inputs
30, 27, 25, 23, 21 IN1, /IN1, accept AC- or DC-coupled signals as small as 100mV. Each pin of a pair internally
IN2, /IN2, terminates to a VT pin through 50. Note that these inputs will default to an indeterminate
IN3, /IN3 state if left open. Unused differential input pairs can be terminated by connecting one input
to VCC and the complementary input to GND through a 1k resistor. The VT pin is to be
left open in this configuration. Please refer to the Input Interface Applications section for
more details.
3, 31, 26, 22 VT0, VT1, Input Termination Center-Tap: Each side of the differential input pair, terminates to a VT
VT2, VT3 pin. The VTA0, VTA1, VTB0, VTB1 pins provide a center-tap to a termination network for
maximum interface flexibility. See Input Interface Applications section for more details.
6, 19 SEL0, SEL1 These single-ended TTL/CMOS-compatible inputs select the inputs to the multiplexers.
Note that these inputs are internally connected to a 25k pull-up resistor and will default
to a logic HIGH state if left open. Input switching threshold is VCC/2.
1, 5, 8, VCC Positive Power Supply: Bypass with 0.1µF||0.01µF low ESR capacitors.
17, 20, 24, 28, 29
10, 11, 14, 15 Q0, /Q0, Differential Outputs: These LVDS output pairs are the outputs of the device. They are a
Q1, /Q1 logic function of the INA0, INA1, INB0, INB1 and SELA and SELB inputs. Please refer to
the Truth Table’” for details. If an output is not used, it must be terminated with 100
across the differential pair.
7, 9, 12, 13, 16, 18 GND, Ground: Ground pin and exposed pad must be connected to the same ground plane.
Exposed pad
PIN DESCRIPTION
PACKAGE/ORDERING INFORMATION
24
23
22
21
20
19
18
17
VCC
IN3
VT3
/IN3
VCC
SEL1
GND
VCC
VCC
/IN0
VT0
IN0
VCC
SEL0
GND
VCC
1
2
3
4
5
6
7
8
910111213141516
32 31 30 29 28 27 26 25
VCC
VCC
/IN1
VT1
IN1
IN2
VT2
/IN2
GND
GND
/Q0
Q0
GND
Q1
/Q1
GND
32-Pin MLF®
Ordering Information(1)
Package Operating Package Lead
Part Number Type Range Marking Finish
SY89547LMI MLF-32 Industrial SY89547L Sn-Pb
SY89547LMITR(2) MLF-32 Industrial SY89547L Sn-Pb
SY89547LMG(3) MLF-32 Industrial SY89547L with Pb-Free
Pb-Free bar-line indicator NiPdAu
SY89547LMGTR(2, 3) MLF-32 Industrial SY89547L with Pb-Free
Pb-Free bar-line indicator NiPdAu
Notes:
1. Contact factory for die availability. Dice are guaranteed at TA = 25°C, DC electricals only.
2. Tape and Reel.
3. Recommended for new designs.
3
Precision Edge®
SY89547L
Micrel, Inc.
M9999-091809
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings(1)
Supply Voltage (VCC) ............................... 0.5V to + 4.0V
Input Voltage (VIN) ........................................ 0.5V to VCC
Termination Current(3)
Source or sink current on VT.....................................±100mA
Input Current
Source or sink current on IN, /IN..........................±50mA
Lead Temperature (soldering, 20 sec.) ................... +260°C
Storage Temperature (TS) ...................... 65°C to +150°C
Operating Ratings(2)
Supply Voltage (VCC) ..................................... 3.0V to 3.6V
Ambient Temperature (TA)........................ 40°C to +85°C
Package Thermal Resistance(4)
MLF® (θJA)
Still-Air................................................................ 35°C/W
500lfpm .............................................................. 28°C/W
MLF® (ΨJB)
Junction-to-Board............................................... 20°C/W
TA = 40°C to +85°C; Unless otherwise stated.
Symbol Parameter Condition Min Typ Max Units
VCC Power Supply 3.0 3.3 3.6 V
ICC Power Supply Current No Load, Max. VCC(6) 68 90 mA
RDIFF_IN Differential Input Resistance 80 100 120
(IN-to-/IN)
RIN Input Resistance 40 50 60
(IN-to-VT, /IN-to-VT)
VIH Input High Voltage 1.2 VCC V
(IN, /IN)
VIL Input Low Voltage 0 VIH0.1 V
(IN, /IN)
VIN Input Voltage Swing Note 7 0.1 VCC V
(IN, /IN)
VDIFF_IN Differential Input Voltage Swing Note 7 0.2 V
| IN - /IN |
IN-to-VTNote 7 1.8 V
Notes:
1. Permanent device damage may occur if Absolute Maximum Ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to Absolute Maximum Ratings conditions
for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Due to the limited drive capability use for input of the same package only.
4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential (GND) on the PCB. ΨJB uses
4-layer θJA in still-air unless otherwise stated.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. Includes current through internal 50 pull-ups.
7. See Operating Characteristics section for VIN and VDIFF_IN definition.
DC ELECTRICAL CHARACTERISTICS(5)
4
Precision Edge®
SY89547LMicrel, Inc.
