DESCRIPTION SPECIFICATIONS
*Power will vary depending on the SDRAM used.
KVR21S15D8/16
16GB 2Rx8 2G x 64-Bit PC4-2133
CL15 260-Pin SODIMM
Continued >>
FEATURES
This document describes ValueRAM's 2G x 64-bit (16GB)
DDR4-2133 CL15 SDRAM (Synchronous DRAM), 2Rx8, non-ECC,
memory module, based on sixteen 1G x 8-bit FBGA components.
The SPD is programmed to JEDEC standard latency DDR4-2133
timing of 15-15-15 at 1.2V. This 260-pin DIMM uses gold contact
fingers. The electrical and mechanical specifications are as follows:
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command T ime (tRFCmin)
Row Active T ime (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
15 cycles
46.5ns(min.)
350ns(min.)
33ns(min.)
TBD W*
94 V - 0
0o C to +85o C
-55o C to +100o C
• Power Supply: VDD=1.2V Typical
• VDDQ = 1.2V Typical
• VPP - 2.5V Typical
• VDDSPD=2.2V to 3.6V
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• Dual-rank
• On-board I2 serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
• Terminated control command and address bus
• PCB: Height 1.18” (30.00mm)
• RoHS Compliant and Halogen-Free
Document No. VAL UERAM1494-001.A00 01/14/16 Page 1
kingston.com
Memory Module Specifi cations
MODULE DIMENSIONS
continued HyperX
Document No. VALUERAM1494-001.A00 Page 2
kingston.com
All measurements are in millimeters.
1.20
3.7 Max
Side
