1
www.clare.com
XBB170
DS-XBB170-R2
XBB170 is a 350V, 100mA, 50Ω2-Form-B relay. It pro-
vides an economical solution for applications requiring
two independent Form-B relays where cost is critical.
•Telecommunications
•Telecom Switching
•Tip/Ring Circuits
•Modem Switching (Laptop, Notebook, Pocket Size)
•Hookswitch
•Dial Pulsing
•Ground Start
•Ringer Injection
•Instrumentation
•Multiplexers
•Data Acquisition
•Electronic Switching
•I/O Subsystems
•Meters (Watt-Hour, Water, Gas)
•Medical Equipment—Patient/Equipment Isolation
•Security
•Aerospace
•Industrial Controls
•Small 8 Pin DIP Package
•Low Drive Power Requirements (TTL/CMOS
Compatible)
•No Moving Parts
•High Reliability
•Arc-Free With No Snubbing Circuits
•3750VRMS Input/Output Isolation
•FCC Compatible
•VDE Compatible
•No EMI/RFI Generation
•Machine Insertable, Wave Solderable
•Surface Mount and Tape & Reel Versions Available
Applications
Features
Description
DUAL POLE OptoMOS®Relay
Ordering Information
Part # Description
XBB170 8 Pin DIP (50/Tube)
XBB170P 8 Pin Flatpack (50/Tube)
XBB170PTR 8 Pin Flatpack (1000/Reel)
XBB170S 8 Pin Surface Mount (50/Tube)
XBB170STR 8 Pin Surface Mount (1000/Reel)
Pin Configuration
XBB170 Units
Load Voltage 350 V
Load Current 100 mA
Max RON 50 Ω
Switching Characteristics of
Normally Closed (Form B) Devices
CONTROL
10ms
10%
90% 90%
+
+
TON
TOFF
+
1
2
3
4
8
7
6
5
+ Control - Switch #1
Ð Control - Switch #1
+ Control - Switch #2
Ð Control - Switch #2
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
AC/DC Configuration
XBB170 Pinout
•UL Recognized: File Number E76270
•CSA Certified: File Number LR 43639-10
•BSI Certified to:
•BS EN 60950:1992 (BS7002:1992)
Certificate #: 7344
•BS EN 41003:1993
Certificate #: 7344
Approvals
www.clare.com
XBB170
Rev. 2
Absolute Maximum Ratings are stress ratings. Stresses
in excess of these ratings can cause permanent damage
to the device. Functional operation of the device at these
or any other conditions beyond those indicated in the
operational sections of this data sheet is not implied.
Exposure of the device to the absolute maximum ratings
for an extended period may degrade the device and effect
its reliability.
Absolute Maximum Ratings (@ 25˚ C)
2
Electrical Characteristics
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics @ 25°C
Load Voltage (Peak) - VL- - 350 V
Load Current* (Continuous)
AC/DC Configuration - IL- - 100 mA
Peak Load Current 10ms ILPK - - 350 mA
On-Resistance
AC/DC Configuration IL=120mA RON -3350 Ω
Off-State Leakage Current VL=350V - - - 1 µA
Switching Speeds
Turn-On IF= 5mA,VL=10V TON --5 ms
Turn-Off IF= 5mA,VL=10V TOFF --5 ms
Output Capacitance 50V; f = 1MHz COUT -25- pF
Input Characteristics @ 25°C
Input Control Current IL= 120mA IF5-50mA
Input Dropout Current - IF0.4 0.7 - mA
Input Voltage Drop IF= 5mA VF0.9 1.2 1.4 V
Reverse Input Voltage - VR--5 V
Reverse Input Current VR= 5V IR- - 10 µA
Common Characteristics @ 25°C
Input to Output Capacitance - VC/O -3- pF
Input to Output Isolation - VI/O 3750 - - VRMS
*Note: If both poles operate simulataneously load current must be derated so as not to exceed the package power dissipation value.
Parameter Min Typ Max Units
Input Power Dissipation - - 1501mW
Input Control Current - - 50 mA
Peak (10ms) - - 1 A
Reverse Input Voltage - - 5 V
Total Power Dissipation - - 8002mW
Isolation Voltage
Input to Output 3750 - - VRMS
Operational Temperature -40 - +85 °C
Storage Temperature -40 - +125 °C
Soldering Temperature
DIP Package - - +260 °C
Surface Mount Package - - +220 °C
(10 Seconds Max.)