M9999-091809
hbwhelp@micrel.com or (408) 955-1690
VCC = 3.3V ±10%; TA = 40°C to +85°C; RL = 100 across Q and /Q, unless otherwise stated.
Symbol Parameter Condition Min Typ Max Units
VOH Output HIGH Voltage See Figure 5a 1.475 V
(Q, /Q)
VOL Output LOW Voltage See Figure 5a 0.925 V
(Q, /Q)
VOUT Output Voltage Swing See Figures 1a, 5a 250 350 mV
(Q, /Q)
VDIFF-OUT Differential Output Voltage Swing See Figure 1b 500 700 mV
| Q - /Q|
VOCM Output Common Mode Voltage See Figure 5b 1.125 1.275 V
(Q, /Q)
VOCM Change in Common Mode Voltage See Figure 5b 50 +50 mV
(Q, /Q)
LVDS OUTPUTS DC ELECTRICAL CHARACTERISTICS(9)
VCC = 3.3V ±10%; TA = 40°C to +85°C; unless otherwise stated.
Symbol Parameter Condition Min Typ Max Units
VIH Input HIGH Voltage 2.0 VCC V
VIL Input LOW Voltage 0.8 V
IIH Input HIGH Current 40 µA
IIL Input LOW Current 300 µA
Note:
9. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
LVTTL/CMOS DC ELECTRICAL CHARACTERISTICS(9)
5
Precision Edge®
SY89547L
Micrel, Inc.
M9999-091809
hbwhelp@micrel.com or (408) 955-1690
VCC = 3.3V ±10%; TA = 40°C to +85°C; RL = 100 across Q and /Q, unless otherwise stated.
Symbol Parameter Condition Min Typ Max Units
fMAX Maximum Operating Frequency NRZ Data 3.2 Gbps
VOUT 200mV Clock 4 GHz
tpd Differential Propagation Delay IN-to-Q 340 440 540 ps
SEL-to-Q 200 420 700 ps
tSKEW Input-to-Input Skew Note 11 520ps
Output-to-Output Skew Note 12 820ps
Part-to-Part Skew Note 13 200 ps
tJITTER Data Random Jitter (RJ) Note 14 1ps
RMS
Deterministic Jitter (DJ) Note 15 10 psPP
Clock Total Jitter (TJ) Note 16 10 psPP
Cycle-to-Cycle Jitter Note 17 1ps
RMS
Crosstalk Crosstalk-Induced Jitter Note 18 0.7 psRMS
tR, tFOutput Rise / Fall Time At full output swing 40 80 150 ps
(20% to 80%)
Notes:
10. Measured with 100mV input swing. See Timing Diagrams section for definition of parameters. High frequency AC parameters are guaranteed by
design and characterization.
11. Input-to-input skew is the difference in time from an input-to-output in comparison to any other input-to-output. In addition, the input-to-input skew
does not include the output skew.
12. Output-to-output skew is measured between two different outputs under identical input transitions.
13. Part-to-part skew is defined for two parts with identical power supply voltages at the same temperature and with no skew of the edges at the
respective inputs. Total skew is calculated as the RMS (Root Mean Square) of the input skew and output skew.
14. RJ is measured with a K28.7 comma detect character pattern, measured at 1.25Gbps and 3.2Gbps.
15. DJ is measured at 1.25Gbps and 3.2Gbps, with both K28.5 and 2231 PRBS pattern.
16. Total jitter definition: with an ideal clock input of frequency fMAX, no more than one output edge in 1012 output edges will deviate by more than the
specified peak-to-peak jitter value.
17. Cycle-to-cycle jitter definition: the variation of periods between adjacent cycles, Tn-Tn-1 where T is the time between rising edges of the output
signal.
18. Crosstalk is measured at the output while applying two similar clock frequencies to adjacent inputs that are asynchronous with respect to each other
at the inputs.
AC ELECTRICAL CHARACTERISTICS(10)
6
Precision Edge®
SY89547LMicrel, Inc.
M9999-091809
hbwhelp@micrel.com or (408) 955-1690
IN0 IN1 IN2 IN3 SEL0 SEL1 Q /Q
0XXX 0001
1XXX 0010
X0XX 1001
X1XX 1010
XX0X 0101
XX1X 0110
XXX0 1101
XXX1 1110
SINGLE-ENDED AND DIFFERENTIAL SWINGS
V
IN
,
V
OUT
350mV (Typ.)
Figure 1a. Single-Ended Voltage Swing
V
DIFF_IN
,
V
DIFF_OUT
700mV (Typ.)
Figure 1b. Differential Voltage Swing
TIMING DIAGRAM
IN
/IN
Q
/Q
t
pd
SEL SEL-to-Q
Q
/Q
t
pd
Figure 2. Timing Diagram
TRUTH TABLE
7
Precision Edge®
SY89547L
Micrel, Inc.
M9999-091809
hbwhelp@micrel.com or (408) 955-1690
FUNCTIONAL CHARACTERISTICS
200MHz Output
TIME (600ps/div.)
Output Swing
(100mV/div.)