1Derate Linearly 1.33 mw/˚C
2Derate Linearly 6.67 mw/˚C
XBB170
www.clare.com
Rev. 2 3
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact
our application department.
XBB170
Typical LED Forward Voltage Drop
(N=50 Ambient Temperature = 25°C)
IF = 5mADC
35
30
25
20
15
10
5
01.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
XBB170
Typical On-Resistance Distribution
(N=50 Ambient Temperature = 25°C)
(Load Current = 100mADC)
25
20
15
10
5
030.59 32.13 33.66 35.2031.36 32.90 34.43
On-Resistance (Ω)
Device Count (N)
XBB170
Typical Blocking Voltage Distribution
(N=50 Ambient Temperature = 25°C)
IF=5mADC
25
20
15
10
5
0424.0 434.5 444.9 455.4429.3 439.7 450.1
Blocking Voltage (V)
Device Count (N)
XBB170
Typical IF for Switch Operation
(N=50 Ambient Temperature = 25°C)
(Load Current = 100mADC)
0.50 0.62 0.750.44 0.56 0.69 0.81
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
XBB170
Typical IF for Switch Dropout
(N=50 Ambient Temperature = 25°C)
(Load Current = 100mADC
25
20
15
10
5
00.50 0.62 0.750.44 0.56 0.69 0.81
LED Current (mA)
Device Count (N)
)
XBB170
Typical Turn-On Time
(N=50 Ambient Temperature = 25°C)
(Load Current = 100mADC)
0.67 0.83 0.99 1.140.75 0.91 1.06
Turn-On (ms)
Device Count (N)
25
20
15
10
5
0
XBB170
Typical Turn-Off Time
(N=50 Ambient Temperature = 25°C)
(Load Current = 100mADC)
0.11 0.17 0.22 0.280.250.190.14
Turn-Off (ms)
Device Count (N)
25
20
15
10
5
0
XBB170
Typical Load Current vs. Temperature
Temperature (°C)
Load Current (mA)
160
140
120
100
80
60
40
20
0
-40 -20 0 20 40 60 80 120100
XBB170
Typical Leakage vs. Temperature
(Measured across Pins 4 & 6)
Temperature (°C)
Leakage (µA)
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0-20 0 20 40 60 80 100
XBB170
Typical Turn-On vs. Temperature
(Load Current = 100mADC)
Temperature (°C)
Turn-On (ms)
-40
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0-20 0 20 40 60 80 100 120
XBB170
Typical Turn-Off vs. Temperature
(Load Current = 100mADC)
Temperature (°C)
5mA
10mA
20mA
Turn-Off (ms)
-40
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0-20 0 20 40 60 80 100 120
www.clare.com
4
XBB170
Rev. 2
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact
our application department.
PERFORMANCE DATA*
XBB170
Typical LED Forward Voltage Drop
vs. Temperature
Temperature (°C)
LED Forward Voltage Drop (V)
1.8
1.6
1.4
1.2
1.0
0.8-40 -20 0 20 40 60 80 120100
50mA
30mA
20mA
10mA
5mA
XBB170
Typical Turn-On vs. LED Forward Current
(Load Current = 100mADC)
LED Forward Current (mA)
Turn-On (ms)
05 1015202530354045
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
050
XBB170
Typical Turn-Off vs. LED Forward Current
(Load Current = 100mADC)
LED Forward Current (mA)
Turn-Off (ms)
05 1015202530354045
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
050
XBB170
Typical On-Resistance vs. Temperature
(Load Current = 100mADC)
Temperature (°C)
On-Resistance (Ω)
-40
70
60
50
40
30
20
10
0
-20 0 20 40 60 80 100 120
XBB170
Typical IF for Switch Operation
vs. Temperature
(Load Current = 100mADC)
Temperature (°C)
LED Current (mA)
-40
6.0
5.0
4.0
3.0
2.0
1.0
0-20 0 20 40 60 80 100 120
XBB170
Typical IF for Switch Dropout
vs. Temperature
(Load Current = 100mADC)
Temperature (°C)
LED Current (mA)
-40
6.0
5.0
4.0
3.0
2.0
1.0
0-20 0 20 40 60 80 100 120
XBB170
Typical Load Current vs. Load Voltage
(Ambient Temperature = 25°C)
Load Voltage (V)
Load Current (mA)
120
100
80
60
40
20
0
-20
-40
-60
-80
-100
-120 -3-4 -2 -1 0 1 2 3 4
XBB170
Energy Rating Curve
Time
Load Current (A)
10µs
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
01ms100µs 100ms 1s
10ms 10s 100s
XBB170
www.clare.com 5
Rev. 2
Dimensions
mm
(inches)
Mechanical Dimensions
4.445 ± .127
(.175 ± .005) 3.302
(.130)
7.620 ± .254
(.300 ± .010)
6.350 ± .127
(.250 ± .005)
8.077 ± .127
(.318 ± .005)
2.540 ± .127
(.100 ± .005)
9.525 ± .254
(.375 ± .010)
.457 ± .076
(.018 ± .003)
.254 TYP.
(.010)
.635 TYP.
(.025)
8 Pin DIP Surface Mount (“S” Suffix) 9.652 ± .381
(.380 ± .015)
PC Board Pattern
(Top View)
6.350 ± .127
(.250 ± .005)
2.540 ± .127
(.100 ± .005)
7.620 ± .127
(.300 ± .005)
7.620 ± .127
(.300 ± .005)
8-.800 DIA.
(8-.031 DIA.)
7.239 TYP.
(.285)
3.302
(.130)
7.620 ± .254
(.300 ± .010)
9.144 TYP.
(.360)
6.350 ± .127
(.250 ± .005)
9.652 ± .381
(.380 ± .015)
2.540 ± .127
(.100 ± .005)
9.144 ± .508
(.360 ± .020)
.457 ± .076
(.018 ± .003)
8.077 ± .127
(.318 ± .005 )
8 Pin DIP Through Hole (Standard)
PC Board Pattern
(Top View) 2.540 ± .127
(.100 ± .005)
8.305 ± .127
(.327 ± .005)
1.905 ± .127
(.075 ± .005)
1.498 ± .127
(.059 ± .005)
PC Board Pattern
(Top View)
2.540 ± .127
(.100 ± .005)
8.763 ± .127
(.345 ± .005)
1.193
(.047)
.787
(.031)
8 Pin Flatpack (“P” Suffix)
7.620 ± .254
(.300 ± .010)
2.159 TYP.
(.085)
2.286 MAX.
(.090)
9.398 ± .127
(.370 ± .005)
6.350 ± .127
(.250 ± .005)
9.652 ± .381
(.380 ± .015)
2.540 ± .127
(.100 ± .005)
8.077 ± .127
(.318 ± .005)
.457 ± .076
(.018 ± .003)
.203
(.008)
.635 ± .127
(.025)
www.clare.com
6
XBB170
Rev. 2
Dimensions
mm
(inches)
Mechanical Dimensions
Tape and Reel Packaging for 8 Pin Flatpack Package
7.493 ± .102
(.295 ± .004)
12.090
(.476)
1.753 ± 0.102
(.069 ± .004)
3.987 ± .102
(.157 ± .004)
1.498 ± .102
(.059 ± .004)
6.731 MAX.
(.265) .406 MAX.
(.016)
4.877
(.192)
Top Cover
Tape
2.007 ± .102
(.079 ± .004)
11.988 ± .102
(.472 ± .004)
User Direction of Feed
.050R TYP.
16.002 ± .305
(.630 ± .012)
10.287
(.405)
Embossment
Embossed Carrier
Top Cover
Tape Thickness
.102 MAX.
(.004)
10.287 ± .102
(.405 ± .004) 1.549 ± .102
(.061 ± .004)
330.2 DIA.
(13.00)
18
Tape and Reel Packaging for 8 Pin Surface Mount Package
7.493 ± .102
(.295 ± .004)
12.090
(.476)
1.753 ± .102
(.069 ± .004)
3.987 ± .102
(.157 ± .004)
1.498 ± .102
(.059 ± .004)
6.731 MAX.
(.265) .406 MAX.
(.016)
4.877
(.192)
Top Cover
Tape
2.007 ± .102
(.079 ± .004)
11.989 ± .102
(.472 ± .004)
User Direction of Feed
.050R TYP.
16.002 ± .305
(.630 ± .012)
10.300
(.405)
Embossment
Embossed Carrier
Top Cover
Tape Thickness
.102 MAX.
(.004)
10.300 ± .102
(.405 ± .004) 1.549 ± .102
(.061 ± .004)
330.2 DIA.
(13.00)
18
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions
at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and
disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to sup-
port or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or
make changes to its products at any time without notice.
Specification: DS-XBB170-R2.0
©Copyright 2002, Clare, Inc.
All rights reserved. Printed in USA.
6/25/02
For additional information please visit our website at: www.clare.com