Q
/Q
1.6GHz Output
TIME (80ps/div.)
Output Swing
(100mV/div.)
Q
/Q
2.5GHz Output
TIME (50ps/div.)
Output Swing
(100mV/div.)
Q
/Q
3.2GHz Output
TIME (40ps/div.)
Output Swing
(100mV/div.)
Q
/Q
2.5Gbps Mask
(2
23
Ð1 PRBS)
TIME (100ps/div.)
Output Swing
(100mV/div.)
VCC = 3.3V, GND = 0V, VIN = 100mV, TA = 25°C.
622Mbps Mask
(2
23
Ð1 PRBS)
TIME (400ps/div.)
Output Swing
(100mV/div.)
8
Precision Edge®
SY89547LMicrel, Inc.
M9999-091809
hbwhelp@micrel.com or (408) 955-1690
FUNCTIONAL CHARACTERISTICS
3.2Gbps Data Output (2231 PRBS)
TIME (80ps/div.)
Output Swing
(100mV/div.)
VCC = 3.3V, GND = 0V, VIN = 100mV, TA = 25°C.
9
Precision Edge®
SY89547L
Micrel, Inc.
M9999-091809
hbwhelp@micrel.com or (408) 955-1690
INPUT AND OUTPUT STAGE INTERNAL TERMINATION
50
50
V
CC
GND
/IN
V
T
IN
Figure 3. Simplified Differential Input Stage
INPUT INTERFACE APPLICATIONS
LVPECL
IN
/IN
SY89547L
VCC
Rp
Rp
GND
GND
For VCC = 3.3V, Rp = 100
VT
GND
VCC
1.4V
Figure 4d. LVPECL
Interface (AC-Coupled)
LVDS IN
/IN
SY89547L
VCC
GND VT
NC
Figure 4e. LVDS Interface
CML IN
/IN
VT
NC
SY89547L
VCC
GND
Figure 4a. CML
Interface (DC-Coupled)
LVPECL
IN
/IN
SY89547L
V
CC
0.01µF
V
CC
R
p
For V
CC
= 3.3V, R
p
= 50
GND V
T
Figure 4c. LVPECL
Interface (DC-Coupled)
CML IN
/IN
VT
SY89547L
VCC
GNDVCC
1.4V
GND
Figure 4b. CML
Interface (AC-Coupled)
10
Precision Edge®
SY89547LMicrel, Inc.
M9999-091809
hbwhelp@micrel.com or (408) 955-1690
OUTPUT INTERFACE APPLICATIONS
LVDS specifies a small swing of 350mV typical, on a
nominal 1.25V common mode above ground. The common
mode voltage has tight limits to permit large variations in
ground between an LVDS driver and receiver. Also, change
in common mode voltage, as a function of data input, is
kept to a minimum, to keep EMI low.
100V
OUT
GND
V
OH
, V
OL
V
OH
, V
OL
Figure 5a. LVDS Differential Measurement
GND
V
OCM
,
D
V
OCM
50
W
50
W
Figure 5b. LVDS Common Mode Measurement
RELATED MICREL PRODUCTS AND SUPPORT DOCUMENTATION
Part Number Function Data Sheet Link
SY89542U 2.5 V, 3.2Gbps Dual, Differential 2:1 LVDS http://www.micrel.com/_PDF/HBW/sy89542u.pdf
Multiplexer with Internal Input Termination
SY89543L 3.3V, 3.2Gbps Dual, Differential 2:1 LVDS http://www.micrel.com/_PDF/HBW/sy89543l.pdf
Multiplexer with Internal Input Termination
SY89544U 2.5V, 3.2Gbps, Differential 4:1 LVDS Multiplexer http://www.micrel.com/_PDF/HBW/sy89544u.pdf
with Internal Input Termination
SY89545L 3.3V, 3.2Gbps 4:1 LVDS Multiplexer with Internal http://www.micrel.com/_PDF/HBW/sy89545l.pdf
Input Termination
SY89546U 2.5V, 3.2Gbps, Differential 4:1 LVDS Multiplexer http://www.micrel.com/_PDF/HBW/SY89546u.pdf
with 1:2 Fanout and Internal Termination
MLF® Application Note www.amkor.com/products/notes_papers/MLF_AppNote_0902.pdf
HBW Solutions New Products and Applications www.micrel.com/product-info/products/solutions.shtml
11
Precision Edge®
SY89547L
Micrel, Inc.
M9999-091809
hbwhelp@micrel.com or (408) 955-1690
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL + 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchasers
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchasers own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.
© 2005 Micrel, Incorporated.
Package
EP- Exposed Pad
Die
CompSide Island
Heat Dissipation
Heavy Copper Plane
Heavy Copper Plane
VEE
VEE
Heat Dissipation
PCB Thermal Consideration for 32-Pin MLF® Package
(Always solder, or equivalent, the exposed pad to the PCB)
Package Notes:
1. Package meets Level 2 qualification.
2. All parts are dry-packaged before shipment.
3. Exposed pads must be soldered to a ground for proper thermal management.
32-PIN
Micro
LeadFrame® (MLF-32)